Shuhei Ishikawa

Person

Handa-City, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Heat spreader module and method of manufacturing same
- Patent number 7,447,032
- Issue date Nov 4, 2008
- NGK Insulators, Ltd.
- Shuhei Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader module
- Patent number 7,433,187
- Issue date Oct 7, 2008
- NGK Insulators, Ltd.
- Takahiro Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat spreader module
- Patent number 7,161,807
- Issue date Jan 9, 2007
- NGK Insulators, Ltd.
- Takahiro Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a circuit board
- Patent number 7,069,645
- Issue date Jul 4, 2006
- NGK Insulators, Ltd.
- Takahiro Ishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite material
- Patent number 6,953,539
- Issue date Oct 11, 2005
- NGK Insulators, Ltd.
- Shuhei Ishikawa
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Heat sink material and method of manufacturing the heat sink material
- Patent number 6,933,531
- Issue date Aug 23, 2005
- NGK Insulators, Ltd.
- Shuhei Ishikawa
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Heat sink material
- Patent number 6,927,421
- Issue date Aug 9, 2005
- NGK Insulators, Ltd.
- Shuhei Ishikawa
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Member for electronic circuit, method for manufacturing the member,...
- Patent number 6,911,728
- Issue date Jun 28, 2005
- NGK Insulators, Ltd.
- Shuhei Ishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite material for heat sinks for semiconductor devices and met...
- Patent number 6,479,095
- Issue date Nov 12, 2002
- NGK Insulators, Ltd.
- Shuhei Ishikawa
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Printed circuit board material and method of manufacturing board ma...
- Patent number 6,379,781
- Issue date Apr 30, 2002
- NGK Insulators, Ltd.
- Tomio Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite material for heat sinks for semiconductor devices and met...
- Patent number 6,110,577
- Issue date Aug 29, 2000
- NGK Insulators, Ltd.
- Shuhei Ishikawa
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Beryllium-copper alloy excellent in strength, workability and heat...
- Patent number 5,824,167
- Issue date Oct 20, 1998
- NGK Insulators, Ltd.
- Shuhei Ishikawa
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Member for securing conduction and connector using the member
- Patent number 5,720,622
- Issue date Feb 24, 1998
- NGK Insulators, Ltd.
- Shuhei Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Production of beryllium-copper alloys and alloys produced thereby
- Patent number 4,792,365
- Issue date Dec 20, 1988
- NGK Insulators, Ltd.
- Yosuke Matsui
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
HEAT SINK MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090086435
- Publication date Apr 2, 2009
- NGK Insulators, Ltd.
- Ken Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING HEAT SPREADER MODULE
- Publication number 20080272180
- Publication date Nov 6, 2008
- NGK Insulators, Ltd.
- Takahiro ISHIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF INSPECTING LAMINATED ASSEMBLY AND METHOD OF INSPECTING HE...
- Publication number 20070183127
- Publication date Aug 9, 2007
- NGK Insulators, Ltd.
- Shuhei ISHIKAWA
- G01 - MEASURING TESTING
Information Patent Application
Heat spreader module and method of manufacturing same
- Publication number 20070058349
- Publication date Mar 15, 2007
- NGK Insulators, Ltd.
- Shuhei Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board and method for producing the same
- Publication number 20060191707
- Publication date Aug 31, 2006
- NGK Insulators, Ltd.
- Takahiro Ishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat spreader module
- Publication number 20040207987
- Publication date Oct 21, 2004
- NGK Insulators, Ltd.
- Takahiro Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat spreader module and method of manufacturing same
- Publication number 20040191558
- Publication date Sep 30, 2004
- NGK Insulators, Ltd.
- Takahiro Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Member for electronic circuit, method for manufacturing the member,...
- Publication number 20030102553
- Publication date Jun 5, 2003
- Shuhei Ishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Composite material and method of producing the same
- Publication number 20030096059
- Publication date May 22, 2003
- NGK Insulators, Ltd.
- Ken Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Heat sink material
- Publication number 20030082393
- Publication date May 1, 2003
- NGK Insulators, Ltd.
- Shuhei Ishikawa
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Composite material
- Publication number 20030054188
- Publication date Mar 20, 2003
- NGK Insulators, Ltd.
- Shuhei Ishikawa
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Circuit board and method for producing the same
- Publication number 20020138973
- Publication date Oct 3, 2002
- NGK Insulators, Ltd.
- Takahiro Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS

Shuhei Ishikawa

Person

Patents Grantslast 30 patents

Heat spreader module and method of manufacturing same

Heat spreader module

Heat spreader module

Method for producing a circuit board

Composite material

Heat sink material and method of manufacturing the heat sink material

Heat sink material

Member for electronic circuit, method for manufacturing the member,...

Composite material for heat sinks for semiconductor devices and met...

Printed circuit board material and method of manufacturing board ma...

Composite material for heat sinks for semiconductor devices and met...

Beryllium-copper alloy excellent in strength, workability and heat...

Member for securing conduction and connector using the member

Production of beryllium-copper alloys and alloys produced thereby

Patents Applicationslast 30 patents

HEAT SINK MODULE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING HEAT SPREADER MODULE

METHOD OF INSPECTING LAMINATED ASSEMBLY AND METHOD OF INSPECTING HE...

Heat spreader module and method of manufacturing same

Circuit board and method for producing the same

Heat spreader module

Heat spreader module and method of manufacturing same

Member for electronic circuit, method for manufacturing the member,...

Composite material and method of producing the same

Heat sink material

Composite material

Circuit board and method for producing the same