Shuji Eguchi

Person

Naka-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Control device and method of manufacturing thereof
- Patent number 7,924,572
- Issue date Apr 12, 2011
- Hitachi, Ltd.
- Takuya Mayuzumi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronic device
- Patent number 7,554,039
- Issue date Jun 30, 2009
- Hitachi, Ltd.
- Takehide Yokozuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for controlling a vehicle
- Patent number 7,530,819
- Issue date May 12, 2009
- Hitachi, Ltd.
- Masahiko Asano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 7,445,455
- Issue date Nov 4, 2008
- Hitachi, Ltd.
- Takehide Yokozuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Control device and method of manufacturing thereof
- Patent number 7,359,212
- Issue date Apr 15, 2008
- Hitachi, Ltd.
- Takuya Mayuzumi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Device for controlling a vehicle
- Patent number 7,303,406
- Issue date Dec 4, 2007
- Hitachi, Ltd.
- Masahiko Asano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, semiconductor wafer, semiconductor module, an...
- Patent number 7,217,992
- Issue date May 15, 2007
- Renesas Technology Corp.
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit tape having adhesive film semiconductor device and a method...
- Patent number 7,202,570
- Issue date Apr 10, 2007
- Renesas Technology Corp.
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,091,620
- Issue date Aug 15, 2006
- Renesas Technology Corp.
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring tape for semiconductor device including a buffer layer havin...
- Patent number 7,038,325
- Issue date May 2, 2006
- Hitachi Cable, Ltd.
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for controlling a vehicle
- Patent number 7,018,218
- Issue date Mar 28, 2006
- Hitachi, Ltd.
- Masahiko Asano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module and mounting method for same
- Patent number 6,940,162
- Issue date Sep 6, 2005
- Renesas Technology Corp.
- Shuji Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor wafer, semiconductor module, an...
- Patent number 6,888,230
- Issue date May 3, 2005
- Renesas Technology Corp.
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the devices
- Patent number 6,861,294
- Issue date Mar 1, 2005
- Renesas Technology Corp.
- Shigeharu Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit tape having adhesive film, semiconductor device, and a meth...
- Patent number 6,791,194
- Issue date Sep 14, 2004
- Hitachi, Ltd.
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and mounting method for same
- Patent number 6,784,541
- Issue date Aug 31, 2004
- Hitachi, Ltd.
- Shuji Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device a ball grid array pa...
- Patent number 6,686,226
- Issue date Feb 3, 2004
- Hitachi, Ltd.
- Shigeharu Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 6,639,323
- Issue date Oct 28, 2003
- Hitachi, Ltd.
- Yukiharu Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method of mounting
- Patent number 6,627,997
- Issue date Sep 30, 2003
- Hitachi, Ltd.
- Shuji Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and method for automotive components
- Patent number 6,586,105
- Issue date Jul 1, 2003
- Hitachi, Ltd.
- Shuji Eguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with elastic structure and wiring
- Patent number 6,515,371
- Issue date Feb 4, 2003
- Hitachi, Ltd.
- Yukiharu Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a porous buffer layer for semiconductor...
- Patent number 6,433,440
- Issue date Aug 13, 2002
- Hitachi, Ltd.
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor device having a stress relieving m...
- Patent number 6,423,571
- Issue date Jul 23, 2002
- Hitachi, Ltd.
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectronic device and method of manufacturing the same
- Patent number 6,371,664
- Issue date Apr 16, 2002
- Hitachi, Ltd.
- Shoichi Takahashi
- G02 - OPTICS
Information Patent Grant
Semiconductor device with chip size package
- Patent number 6,307,269
- Issue date Oct 23, 2001
- Hitachi, Ltd.
- Yukiharu Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,297,073
- Issue date Oct 2, 2001
- Hitachi, Ltd.
- Makoto Kitano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectronic device and method of manufacturing the same
- Patent number 6,282,350
- Issue date Aug 28, 2001
- Hitachi, Ltd.
- Shoichi Takahashi
- G02 - OPTICS
Information Patent Grant
Semiconductor device
- Patent number 6,130,112
- Issue date Oct 10, 2000
- Hitachi, Ltd.
- Makoto Kitano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device having a ball grid a...
- Patent number 6,114,192
- Issue date Sep 5, 2000
- Hitachi, Ltd.
- Shigeharu Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate and multilayer printed circuit board
- Patent number 6,114,005
- Issue date Sep 5, 2000
- Hitachi, Ltd.
- Akira Nagai
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
Control Device and Method of Manufacturing Thereof
- Publication number 20080165511
- Publication date Jul 10, 2008
- HITACHI, LTD.
- Takuya Mayuzumi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Device for controlling a vehicle
- Publication number 20080108232
- Publication date May 8, 2008
- Masahiko Asano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device
- Publication number 20060234420
- Publication date Oct 19, 2006
- Takehide Yokozuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device for controlling a vehicle
- Publication number 20060216967
- Publication date Sep 28, 2006
- Masahiko Asano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Control device and method of manufacturing thereof
- Publication number 20060077643
- Publication date Apr 13, 2006
- HITACHI, LTD.
- Takuya Mayuzumi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Electronic device
- Publication number 20060068609
- Publication date Mar 30, 2006
- Takehide Yokozuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing metthod thereof
- Publication number 20050212142
- Publication date Sep 29, 2005
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20050200019
- Publication date Sep 15, 2005
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mobile millimetric wave radar
- Publication number 20050069277
- Publication date Mar 31, 2005
- Terumi Nakazawa
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor module and mounting method for same
- Publication number 20040251540
- Publication date Dec 16, 2004
- Shuji Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit tape having adhesive film semiconductor device and a method...
- Publication number 20040224149
- Publication date Nov 11, 2004
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, semiconductor wafer, semiconductor module, an...
- Publication number 20040217453
- Publication date Nov 4, 2004
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring tape for semiconductor device including a buffer layer havin...
- Publication number 20040195702
- Publication date Oct 7, 2004
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device for controlling a vehicle
- Publication number 20040125582
- Publication date Jul 1, 2004
- Hitachi, Ltd.
- Masahiko Asano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20040061220
- Publication date Apr 1, 2004
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices and methods of making the devices
- Publication number 20040063272
- Publication date Apr 1, 2004
- Hitachi, Ltd.
- Shigeharu Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20030207557
- Publication date Nov 6, 2003
- Yukiharu Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module and mounting method for same
- Publication number 20030071348
- Publication date Apr 17, 2003
- Shuji Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit tape having adhesive film, semiconductor device, and a meth...
- Publication number 20020160185
- Publication date Oct 31, 2002
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and wiring tape for semiconductor device
- Publication number 20020158343
- Publication date Oct 31, 2002
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20020050636
- Publication date May 2, 2002
- Yukiharu Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20020047215
- Publication date Apr 25, 2002
- Yukiharu Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging structure and method for automotive components
- Publication number 20020031672
- Publication date Mar 14, 2002
- Shuji Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making a semiconductor device having a stress relieving m...
- Publication number 20010051393
- Publication date Dec 13, 2001
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photoelectronic device and method of manufacturing the same
- Publication number 20010024549
- Publication date Sep 27, 2001
- Hitachi, Ltd.
- Shoichi Takahashi
- G02 - OPTICS

