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Shuhei Matsumoto
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Kumamoto, JP
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last 30 patents
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Patent Grant
Bonding apparatus, bonding system, bonding method, and recording me...
Patent number
11,658,146
Issue date
May 23, 2023
Tokyo Electron Limited
Takashi Nakamitsu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding apparatus, bonding system, bonding method, and recording me...
Patent number
11,488,929
Issue date
Nov 1, 2022
Tokyo Electron Limited
Takashi Nakamitsu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding apparatus, bonding system, bonding method, and recording me...
Patent number
11,094,667
Issue date
Aug 17, 2021
Tokyo Electron Limited
Takashi Nakamitsu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding method, storage medium, bonding apparatus and bonding system
Patent number
9,741,595
Issue date
Aug 22, 2017
Tokyo Electron Limited
Kenji Sugakawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate processing apparatus, substrate processing method, and co...
Patent number
9,039,863
Issue date
May 26, 2015
Tokyo Electron Limited
Shuhei Matsumoto
G05 - CONTROLLING REGULATING
Patents Applications
last 30 patents
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Patent Application
MOUNTING PAD, MOUNTING MECHANISM, AND SUBSTRATE TRANSFER MECHANISM
Publication number
20230395421
Publication date
Dec 7, 2023
TOKYO ELECTRON LIMITED
Masato OBARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...
Publication number
20230026661
Publication date
Jan 26, 2023
TOKYO ELECTRON LIMITED
Takashi Nakamitsu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...
Publication number
20210343678
Publication date
Nov 4, 2021
TOKYO ELECTRON LIMITED
Takashi Nakamitsu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...
Publication number
20190312006
Publication date
Oct 10, 2019
TOKYO ELECTRON LIMITED
Takashi Nakamitsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...
Publication number
20190273063
Publication date
Sep 5, 2019
TOKYO ELECTRON LIMITED
Takashi Nakamitsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bonding Method, Storage Medium, Bonding Apparatus and Bonding System
Publication number
20160155721
Publication date
Jun 2, 2016
TOKYO ELECTRON LIMITED
Kenji SUGAKAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND CO...
Publication number
20130334172
Publication date
Dec 19, 2013
TOKYO ELECTRON LIMITED
Shuhei Matsumoto
H01 - BASIC ELECTRIC ELEMENTS