Shuichi Kawano

Person

Kawasaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing interposer
- Patent number 8,997,344
- Issue date Apr 7, 2015
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with low-elasticity layer and low-thermal-expansion layer
- Patent number 8,455,766
- Issue date Jun 4, 2013
- Ibiden Co., Ltd.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 8,436,252
- Issue date May 7, 2013
- Ibiden Co., Ltd.
- Shuichi Kawano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor and manufacturing method thereof
- Patent number 8,247,289
- Issue date Aug 21, 2012
- Ibiden Co., Ltd.
- Yoshiki Yamanishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer and method for manufacturing interposer
- Patent number 8,188,378
- Issue date May 29, 2012
- Ibiden Co., Ltd.
- Hajime Sakamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Interposer and method for manufacturing interposer
- Patent number 8,178,790
- Issue date May 15, 2012
- Ibiden Co., Ltd.
- Toshiki Furutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and method for manufacturing interposer
- Patent number 8,173,907
- Issue date May 8, 2012
- Ibiden Co., Ltd.
- Hajime Sakamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Interposer and electronic device using the same
- Patent number 8,149,585
- Issue date Apr 3, 2012
- Ibiden Co., Ltd.
- Shuichi Kawano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer, a method for manufacturing the same and an electronic c...
- Patent number 7,911,802
- Issue date Mar 22, 2011
- Ibiden Co., Ltd.
- Shuichi Kawano
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Package board integrated with power supply
- Patent number 7,751,205
- Issue date Jul 6, 2010
- Ibiden Co., Ltd.
- Takashi Kariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric film capacitor and method of manufacturing the same
- Patent number 7,742,277
- Issue date Jun 22, 2010
- Ibiden Company Limited
- Tomotaka Shinoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer
- Patent number 7,589,394
- Issue date Sep 15, 2009
- Ibiden Co., Ltd.
- Shuichi Kawano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PRODUCING DIE FOR EXTRUSION MOLDING AND METHOD OF PRODUCI...
- Publication number 20160229083
- Publication date Aug 11, 2016
- IBIDEN CO., LTD.
- Makoto ASAI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DIE FOR EXTRUSION MOLDING, METHOD OF PRODUCING DIE FOR EXTRUSION MO...
- Publication number 20150014902
- Publication date Jan 15, 2015
- IBIDEN CO., LTD.
- Kiyotaka ANDO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DIE FOR EXTRUSION MOLDING, METHOD OF PRODUCING DIE FOR EXTRUSION MO...
- Publication number 20150014903
- Publication date Jan 15, 2015
- IBIDEN CO., LTD.
- Makoto ASAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE FOR EXTRUSION MOLDING, METHOD OF PRODUCING DIE FOR EXTRUSION MO...
- Publication number 20150017343
- Publication date Jan 15, 2015
- IBIDEN CO., LTD.
- Kiyotaka ANDO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER
- Publication number 20110265324
- Publication date Nov 3, 2011
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100326709
- Publication date Dec 30, 2010
- IBIDEN CO., LTD.
- Shuichi Kawano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER
- Publication number 20090231827
- Publication date Sep 17, 2009
- IBIDEN CO., LTD.
- Toshiki Furutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER
- Publication number 20090173522
- Publication date Jul 9, 2009
- IBIDEN CO., LTD.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER
- Publication number 20090173530
- Publication date Jul 9, 2009
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR MOUNTING IC CHIP AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090038830
- Publication date Feb 12, 2009
- IBIDEN CO., LTD.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER
- Publication number 20080253097
- Publication date Oct 16, 2008
- IBIDEN CO., LTD.
- Shuichi KAWANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER, A METHOD FOR MANUFACTURING THE SAME AND AN ELECTRONIC C...
- Publication number 20080247116
- Publication date Oct 9, 2008
- IBIDEN CO., LTD.
- Shuichi KAWANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND ELECTRONIC DEVICE USING THE SAME
- Publication number 20080142976
- Publication date Jun 19, 2008
- IBIDEN CO., LTD.
- Shuichi Kawano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interposer and electronic device using the same
- Publication number 20080017407
- Publication date Jan 24, 2008
- IBIDEN CO., LTD.
- Shuichi Kawano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package board integrated with power supply
- Publication number 20080007925
- Publication date Jan 10, 2008
- IBIDEN, CO., LTD.
- Takashi Kariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor and manufacturing method thereof
- Publication number 20070181928
- Publication date Aug 9, 2007
- Yoshiki Yamanishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dielectric film capacitor and method of manufacturing the same
- Publication number 20070126041
- Publication date Jun 7, 2007
- TOKYO ELECTRON LIMITED
- Tomotaka Shinoda
- H01 - BASIC ELECTRIC ELEMENTS

Shuichi Kawano

Person

Patents Grantslast 30 patents

Method for manufacturing interposer

Substrate with low-elasticity layer and low-thermal-expansion layer

Printed wiring board and method for manufacturing the same

Capacitor and manufacturing method thereof

Interposer and method for manufacturing interposer

Interposer and method for manufacturing interposer

Interposer and method for manufacturing interposer

Interposer and electronic device using the same

Interposer, a method for manufacturing the same and an electronic c...

Package board integrated with power supply

Dielectric film capacitor and method of manufacturing the same

Interposer

Patents Applicationslast 30 patents

METHOD OF PRODUCING DIE FOR EXTRUSION MOLDING AND METHOD OF PRODUCI...

DIE FOR EXTRUSION MOLDING, METHOD OF PRODUCING DIE FOR EXTRUSION MO...

DIE FOR EXTRUSION MOLDING, METHOD OF PRODUCING DIE FOR EXTRUSION MO...

DIE FOR EXTRUSION MOLDING, METHOD OF PRODUCING DIE FOR EXTRUSION MO...

INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER

INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER

INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER

SUBSTRATE FOR MOUNTING IC CHIP AND METHOD OF MANUFACTURING THE SAME

INTERPOSER

INTERPOSER, A METHOD FOR MANUFACTURING THE SAME AND AN ELECTRONIC C...

INTERPOSER AND ELECTRONIC DEVICE USING THE SAME

Interposer and electronic device using the same

Package board integrated with power supply

Capacitor and manufacturing method thereof

Dielectric film capacitor and method of manufacturing the same