Shuji Eguchi

Person

Patents Grantslast 30 patents

Control device and method of manufacturing thereof

Electronic device

Device for controlling a vehicle

Electronic device

Control device and method of manufacturing thereof

Device for controlling a vehicle

Semiconductor device, semiconductor wafer, semiconductor module, an...

Circuit tape having adhesive film semiconductor device and a method...

Semiconductor device and manufacturing method thereof

Wiring tape for semiconductor device including a buffer layer havin...

Device for controlling a vehicle

Semiconductor module and mounting method for same

Semiconductor device, semiconductor wafer, semiconductor module, an...

Semiconductor devices and methods of making the devices

Circuit tape having adhesive film, semiconductor device, and a meth...

Semiconductor module and mounting method for same

Method of manufacturing a semiconductor device a ball grid array pa...

Semiconductor device and its manufacturing method

Semiconductor module and method of mounting

Packaging structure and method for automotive components

Semiconductor device with elastic structure and wiring

Semiconductor device having a porous buffer layer for semiconductor...

Method of making a semiconductor device having a stress relieving m...

Photoelectronic device and method of manufacturing the same

Semiconductor device with chip size package

Semiconductor device

Photoelectronic device and method of manufacturing the same

Semiconductor device

Method of manufacturing a semiconductor device having a ball grid a...

Laminate and multilayer printed circuit board

Patents Applicationslast 30 patents

Control Device and Method of Manufacturing Thereof

Device for controlling a vehicle

Electronic device

Device for controlling a vehicle

Control device and method of manufacturing thereof

Electronic device

Semiconductor device and manufacturing metthod thereof

Semiconductor device and manufacturing method thereof

Mobile millimetric wave radar

Semiconductor module and mounting method for same

Circuit tape having adhesive film semiconductor device and a method...

Semiconductor device, semiconductor wafer, semiconductor module, an...

Wiring tape for semiconductor device including a buffer layer havin...

Device for controlling a vehicle

Semiconductor device and manufacturing method thereof

Semiconductor devices and methods of making the devices

Semiconductor device and its manufacturing method

Semiconductor module and mounting method for same

Circuit tape having adhesive film, semiconductor device, and a meth...

Semiconductor device and wiring tape for semiconductor device

Semiconductor device and its manufacturing method

Semiconductor device and its manufacturing method

Packaging structure and method for automotive components

Method of making a semiconductor device having a stress relieving m...

Photoelectronic device and method of manufacturing the same