Shyam Surthi

Person

Raleigh, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated assemblies having charge-trapping material arranged in v...
- Patent number 12,150,303
- Issue date Nov 19, 2024
- Byeung Chul Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 12,082,416
- Issue date Sep 3, 2024
- Micron Technology, Inc.
- Byeung Chul Kim
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 12,057,400
- Issue date Aug 6, 2024
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including stack structures having air gaps,...
- Patent number 12,052,862
- Issue date Jul 30, 2024
- Micron Technology, Inc.
- Byeung Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 12,041,779
- Issue date Jul 16, 2024
- Micron Technology, Inc.
- Shyam Surthi
Information Patent Grant
Integrated assemblies having vertically-spaced channel material seg...
- Patent number 11,871,572
- Issue date Jan 9, 2024
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,729,982
- Issue date Aug 15, 2023
- Micron Technology, Inc.
- Shyam Surthi
Information Patent Grant
Electronic devices comprising adjoining oxide materials and related...
- Patent number 11,672,118
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having charge-trapping material arranged in v...
- Patent number 11,672,120
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- Byeung Chui Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated assemblies having vertically-extending channel material...
- Patent number 11,631,697
- Issue date Apr 18, 2023
- Micron Technology, Inc.
- Shyam Surthi
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated assemblies having vertically-spaced channel material seg...
- Patent number 11,605,645
- Issue date Mar 14, 2023
- Micron Technology, Inc.
- John D. Hopkins
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated assemblies having vertically-spaced channel material seg...
- Patent number 11,587,948
- Issue date Feb 21, 2023
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having vertically-spaced channel material seg...
- Patent number 11,563,031
- Issue date Jan 24, 2023
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having vertically-spaced channel material seg...
- Patent number 11,557,608
- Issue date Jan 17, 2023
- Micron Technology, Inc.
- Byeung Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuitry, a method used in forming integrated circuitry...
- Patent number 11,495,610
- Issue date Nov 8, 2022
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having vertically-spaced channel material seg...
- Patent number 11,417,682
- Issue date Aug 16, 2022
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,296,103
- Issue date Apr 5, 2022
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having vertically-extending channel material...
- Patent number 11,289,501
- Issue date Mar 29, 2022
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having vertically-spaced channel material seg...
- Patent number 11,244,954
- Issue date Feb 8, 2022
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,189,629
- Issue date Nov 30, 2021
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having improved charge migration
- Patent number 11,171,153
- Issue date Nov 9, 2021
- Micron Technology, Inc.
- Byeung Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having vertically-spaced channel material seg...
- Patent number 11,107,830
- Issue date Aug 31, 2021
- Micron Technology, Inc.
- Byeung Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having vertically-spaced channel material seg...
- Patent number 11,081,498
- Issue date Aug 3, 2021
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having vertically-spaced channel material seg...
- Patent number 11,081,497
- Issue date Aug 3, 2021
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having charge-trapping material arranged in v...
- Patent number 11,037,956
- Issue date Jun 15, 2021
- Micron Technology, Inc.
- Byeung Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having vertically-spaced channel material seg...
- Patent number 11,031,414
- Issue date Jun 8, 2021
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having vertically-spaced channel material seg...
- Patent number 11,024,644
- Issue date Jun 1, 2021
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses including buried digit lines
- Patent number 10,930,652
- Issue date Feb 23, 2021
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitance reduction in a semiconductor device
- Patent number 10,923,480
- Issue date Feb 16, 2021
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having charge-trapping material arranged in v...
- Patent number 10,777,576
- Issue date Sep 15, 2020
- Micron Technology, Inc.
- Byeung Chul Kim
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20240381646
- Publication date Nov 14, 2024
- Micron Technology, Inc.
- Byeung Chul Kim
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20240363540
- Publication date Oct 31, 2024
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE DIODES FOR WAFER ON WAFER PACKAGING OF SEMICONDUCTOR D...
- Publication number 20240322049
- Publication date Sep 26, 2024
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING THROUGH-SILICON VIAS, AND RELATED...
- Publication number 20240290385
- Publication date Aug 29, 2024
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRING DRIVER WITH DEEP TRENCH ISOLATIONS
- Publication number 20240274594
- Publication date Aug 15, 2024
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS WITH SELF-ALIGNED CONNECTION AND RELATED METHODS
- Publication number 20240194529
- Publication date Jun 13, 2024
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED INTERCONNECTION FOR WAFER ON WAFER PACKAGING
- Publication number 20240170426
- Publication date May 23, 2024
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING ADJOINING OXIDE MATERIALS AND RELATED...
- Publication number 20240130124
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Shyam Surthi
Information Patent Application
MEMORY ARRAY STRUCTURES AND METHODS OF THEIR FABRICATION
- Publication number 20240071966
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20230320085
- Publication date Oct 5, 2023
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Charge-Trapping Material Arranged in V...
- Publication number 20230262981
- Publication date Aug 17, 2023
- Micron Technology, Inc.
- Byeung Chul Kim
- G11 - INFORMATION STORAGE
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STACK STRUCTURES HAVING AIR GAPS,...
- Publication number 20230189515
- Publication date Jun 15, 2023
- Micron Technology, Inc.
- Byeung Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20230043163
- Publication date Feb 9, 2023
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20230034157
- Publication date Feb 2, 2023
- Micron Technology, Inc.
- Byeung Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20230011076
- Publication date Jan 12, 2023
- Micron Technology, Inc.
- Shyam Surthi
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Assemblies Having Vertically-Spaced Channel Material Seg...
- Publication number 20220359565
- Publication date Nov 10, 2022
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20220181334
- Publication date Jun 9, 2022
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Vertically-Extending Channel Material...
- Publication number 20220173123
- Publication date Jun 2, 2022
- Micron Technology, Inc.
- Shyam Surthi
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Assemblies Having Vertically-Spaced Channel Material Seg...
- Publication number 20220123018
- Publication date Apr 21, 2022
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING ADJOINING OXIDE MATERIALS AND RELATED...
- Publication number 20220077176
- Publication date Mar 10, 2022
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20220045072
- Publication date Feb 10, 2022
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20220037357
- Publication date Feb 3, 2022
- Micron Technology, Inc.
- Byeung Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuitry, A Method Used In Forming Integrated Circuitry...
- Publication number 20220005819
- Publication date Jan 6, 2022
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Vertically-Spaced Channel Material Seg...
- Publication number 20210366927
- Publication date Nov 25, 2021
- Micron Technology, Inc.
- Byeung Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20210343728
- Publication date Nov 4, 2021
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20210343729
- Publication date Nov 4, 2021
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC STRUCTURES COMPRISING MULTIPLE, ADJOINING HIGH-K DIELECT...
- Publication number 20210343736
- Publication date Nov 4, 2021
- Micron Technology, Inc.
- Shyam Surthi
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Assemblies Having Vertically-Spaced Channel Material Seg...
- Publication number 20210335817
- Publication date Oct 28, 2021
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Vertically-Spaced Channel Material Seg...
- Publication number 20210335818
- Publication date Oct 28, 2021
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Charge-Trapping Material Arranged in V...
- Publication number 20210327898
- Publication date Oct 21, 2021
- Micron Technology, Inc.
- Byeung Chul Kim
- G11 - INFORMATION STORAGE

