This application claims priority to Japanese Patent Application Nos. 2022-091651, filed on Jun. 6, 2022, and 2023-071398, filed on Apr. 25, 2023, respectively, the entire contents of which are incorporated herein by reference.
The present disclosure relates to a mounting pad, a mounting mechanism, and a substrate transfer mechanism.
There is known a substrate processing apparatus including a plurality of substrate processing chambers for performing substrate processing such as film formation, etching, or the like on a substrate (hereinafter, also referred to as wafer) in a vacuum atmosphere. In this substrate processing apparatus, a substrate is transferred from a container accommodating a plurality of substrates in the atmosphere to a load-lock module by a substrate transfer mechanism of an atmospheric transfer chamber maintained in an atmospheric pressure atmosphere inner atmosphere of the load-lock module can be switched between a vacuum state and an atmospheric pressure, and the substrate is transferred between the atmospheric transfer chamber and a vacuum transfer chamber. The substrate is transferred to each substrate processing chamber by a substrate transfer mechanism of the vacuum transfer chamber maintained in a vacuum atmosphere.
The substrate transfer mechanism in the atmosphere transfer chamber holds the substrate by using a mounting mechanism disposed at the tip end of a transfer arm, for example. The mounting mechanism is provided with a vacuum suction pad for holding the substrate by vacuum suction (see Patent Document 1).
The present disclosure provides a mounting pad capable of reducing sticking of a substrate to a mounting mechanism, a mounting mechanism, and a substrate transfer mechanism.
In accordance with an aspect of the present disclosure, there is a mounting pad for placing an object thereon, comprising: a base; and an annular outer edge portion that is provided on one surface of the base, projects in a direction intersecting a surface direction of said one surface to surround an outer edge of said one surface, and is to be in contact with the object, wherein a thickness of the outer edge portion in at least one portion of the outer edge portion is different from a thickness of the outer edge portion in other portions of the outer edge portion.
Hereinafter, embodiments of a mounting pad, a mounting mechanism, and a substrate transfer mechanism of the present disclosure will be described in detail with reference to the accompanying drawings. The following embodiments are not intended to limit the present disclosure.
A substrate transfer mechanism in an atmosphere transfer chamber places a substrate on a teeth by releasing vacuum attraction and moving a mounting mechanism downward in a container accommodating a plurality of substrates, for example. The teeth is a table on which a substrate is placed in the container accommodating a plurality of substrates. In this case, it is required to quickly separate the substrate from a vacuum suction pad of the mounting mechanism. However, even if the vacuum attraction is released, the substrate may be stuck to the vacuum suction pad. If the transfer arm attempts to transfer another substrate in that state, the transfer arm moves to receive a next substrate in a state where a previous substrate is attracted to the mounting mechanism. Thus, the substrates may collide and be broken, or the previous substrate that is still attracted may fall during the transfer operation, causing a transfer error. Therefore, it is expected to reduce sticking of the substrate to the mounting mechanism.
[Configuration of Processing System]
Each of the vacuum transfer modules TM1 and TM2 has a substantially rectangular shape in plan view. The process modules PM1 to PM6 are connected to two opposite side surfaces of the vacuum transfer module TM1. The load-lock modules LL1 and LL2 are connected to one of two opposite side surfaces of the vacuum transfer module TM1, and a path (not shown) for connection to the vacuum transfer module TM2 is connected to the other side surface thereof. The side surfaces of the vacuum transfer module TM1 to which the load-lock modules LL1 and LL2 are connected are angled by the two load-lock modules LL1 and LL2. The process modules PM7 to PM12 are connected to two opposite side surfaces of the vacuum transfer module TM2. A path (not shown) for connection to the vacuum transfer module TM1 is connected to one of two opposite side surfaces of the vacuum transfer module TM2. The vacuum transfer modules TM1 and TM2 have vacuum chambers in a vacuum atmosphere, and vacuum transfer robots TR1 and TR2 are disposed therein, respectively.
The vacuum transfer robots TR1 and TR2 are configured to be rotatable, extensible/contractible, and vertically movable. The vacuum transfer robots TR1 and TR2 transfer an object to be transferred based on an operation instruction outputted by a controller CU to be described later. For example, the vacuum transfer robot TR1 holds an object to be transferred at mounting mechanisms EE11 and EE12 disposed at the tip end thereof, and transfers the object to be transferred between the load-lock modules LL1 and LL2, the process modules PM1 to PM6, and the path (not shown). For example, the vacuum transfer robot TR2 holds an object to be transferred at mounting mechanisms EE21 and EE22 disposed at the tip end thereof, and transfers the object between the process modules PM7 to PM12 and the path (not shown). The mounting mechanism is also referred to as an end effector, a pick, or a fork.
The object to be transferred includes a substrate and a consumable part. The substrate is, e.g., a semiconductor wafer. The consumable part is replaceably attached to the process modules PM1 to PM12, and consumed by performing various processing such as plasma processing and the like in the process modules PM1 to PM12. The consumable part includes, e.g., members constituting a shower head and a ring assembly disposed in the process modules PM1 to PM12.
