Shuidi WANG

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Beijing, CN

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Patents Grantslast 30 patents

Information Patent Grant
Method for bonding semiconductor devices on sustrate and bonding st...
- Patent number 9,613,925
- Issue date Apr 4, 2017
- Tsinghua University
- Jian Cai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING METHOD AND BONDING STRUCTURE FORMED USING THE SAME
- Publication number 20160172326
- Publication date Jun 16, 2016
- TSINGHUA UNIVERSITY
- Jian CAI
- H01 - BASIC ELECTRIC ELEMENTS