METHOD OF INSPECTING LAMINATED ASSEMBLY AND METHOD OF INSPECTING HEAT SPREADER MODULE

Abstract

A heat spreader module includes a laminated assembly, a heat spreader bonded to an upper surface of the laminated assembly, and a circuit board bonded to an upper surface of the heat spreader. The laminated assembly includes a base, an insulated substrate bonded to an upper surface of the base, and an intermediate metal plate bonded to an upper surface of the insulated substrate. A nonwoven fabric impregnated with a liquid is prepared, and an exposed portion of the insulated substrate, which extends out from below the intermediate metal plate, is wiped with the nonwoven fabric. Then, the entire structure is dried until the liquid on the exposed portion of the insulated substrate is removed. Thereafter, a pulsed voltage is applied between the circuit board and the base.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a vertical cross-sectional view of a heat spreader module for use in the present invention;

FIG. 2 is an enlarged fragmentary view of an SiC/Cu composite material for use as an example of a constituent of a heat spreader;

FIG. 3 is an enlarged fragmentary view of another SiC/Cu composite material for use as an example of a constituent of a heat spreader;

FIG. 4 is a flowchart of an operation sequence of a manufacturing process, including an inspecting method, according to the present invention;

FIG. 5 is a vertical cross-sectional view illustrating a setting step;

FIG. 6 is a vertical cross-sectional view illustrating a joining step;

FIG. 7 is a vertical cross-sectional view illustrating a liquid applying step;

FIG. 8 is a vertical cross-sectional view illustrating a voltage applying step; and

FIG. 9 is a vertical cross-sectional view of a modified heat spreader module for use in the present invention.

Claims

1. A method of inspecting a laminated assembly having a first metal plate, a second metal plate, and an insulated substrate interposed between the first metal plate and the second metal plate, comprising the steps of: coating an exposed portion of said insulated substrate with a liquid;drying said exposed portion which has been coated with said liquid; andapplying a voltage to said insulated substrate.

2. A method according to claim 1, wherein the voltage is applied to said insulated substrate in order to measure a withstand voltage of said laminated assembly.

3. A method according to claim 1, wherein the voltage is applied to said insulated substrate in order to measure an insulation resistance of said laminated assembly.

4. A method according to claim 1, wherein said step of coating said exposed portion comprises the step of wiping said exposed portion with a nonwoven fabric impregnated with said liquid.

5. A method according to claim 1, wherein said insulated substrate has an area that is greater than an area of at least said first metal plate.

6. A method according to claim 1, wherein said liquid has a wetting angle of 90° or smaller with respect to said insulated substrate.

7. A method according to claim 1, wherein said liquid comprises an organic compound.

8. A method according to claim 7, wherein said organic compound comprises alcohol, phenol, ether, aldehyde, ketone, carboxylic acid, amine, or any of derivatives thereof.

9. A method according to claim 1, wherein said liquid comprises water.

10. A method of inspecting a heat spreader module having a laminated assembly comprising a first metal plate, a second metal plate, and an insulated substrate interposed between the first metal plate and the second metal plate, wherein a heat spreader is mounted on said laminated assembly, comprising the steps of: coating an exposed portion of said insulated substrate with a liquid;drying said exposed portion which has been coated with said liquid; andapplying a voltage to said insulated substrate.

11. A method according to claim 10, wherein said first metal plate comprises an intermediate metal plate, said second metal plate comprises a base of metal, and said heat spreader module includes said insulated substrate, said intermediate metal plate, said heat spreader, and a circuit board with a semiconductor circuit mounted thereon, which are bonded successively in the order named onto said base.

12. A method according to claim 10, wherein said first metal plate comprises a circuit board with a semiconductor circuit mounted thereon, said second metal plate comprises an intermediate metal plate, and said heat spreader module includes said intermediate metal plate, said insulated substrate, and said circuit board, which are bonded successively in the order named onto said heat spreader.

13. A method according to claim 10, wherein the voltage is applied to said insulated substrate in order to measure a withstand voltage of said heat spreader module.

14. A method according to claim 10, wherein the voltage is applied to said insulated substrate in order to measure an insulation resistance of said heat spreader module.

15. A method according to claim 10, wherein said step of coating said exposed portion comprises the step of wiping said exposed portion with a nonwoven fabric impregnated with said liquid.

16. A method according to claim 10, wherein said insulated substrate has an area that is greater than an area of at least said first metal plate.

17. A method according to claim 10, wherein said liquid has a wetting angle of 90° or smaller with respect to said insulated substrate.

18. A method according to claim 10, wherein said liquid comprises an organic compound.

19. A method according to claim 18, wherein said organic compound comprises alcohol, phenol, ether, aldehyde, ketone, carboxylic acid, amine, or any of derivatives thereof.

20. A method according to claim 10, wherein said liquid comprises water.