The process modules PM1 to PM12 have processing chambers, and stages (mounting table) are disposed therein. After substrates are placed on the stages, the process modules PM1 to PM12 are depressurized to introduce a processing gas. Then, an RF power is applied to generate plasma, and the substrate is subjected to plasma processing using the plasma. The vacuum transfer modules TM1 and TM2 and the process modules PM1 to PM12 are separated by gate valves G1 that can be opened and closed.
The load-lock modules LL1 and LL2 are disposed between the vacuum transfer module TM1 and the atmospheric transfer module LM. Each of the load-lock modules LL1 and LL2 has a chamber of which inner pressure can be switched between a vacuum state and an atmospheric pressure. A stage is disposed in each of the load-lock modules LL1 and LL2. In the case of loading the substrates from the atmospheric transfer module LM to the vacuum transfer module TM1, the substrates are transferred from the atmospheric transfer module LM into the load-lock modules LL1 and LL2 maintained at an atmospheric pressure; the pressures in the load-lock modules LL1 and LL2 are decreased; and the substrates are loaded into the vacuum transfer module TM1. In the case of unloading the substrates from the vacuum transfer module TM1 to the atmosphere transfer module LM, the substrates are transferred from the vacuum transfer module TM1 into the load-lock modules LL1 and LL2 maintained in a vacuum state; the pressures in the load-lock modules LL1 and LL2 are increased to an atmospheric pressure; and the substrates are loaded into the atmospheric transfer module LM. The load-lock modules LL1 and LL2 and the vacuum transfer module TM1 are separated by gate valves G2 that can be opened and closed. The load-lock modules LL1 and LL2 and the atmospheric transfer module LM are separated by gate valves G3 that can be opened and closed.
The atmospheric transfer module LM is disposed to be opposite to the vacuum transfer module TM1. The atmospheric transfer module LM may be, e.g., an equipment front end module (EFEM). The atmospheric transfer module LM is a rectangular parallelepiped-shaped atmospheric transfer chamber having a fan filter unit (FFU) and maintained at an atmospheric pressure. The two load-lock modules LL1 and LL2 are connected to one long side of the atmospheric transfer module LM. Load ports LP1 to LP4 are connected to the other long side of the atmospheric transfer module LM. A container C accommodating a plurality of (e.g., twenty five) substrates is placed on each of the load ports LP1 to LP4. The container C may be, e.g., a front opening unified pod (FOUP). An atmospheric transfer robot TR3 for transferring an object to be transferred is disposed in the atmospheric transfer module LM.
The atmospheric transfer robot TR3 is configured to be movable along the longitudinal direction of the atmospheric transfer module LM, and is configured to be rotatable, extensible/contractible, and vertically movable. The atmospheric transport robot TR3 transfers an object to be transferred based on the operation instruction outputted by the controller CU to be described later. For example, the atmospheric transfer robot TR3 holds an object to be transferred at a mounting mechanism EE31 disposed at the tip end thereof, and transfers the object to be transferred between the load ports LP1 to LP4, the load-lock modules LL1 and LL2, the aligner AN, and the storage SR.
The aligner AN is connected to one short side surface of the atmospheric transfer module LM. Alternatively, the aligner AN may be connected to the long side surface of the atmospheric transfer module LM. Alternatively, the aligner AN may be disposed in the atmospheric transfer module LM. The aligner AN has a support (not shown), an optical sensor (not shown), and the like. Here, the aligner is a device for detecting the position of the object to be transferred.
The support is a table that is rotatable about an axis extending in a vertical direction, and is configured to support a substrate thereon. The support is rotated by a driving device (not shown). The driving device is controlled by the controller CU to be described later. When the support is rotated by the power from the driving device, the substrate placed on the support is also rotated.
The optical sensor detects the edge of the substrate while the substrate is rotating. The optical sensor detects the deviation amount of the notch (or another marker) of the substrate with respect to a reference angular position, and the deviation amount of the center position of the substrate with respect to a reference position from the edge detection result. The optical sensor outputs the deviation amount of the angular position of the notch and the deviation amount of the center position of the substrate to the controller CU to be described later. The controller CU calculates the rotation amount of a rotary support for correcting the angular position of the notch to the reference angular position based on the deviation amount of the angular position of the notch. The controller CU controls a driving device (not shown) to rotate the rotary support by the rotation amount. Accordingly, the angular position of the notch can be corrected to the reference angular position. Further, the controller CU controls the position of the mounting mechanism EE31 of the atmospheric transfer robot TR3 at the time of receiving the substrate from the aligner AN such that the center position of the substrate coincides with a predetermined position on the mounting mechanism EE31 of the atmospheric transfer robot TR3 based on the deviation amount of the center position of the substrate.
