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Shyh-Ing Wu

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  • Kaohsiung, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Method for Forming Passivation Layer
    • Publication number 20070232052
    • Publication date Oct 4, 2007
    • ADVANCED SEMICONDUCTOR ENGINEERING INC.
    • Cheng-Hsueh Su
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Chip structure and manufacturing method of the same
    • Publication number 20070108612
    • Publication date May 17, 2007
    • Advanced Semiconductor Engineering, Inc.
    • Chueh-An Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Bumping process and structure thereof
    • Publication number 20070049001
    • Publication date Mar 1, 2007
    • Advanced Semiconductor Engineering, Inc.
    • Chueh-An Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wafer structure
    • Publication number 20070045848
    • Publication date Mar 1, 2007
    • Advanced Semiconductor Engineering, Inc.
    • Li-Cheng Tai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wafer structure, chip structure and bumping process
    • Publication number 20060097392
    • Publication date May 11, 2006
    • Advanced Semiconductor Engineering, Inc.
    • Shyh-Ing Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    [BUMP-FORMING PROCESS]
    • Publication number 20040124171
    • Publication date Jul 1, 2004
    • Shyh-Ing Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SOLDER PASTE FOR FABRICATING BUMP
    • Publication number 20030164204
    • Publication date Sep 4, 2003
    • Ho-Ming Tong
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method of attaching a heat sink to an IC package
    • Publication number 20030106212
    • Publication date Jun 12, 2003
    • Advanced Semiconductor Engineering, Inc.
    • Shin-Hua Chao
    • H01 - BASIC ELECTRIC ELEMENTS