Shyam Surthi

Person

Patents Grantslast 30 patents

Integrated assemblies having charge-trapping material arranged in v...

Integrated assemblies and methods of forming integrated assemblies

Integrated assemblies and methods of forming integrated assemblies

Microelectronic devices including stack structures having air gaps,...

Integrated assemblies and methods of forming integrated assemblies

Integrated assemblies having vertically-spaced channel material seg...

Integrated assemblies and methods of forming integrated assemblies

Electronic devices comprising adjoining oxide materials and related...

Integrated assemblies having charge-trapping material arranged in v...

Integrated assemblies having vertically-extending channel material...

Integrated assemblies having vertically-spaced channel material seg...

Integrated assemblies having vertically-spaced channel material seg...

Integrated assemblies having vertically-spaced channel material seg...

Integrated assemblies having vertically-spaced channel material seg...

Integrated circuitry, a method used in forming integrated circuitry...

Integrated assemblies having vertically-spaced channel material seg...

Integrated assemblies and methods of forming integrated assemblies

Integrated assemblies having vertically-extending channel material...

Integrated assemblies having vertically-spaced channel material seg...

Integrated assemblies and methods of forming integrated assemblies

Integrated assemblies having improved charge migration

Integrated assemblies having vertically-spaced channel material seg...

Integrated assemblies having vertically-spaced channel material seg...

Integrated assemblies having vertically-spaced channel material seg...

Integrated assemblies having charge-trapping material arranged in v...

Integrated assemblies having vertically-spaced channel material seg...

Integrated assemblies having vertically-spaced channel material seg...

Apparatuses including buried digit lines

Capacitance reduction in a semiconductor device

Integrated assemblies having charge-trapping material arranged in v...

Patents Applicationslast 30 patents

Integrated Assemblies and Methods of Forming Integrated Assemblies

Integrated Assemblies and Methods of Forming Integrated Assemblies

HIGH VOLTAGE DIODES FOR WAFER ON WAFER PACKAGING OF SEMICONDUCTOR D...

MICROELECTRONIC DEVICES INCLUDING THROUGH-SILICON VIAS, AND RELATED...

STRING DRIVER WITH DEEP TRENCH ISOLATIONS

APPARATUS WITH SELF-ALIGNED CONNECTION AND RELATED METHODS

ADVANCED INTERCONNECTION FOR WAFER ON WAFER PACKAGING

ELECTRONIC DEVICES COMPRISING ADJOINING OXIDE MATERIALS AND RELATED...

MEMORY ARRAY STRUCTURES AND METHODS OF THEIR FABRICATION

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

Integrated Assemblies Having Charge-Trapping Material Arranged in V...

MICROELECTRONIC DEVICES INCLUDING STACK STRUCTURES HAVING AIR GAPS,...

Integrated Assemblies and Methods of Forming Integrated Assemblies

Integrated Assemblies and Methods of Forming Integrated Assemblies

Integrated Assemblies and Methods of Forming Integrated Assemblies

Integrated Assemblies Having Vertically-Spaced Channel Material Seg...

Integrated Assemblies and Methods of Forming Integrated Assemblies

Integrated Assemblies Having Vertically-Extending Channel Material...

Integrated Assemblies Having Vertically-Spaced Channel Material Seg...

ELECTRONIC DEVICES COMPRISING ADJOINING OXIDE MATERIALS AND RELATED...

Integrated Assemblies and Methods of Forming Integrated Assemblies

Integrated Assemblies and Methods of Forming Integrated Assemblies

Integrated Circuitry, A Method Used In Forming Integrated Circuitry...

Integrated Assemblies Having Vertically-Spaced Channel Material Seg...

Integrated Assemblies and Methods of Forming Integrated Assemblies

Integrated Assemblies and Methods of Forming Integrated Assemblies

ELECTRONIC STRUCTURES COMPRISING MULTIPLE, ADJOINING HIGH-K DIELECT...

Integrated Assemblies Having Vertically-Spaced Channel Material Seg...

Integrated Assemblies Having Vertically-Spaced Channel Material Seg...

Integrated Assemblies Having Charge-Trapping Material Arranged in V...