The storage SR is connected to the long side surface of the atmospheric transfer module LM. Alternatively, the storage SR may be connected to the short side surface of the atmospheric transfer module LM. Alternatively, the storage SR may be disposed in the atmospheric transfer module LM. The storage SR accommodates an object to be transferred.
The processing system PS includes the controller CU. The controller CU may be, e.g., a computer. The controller CU includes a central processing unit (CPU), a random access memory (RAM), a read only memory (ROM), an auxiliary storage device, and the like. The CPU operates based on a program stored in the ROM or the auxiliary storage device to control the individual components of the processing system PS. For example, the controller CU outputs the operation instruction to the vacuum transfer robots TR1 and TR2, the atmospheric transfer robot TR3, and the like. The operation instruction includes, e.g., an instruction for holding objects to be transferred at the mounting mechanisms EE11, EE12, EE21, EE22, and EE31 disposed at the tip ends and transferring the objects to be transferred between modules.
[Specific Description of Mounting Mechanism EE31]
Next, the mounting mechanism EE31 of the atmospheric transfer robot TR3 will be described in detail with reference to
The mounting mechanism EE31 has a substantially U-shape in plan view. The mounting mechanism EE31 includes a plurality of suction holes V1, a suction passage V2, and the like. The suction passage V2 is an example of an exhaust passage. The mounting mechanism EE31 holds the bottom surface of the substrate W by vacuum suction using the suction holes V1. A mounting pad 10 is disposed in each suction hole V1. The mounting pad 10 is made of, e.g., engineering plastic, and the mounting direction of the mounting pad 10 can be changed. Further, the mounting pad 10 can be replaced. The suction holes V1 are connected to an exhaust device V4 through the suction passage V2 and an exhaust line V3. The exhaust device V4 includes a valve, a regulator, a vacuum pump, and the like, and adjusts the pressure in the suction passage V2 and the exhaust line V3 by conducting suction from the suction passage V2 and the exhaust line V3.
Next, the mounting pad 10 and modifications thereof will be described with reference to
The mounting pads 10 and 30 shown in
The mounting pad 10 is fastened to the bracket 20 with screws (not shown) corresponding to the screw holes 14. In the mounting pad 10, six screw holes 14 are provided and the base 11 has a circular shape. However, the present disclosure is not limited thereto. For example, three screw holes 14 may be provided and the base 11 may have a triangular shape. In the mounting pad 10, one or more recesses 16 are disposed on the inner circumferential surface 15 side of the outer edge portion 12. In the example of
The mounting pad 30 is an example of modification of the mounting pad 10. The mounting pad 30 has an annular outer edge portion 32 higher than a circular base 31. Similarly to the mounting pad 10, the mounting pad 30 has an opening 33 at the center of the base 31, and a plurality of screw holes 34 are disposed on the outer peripheral side of the opening 33. Similarly to the mounting pad 10, the mounting pad 30 is fastened to the bracket 20 with screws (not shown) corresponding to the screw holes 34. The mounting pad 30 has one or more protrusions 36 on an outer circumferential surface 35 side of the outer edge portion 32. In the example of
The mounting pads 40 and 50 shown in
The mounting pad 50 has an annular outer edge portion 52 higher than a circular base 51. Similarly to the mounting pad 10, the mounting pad 50 has an opening 53 at the center of the base 51, and a plurality of screw holes 54 are disposed on the outer peripheral side of the opening 53. Similarly to the mounting pad 10, the mounting pad 50 is fastened to the bracket 20 with screws (not shown) corresponding to the screw holes 54. The mounting pad 50 has one or more corners 56 on an outer circumferential surface 55 side of the outer edge portion 52. In the example of
In the mounting pads 60 and 70 shown in
Here, the deformation of the mounting pad 60 in a direction of an arrow 68 will be described with reference to
Referring back to the description of
Next, the relationship between the teeth 90 and the directions of various mounting pads and the relationship between the center of the substrate W and the directions of the various mounting pads will be described with reference to
Next, Modifications 1 to 3 will be described with reference to
The mounting pad 100 has an annular outer edge portion 102 higher than a circular base 101. Similarly to the mounting pad 10, the mounting pad 100 has an opening 103 at the center of the base 101, and a plurality of screw holes 104 are disposed on the outer peripheral side of the opening 103. Similarly to the mounting pad 10, the mounting pad 100 is fastened to the bracket 20 with screws (not shown) corresponding to the screw holes 104. The mounting pad 100 has one or more recesses 106 on an outer circumferential surface 105 side of the outer edge portion 102. In the example of
In Modification 3, the opening 126 formed at the center of the mounting pad 120 and connected to the suction hole V1 and the mounting holes 122 of the mounting pad 120 are separately formed. However, the mounting pad may be attached to the mounting mechanism by a fastening member such as a screw having a through-hole or the like. Such an embodiment will be described as a second embodiment. The processing system in the second embodiment is the same as that in the above-described first embodiment, so that the redundant description of configurations and operations will be omitted.
