Claims
- 1. A solder paste for fabricating bumps comprising a flax, andmetallic alloy powder including a plurality of metallic alloy granules, wherein a size of the metallic alloy granules ranges from about 20 μm to about 60 μm.
- 2. The solder paste of claim 1, wherein the size of the metallic alloy granules ranges from about 35 μm to about 45 μm.
- 3. The solder paste of claim 1, wherein a weight percent of the metallic alloy powder ranges from about 85% to about 95% of the solder paste for fabricating the bumps.
- 4. The solder paste of claim 1, wherein the metallic alloy powder includes ground Sn/Pb alloy.
- 5. The solder paste of claim 1, wherein the metallic alloy powder includes ground low eutectic metallic alloy.
- 6. The solder paste of claim 4, wherein a ratio of Pb to Sn in the alloy is 95:5.
- 7. The solder paste of claim 4, wherein a ratio of Pb to Sn ranges from about 94% to about 98% of a weight percentage of lead.
- 8. A solder paste for fabricating bumps comprising a flux, andmetallic alloy powder including a plurality of Sn/Pb alloy granules, wherein a ratio of lead to the Sn/Pb alloy ranges from about 85% to about 95% and a size of the metallic alloy granules ranges from about 20 μm to about 60 μm.
- 9. The solder paste of claim 8, wherein the metallic alloy powder includes ground low eutectic metallic alloy.
- 10. The solder paste of claim 8, wherein the size of the metallic alloy granules ranges from about 35 μm to about 45 μm.
- 11. The solder paste of claim 8, wherein a weight percentage of the metallic alloy powder ranges from about 85% to about 95% of the solder paste for fabricating the bumps.
- 12. A solder paste for fabricating bumps comprising:a flux, and metallic alloy powder including a plurality of metallic alloy granules, wherein an average size of the metallic alloy granules is in a range of 35-45 μm.
Priority Claims (1)
Number |
Date |
Country |
Kind |
91103732 A |
Mar 2002 |
TW |
|
CROSS REFERENCE TO RELATED APPLICATIONS
This application claims the priority benefit of Taiwan application serial no. 91103732, filed on Mar. 1, 2002.
US Referenced Citations (10)
Non-Patent Literature Citations (1)
Entry |
ASM Handbook, vol. 7, Powder Metallurgy, pp. 176, 837, 1984. |