The mounting pad 200 is attached with the screw 201 to the pad mounting portion V13 disposed on one surface (for example, upper surface) of the mounting mechanism EE31b. The mounting pad 200 is fastened with the screw 201 to the mounting mechanism EE31b at an opening 202 formed at the center of the mounting pad 200. The screw 201 is an example of a fastening member. The suction hole V1a is formed at the center of the screw 201 and communicates with the suction passage V2. In other words, the suction hole V1a of the screw 201 is an example of a second through-hole formed along the fastening direction of the screw 201. The mounting pad 200 has a plurality of through-holes 213 corresponding to the suction holes V1b to surround the opening 202. The through-hole 213 is an example of a second through-hole. The suction holes V1b communicates with the suction passage V2. In the following description, in a state where the mounting pad 200 is mounted on the mounting mechanism EE31b, the through-holes 213 and the suction holes V1b may be collectively referred to as the suction holes V1b. In the mounting pad 200, the pressure applied to the backside of the substrate W can be distributed by providing the suction holes V1b in addition to the suction hole V1a.
An O-ring 203 as a seal member is disposed on the back surface of the mounting pad 200 and at the outer peripheral portion of the suction hole V1b. In the example of
In addition, a gap 205 exists between the pad mounting portion V13 and the outer edge portion of the mounting pad 200 that is located on the outer peripheral side compared to the O-ring 203. The gap 205 has a longer distance from the O-ring 203 to the outer edge portion compared to the gap 125 in the mounting pad 120 of Modification 3, so that the mounting pad 200 can be bent more. Due to the gap 205, the outer edge portion of the mounting pad 200 can be brought into close contact with the substrate W. When the mounting mechanism EE31b transfers the substrate W to the teeth 90 or the like, the O-ring 203 serves as a cushion used when the mounting pad 200 adhered to the substrate W is separated and returns to its original position. Therefore, even if the mounting pad 200 is bent more, the O-ring 203 suppresses stress cracking of the mounting pad 200 and, thus, the lifespan of the mounting pad 200 can be increased.
Next, the mounting pad 200 will be described in detail with reference to
The mounting pad 200 has an annular groove 214 between the through-holes 213 of the base 211 and the outer edge portion 212. Protrusions 215 are formed at a part of the groove 214. The thickness of the protrusions 215 is the same as that of the vicinity of the through-holes 213 of the base, and is different from that of the groove 214 in the circumferential direction of the groove 214. In other words, the thickness (width) of the groove 214 in at least one portion (where the protrusions 215 are disposed) of the groove 214 is different from the thickness of other portions of the groove 214. Further, the protrusions 215 are disposed at positions facing each other with respect to the center on a straight line passing through the center of the mounting pad 200, for example.
The mounting pad 200 has one or more recesses 216 on the outer circumferential surface side of the outer edge portion 212. In other words, the recesses 216 are formed such that the outer circumference of the outer edge portion 212 becomes close to the center of the base 211 in at least one portion of the outer edge portion 212, and the distance between the outer circumference and the inner circumference of the outer edge portion 212 in the corresponding portion is smaller than that in the other portions of the outer edge portion 212. Further, the mounting pad 200 has one or more recesses 217 on the inner circumferential surface side of the outer edge portion 212. In other words, the recesses 217 are formed such that the inner circumference of the outer edge portion 212 becomes distant from the center of the base 211 in at least one portion of the outer edge portion 212, and the distance between the outer circumference and the inner circumference the outer edge portion 212 in the corresponding portion is smaller than that in the other portions of the outer edge portion 212. In the example of
In the mounting pad 200, regions 218 where two recesses 216 face the center of the mounting pad 200 without the protrusions 215 interposed therebetween among the four recesses 216 serve as the separation start points, so that the separation of the substrate W become easier. In other words, the mounting pad 200 is easily deformed at the two recesses 216 that do not face the protrusions 215 than at the two recesses 216 facing the protrusions 215.
As shown in
Next, Modification 4 will be described with reference to
The mounting pad 230 has an annular groove 234 formed between the through-holes 233 of the base 231 and the outer edge portion 232. The groove 234 has a width smaller than that of the groove 214 of the mounting pad 200. The distance from the center of the base 231 to the inner circumferential side of the groove 234 is the same in the circumferential direction. In other words, the mounting pad 230 does not have portions corresponding to the protrusions 215 of the mounting pad 200.
The mounting pad 230 has one or more recesses 235 on the outer circumferential surface side of the outer edge portion 232. In other words, the recesses 235 are formed such that the outer circumference of the outer edge portion 232 becomes close to the center of the base 231 in at least one portion of the outer edge portion 232, and the distance between the outer circumference and the inner circumference of the outer edge portion 232 is smaller in the corresponding portion than that in the other portions of the outer edge portion 232. In the example of
Next, the displacement amount comparison between the mounting pad 200 of the second embodiment and the mounting pad 230 of Modification 4 will be described with reference to
Next, Modifications 5 to 7 will be described with reference to
In the mounting pad 250, an annular groove 254 is formed between the through-holes 253 of the base 251 and the outer edge portion 252. The distance from the center of the base 251 to the inner circumference of the groove 254 is the same in the circumferential direction. In other words, the mounting pad 250 does not have portions corresponding to the protrusions 215 of the mounting pad 200.
The mounting pad 250 has one or more recesses among recesses 255 and recesses 255a on the outer circumferential surface side of the outer edge portion 252. In other words, one or more recesses among the recesses 255 and the recesses 255a are formed such that the outer circumference of the outer edge portion 252 becomes close to the center of the base 251 in at least one portion of the outer edge portion 252, and the distance between the outer circumference and the inner circumference of the outer edge portion 252 in the corresponding portion is smaller than that in the other portions of the outer edge portion 252. The recess 255a is different from the recess 255 in that the edge portion is not chamfered. The mounting pad 250 may have the recesses 255 instead of the recesses 255a. Further, the mounting pad 250 has one or more recesses 256 on the inner circumferential surface side of the outer edge portion 252. In other words, the recesses 256 are formed such that the inner circumference of the outer edge portion 252 becomes distant from the center of the base 251 in at least one portion of the outer edge portion 252, and the distance between the outer circumference and the inner circumference of the outer edge portion 252 in the corresponding portion is smaller than that in the other portions of the outer edge portion 252. In the example of
The mounting pad 260 has annular grooves 264 and 266 formed between the through-hole 263 of the base 261 and the outer edge portion 262. An annular portion 265 of which thickness is the same as that of the portion of the base 260 close to the through-holes 263 is formed between the groove 264 and the groove 266. The distance from the center of the base 261 to the inner circumference of the groove 264 and the distance from the center of the base 261 to the outer circumference of the base 261 are the same in the circumferential direction. The distance from the center of the base 261 to the inner circumference of the groove 266 and the distance from the center of the base 261 to the outer circumference of the groove 266 are the same in the circumferential direction.
The mounting pad 260 has one or more recesses among recesses 267 and recesses 267a on the outer circumferential surface side of the outer edge portion 262. In other words, one or more recesses among the recesses 267 and the recesses 267a are formed such that the outer circumference of the outer edge portion 262 becomes close to the center of the base 261 in at least one portion of the outer edge portion 262, and the distance between the outer circumference and the inner circumference of the outer edge portion 262 in the corresponding portion is smaller than that in the other portions of the outer edge portion 262. The recess 267a is different from the recess 267a in that the edge portion is not chamfered. The mounting pad 260 may have the recesses 267 instead of the recesses 267a. Further, the mounting pad 260 may have one or more recesses 268 on the inner circumferential surface side of the outer edge portion 262. In other words, the recesses 268 are formed such that the inner circumference of the outer edge portion 262 becomes distant from the center of the base 261 in at least one portion of the outer edge portion 262, and the distance between the outer circumference and the inner circumference of the outer edge portion 262 in the corresponding portion is smaller than that in other portions of the outer edge portion 262. In the example of
The mounting pad 270 has an annular groove 274 between the through-holes 273 of the base 271 and the outer edge portion 272. In the groove 274, a plurality of rectangular recesses 275 having the same thickness as that of the groove 274 are formed from the groove 274 toward the center of the base 271, thereby forming a plurality of fan-shaped protrusions 276. The recesses 275 are arranged in eight directions obtained by dividing the circumferential direction of the base 271, for example. The protrusions 276 have the same thickness as that of the vicinity of the through-holes 273 of the base 271, and have a thickness different from that of the groove 274 in the circumferential direction of the groove 274. The protrusions 276 and the recesses 275 are alternately arranged. In other words, the thickness (width) of the groove 274 in at least one portion (where the protrusions 276 are disposed) of the groove 274 is different from that in the other portions of the groove 274.
The mounting pad 270 has one or more recesses among recesses 277 and recesses 277a on the outer circumferential surface side of the outer edge portion 272. In other words, one or more recesses among the recesses 277 and the recesses 277a are formed such that the outer circumference of the outer edge portion 272 becomes close to the center of the base 271 in at least one portion of the outer edge portion 272, and the distance between the outer circumference and the inner circumference of the outer edge portion 272 in the corresponding portion is smaller than that in the other portions of the outer edge portion 272. The recess 277a is different from the recess 277a in that the edge portion is not chamfered. The mounting pad 270 may have the recesses 277 instead of the recesses 277a. Further, the mounting pad 270 has one or more recesses 278 on the inner circumferential surface side of the outer edge portion 272. In other words, the recesses 278 are formed such that the inner circumference of the outer edge portion 272 becomes distant from the center of the base 271 in at least one portion of the outer edge portion 272, and the distance between the outer circumference and the inner circumference of the outer edge portion 272 in the corresponding portion in the corresponding portion is smaller than that in the other portions of the outer edge portion 272. In the example of
In the above-described embodiments, the mounting pads 10, 30, 40, 50, 60, 70, 100, 120, 200, 230, 250, 260, and 270 and the mounting mechanisms EE31, EE31a, and EE31b are separately provided. However, the present disclosure is not limited thereto. For example, the mounting pads 10, 30, 40, 50, 60, 70, 100, 120, 200, 230, 250, 260, and 270 may be integrally formed on one surfaces of the mounting mechanisms EE31, EE31a, and EE31b (to be an integrally molded product).
In accordance with the above-described embodiments, the mounting pad (for example, the mounting pads 10 and 200) for placing an object (substrate W) thereon comprises the base (for example, the bases 11 and 211) and the annular outer edge portion (for example, the outer edge portions 12 and 212) formed on one surface of the base. The outer edge portion projects in a direction intersecting the surface direction of the corresponding surface to surround an outer edge of the corresponding surface, and can be in contact with the object. The thickness of the outer edge portion in at least one portion (for example, the recesses 16 and 216) of the outer edge portion is different from a thickness of the outer edge portion in the other portions of the outer edge portion. As a result, the sticking of the object (substrate W) to the mounting mechanism EE31 or the like can be reduced.
Further, in accordance with the above-described embodiments, the mounting pad further comprises at least one through-hole (for example, the openings 13 and 202, the screw holes 14, and the through-holes 213) formed in the base. Accordingly, when the through-hole is the opening 13, for example, the substrate W can be attracted. When the through-hole is the screw hole 14, for example, the mounting pad 10 can be fixed to the mounting mechanism EE31. For example, the mounting pad 200 can be fixed to the mounting mechanism EE31b by the screw 201 in the opening 202, and the substrate W can be attracted by the suction hole V1a of the screw 201 and the suction holes V1b communicating with the through-holes 213.
Further, in accordance with the above-described embodiments, two or more portions where the outer edge portion has a different thickness are provided at rotationally symmetrical positions with the center of the base as the rotation axis. As a result, the sticking of the object to the mounting mechanism EE31 or the like can be reduced.
Further, in accordance with the above-described embodiments, the portions where the outer edge portion has a different thickness and the through-holes are disposed on a straight line. As a result, the sticking of the object to the mounting mechanism EE31 or the like can be further reduced.
Further, in accordance with the above-described embodiments, the portions (for example, the recesses 66, 76, and 235) where the outer edge portion (for example, the outer edge portions 62, 72, and 232) has different thicknesses are provided in two opposing positions. As a result, the mounting pads 60, 70, and 230 are easily deformed, and the sticking of the object to the mounting mechanism EE31 or the like can be further reduced.
Further, in accordance with the above-described embodiments, the through-holes include the first through-hole (for example, the opening 202) and the second through-holes (for example, the through-holes 213) having different diameters. As a result, the through-hole suitable for fastening and the through-hole suitable for suction can be formed.
Further, in accordance with the above-described embodiments, the first through-hole is disposed at the center of the base, two or more second through-holes are arranged around the first through-hole. The diameter of the through-hole is greater than the diameter of the second through-holes. As a result, the through-hole suitable for fastening and the through-hole suitable for suction can be formed.
Further, in accordance with the above-described embodiments, at least one portion (for example, the recesses 66, 76, and 216) of the outer edge portion (for example, the outer edge portions 62, 72, and 212) is disposed such that the outer circumference of the outer edge portion becomes close to the center of the base, and the distance between the outer circumference and the inner circumference of the outer edge portion in the corresponding portion is smaller than that in the other portions of the outer edge portion. As a result, the sticking of the object to the mounting mechanism EE31 or the like can be further reduced.
Further, in accordance with the above-described embodiments, at least one portion (for example, the recesses 16 and 217) of the outer edge portion is disposed such that the inner circumference of the outer edge portion becomes distant from the center of the base, and the distance between the outer circumference and the inner circumference of the outer edge portion in the corresponding portion is smaller than that in the other portions of the outer edge portion. As a result, the sticking of the object to the mounting mechanism EE31 or the like can be further reduced.
Further, in accordance with the above-described embodiments, the first portion that is at least one portion (for example, the recesses 216) of the outer edge portion (for example, the outer edge portion 212) is disposed such that the outer circumference of the outer edge portion becomes close to the center of the base, and the second portion that is at least one portion (for example, the recesses 217) of the outer edge portion is disposed such that the inner circumference of the outer edge portion becomes distant from the center of the base. The first portion and the second portion are alternately arranged along the circumferential direction of the outer edge portion. As a result, the displacement applied to the contact surface between the outer edge portion and the target is shifted, and the separation start points can be generated, which makes the separation of the target easier.
Further, in accordance with the above-described embodiments, the annular groove (for example, the grooves 78 and 214) is formed near the boundary between the base (for example, the bases 71 and 211) and the outer edge portion (for example, the outer edge portions 72 and 212). As a result, the mounting pad 70 and the like are more easily deformed, and the sticking of the object to the mounting mechanism EE31 and the like can be further reduced.
Further, in accordance with the above-described embodiments, the thickness of the groove in at least one portion of the groove (for example, portions of the groove 214 where the protrusions 215 are disposed) is different from that in the other portions of the groove. As a result, the displacement applied to the contact surface between the outer edge portion and the target can be shifted, and the separation start points can be generated, which makes the separation of the target easier.
Further, in accordance with the above-described embodiments, at least one portion (for example, the recesses 216) of the outer edge portion and at least one portion of the groove (for example, portions of the groove 214 where the protrusions 215 are disposed) are disposed on a straight line. As a result, the displacement applied to the contact surface between the outer edge portion and the target can be shifted, and the separation start points can be generated, which makes the separation of the target easier.
Further, in accordance with the above-described embodiments, the outer edge portion (the outer edge portions 42 and 52) has a circular or elliptical inner circumferential surface and a polygonal outer circumferential surface (the outer peripheral surfaces 45 and 55). As a result, the sticking of the object to the mounting mechanism EE31 or the like can be further reduced.
Further, in accordance with the above-described embodiments, the mounting mechanism (for example, the mounting mechanisms EE31 and EE31b) for placing an object thereon includes the exhaust passage (the suction passage V2) disposed in the mounting mechanism, and the mounting pad (for example, the mounting pads 10 and 200) disposed on one surface of the mounting mechanism. The mounting pad includes: the base (for example, the bases 11 and 211); at least one first through-hole (for example, the openings 13 and 202) disposed in the base and communicating with the exhaust passage; the through-holes 213 (the suction holes V1b); and the annular outer edge portion (for example, the outer edge portions 12 and 212) that is disposed on one surface of the base, projects in a direction intersecting the surface direction of the corresponding surface to surround the outer edge of the corresponding surface, and can be in contact with the object. The thickness of the outer edge portion in at least one portion (for example, the recesses 16 and 216) is different from that in the other portions of the outer edge portion. As a result, the sticking of the object (substrate W) to the mounting mechanism EE31 or the like can be reduced.
Further, in accordance with the above-described embodiments, the mounting mechanism is the support 110 on which the object can be attracted and held. As a result, the sticking of the object (substrate W) to the support 110 of the aligner AN can be reduced.
Further, in accordance with the above-described embodiments, the gap (for example, the gaps 125 and 205) exists between the outer edge portion and one surface of the mounting mechanism. As a result, the mounting pad 120 and the like are bent, and the outer edge portion can be brought into closer contact with the object (substrate W).
Further, in accordance with the above-described embodiments, the pad mounting portion (for example, the pad mounting portions V11 to V13) disposed on one surface of the mounting mechanism is further provided, and the mounting pad is mounted on the pad mounting portion. As a result, the mounting pad 10 and the like can be easily replaced.
Further, in accordance with the above-described embodiments, the mounting pad is integrally formed on one surface of the mounting mechanism. As a result, the configuration of the mounting mechanism can be simplified.
Further, in accordance with the above-described embodiments, the mounting mechanism is an end effector for transferring a substrate. As a result, the sticking of the substrate W to the end effector can be reduced.
Further, in accordance with the above-described embodiments, the mounting pad further includes at least one fastening hole (for example, the mounting holes 122, the opening 202) for a fastening member, which is formed in the base. As a result, the mounting pad 120 and the like can be mounted on the mounting mechanism EE31a and the like.
Further, in accordance with the above-described embodiments, the mounting pad (for example, the mounting pad 200) includes at least one fastening hole (for example, the opening 202) for a fastening member, which is formed in the base (for example, the base 211). The fastening member (for example, the screw 201) for fastening the mounting pad and the pad mounting portion (for example, the pad mounting portion V13) is fitted into the fastening hole. The fastening member has the second through-hole (for example, the suction hole V1a) formed along the fastening direction. As a result, the fastening hole and the suction hole can be shared.
Further, in accordance with the above-described embodiments, the seal member (for example, the O-rings 123 and 203) is disposed between the base and one surface of the mounting mechanism to surround all the first through-holes (for example, the openings 13 and 202, and the through-holes 213 (the suction holes V1b)) in plan view is further included. As a result, the close contact between the base and one surface of the mounting mechanism can be ensured. In addition, even if the mounting pad 200 or the like is bent more, the O-ring 203 suppresses the stress cracking of the mounting pad 200 or the like, so that the lifespan of the mounting pad 200 or the like can be increased.
Further, in accordance with the above-described embodiments, a part of the back surface of the base (for example, the base 11) and the pad mounting portion (for example, the pad mounting portion V11) are adhered. As a result, the area of the base 11 and the like can be reduced.
Further, in accordance with the above-described embodiments, the substrate transfer mechanism (for example, the atmospheric transfer robot TR3) for transferring the substrate W to the table (for example, the teeth 90) on which the substrate W is placed or receiving the substrate W from the table includes the mounting mechanism (for example, the mounting mechanisms EE31 and EE31b). In the mounting mechanism, the mounting pad (for example, the mounting pads 10 and 200) is disposed such that at least one of the thinnest portions of the outer edge portion (for example, the outer edge portions 12 and 212) faces a portion (for example, the region 90a) where the substrate W placed on the mounting mechanism can be in contact with the table. As a result, the sticking of the substrate W to the mounting mechanism can be further reduced.
Further, in accordance with the above-described embodiments, the substrate transfer mechanism (the atmospheric transfer robot TR3) includes the mounting mechanism EE31. In the mounting mechanism EE31, three or more mounting pads (for example, the mounting pads 10, 30, 60, 70, 100, and 200) are arranged at equal intervals from the center of the object, and at least two mounting pads are arranged such that the position (for example, the recesses 16, 66, 76, 106, and 216, and the regions 38 and 218) of the outer edge portion where the thickness of the outer edge portion in contact with the object is smallest faces the teeth 90. As a result, the separation start points 91 of the teeth 90 and the region (for example, the regions 17, 38, 67, 77, 107, and 218) serving as the separation start points of the mounting pad are close to each other, so that the sticking of the substrate W to the mounting mechanism EE31 can be further reduced.
Further, in accordance with the above-described embodiments, at least one mounting pad (for example, the mounting pads 10, 30, 60, 70, 100, and 200) is disposed such that the position (for example, the recesses 16, 66, 76, 106, and 216, and the regions 38 and 218) of the outer edge portion where the thickness of the outer edge portion in contact with the target is smallest is located on the straight line (the line 94) that connects the center of the object and the mounting pad. As a result, the center of the substrate W is aligned with the direction of the region (for example, the regions 17, 38, 67, 77, 107, and 218) serving as the separation start point of the mounting pad, and the sticking of the substrate W to the mounting mechanism EE31 can be further reduced.
Further, in accordance with the above-described embodiments, the outer edge portion 12 has an annular shape, and the outer edge portion 12 has a different thickness in one or more recesses (the recesses 16) disposed on the annular inner circumferential surface 15. As a result, the sticking of the substrate W to the mounting mechanism EE31 can be reduced.
Further, in accordance with the above-described embodiments, the outer edge portion (for example, the outer edge portions 62, 72, and 102) has an annular shape, and the outer edge portion has a different thickness in one or more recesses (for example, the recesses 66, 76, and 106) disposed on the annular outer circumferential surface (for example, the outer peripheral surfaces 65, 75, and 105). As a result, the mounting pads 60, 70, and 100 and the like are easily deformed, and the sticking of the substrate W to the mounting mechanism EE31 can be further reduced.
Further, in accordance with the above-described embodiments, the outer edge portion (for example, the outer edge portions 32, 42, and 52) have an annular shape, and the outer edge portion has a different thickness in one or more protrusions (for example, the protrusions 36, the corners 46 and 56) disposed on the annular outer circumferential surface (for example, the outer circumferential surface 35, 45, and 55). As a result, the sticking of the substrate W to the mounting mechanism EE31 can be reduced.
Further, in accordance with the above-described embodiments, three protrusions (for example, the protrusions 36) are arranged at equal intervals in the circumferential direction. As a result, the sticking of the substrate W to the mounting mechanism EE31 can be reduced.
Further, in accordance with the above-described embodiments, the protrusions (for example, the corners 46 and 56) includes corners. As a result, the sticking of the substrate W to the mounting mechanism EE31 can be further reduced.
Further, in accordance with the above-described embodiments, the outer edge portion (for example, the outer edge portions 42 and 52) has a circular or elliptical inner circumferential surface, and an outer circumferential surface (for example, the outer circumferential surfaces 45 and 55) formed as a flat surface with the corner (for example, the corners 46 and 56). As a result, the sticking of the substrate W to the mounting mechanism EE31 can be further reduced.
It should be noted that the embodiments of the present disclosure are illustrative in all respects and are not restrictive. The above-described embodiments may be omitted, replaced, or changed in various forms without departing from the scope of the appended claims and the gist thereof.
Further, in the above-described embodiments, the case where the outer edge portion 12 in contact with the substrate W has an annular shape of a single circle has been described. However, the present disclosure is not limited thereto. For example, the outer edge portion may have an annular shape of two or more concentric circles.
Further, in the above-described embodiments, the case where the substrate W is placed in the container C mounted on the load ports LP1 to LP4 has been described. However, the present disclosure is not limited thereto. For example, the substrate W may be placed on the support of the aligner AN, the stages of the load-lock modules LL1 and LL2, or the like. In that case, the center of the substrate W serves as the separation start point.
Further, in the above-described embodiments, the case where the object to be transferred is the substrate W has been described. However, the present disclosure is not limited thereto. For example, the object to be transferred may be a mounting mechanism capable of transferring a ring assembly accommodated in the storage SR or the like.
The present disclosure may employ the following configurations.
The present disclosure may also employ the following configurations.
Number | Date | Country | Kind |
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2022-091651 | Jun 2022 | JP | national |
2023-071398 | Apr 2023 | JP | national |