Sidney B. Rigg

Person

Meridian, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Through-wafer interconnects for photoimager and memory wafers
- Patent number 8,669,179
- Issue date Mar 11, 2014
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor dice including at least one blind hole, wafers includ...
- Patent number 8,637,962
- Issue date Jan 28, 2014
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-wafer interconnects for photoimager and memory wafers
- Patent number 8,502,353
- Issue date Aug 6, 2013
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming conductive vias
- Patent number 8,324,100
- Issue date Dec 4, 2012
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor dice including at least one blind hole, wafers includ...
- Patent number 8,324,101
- Issue date Dec 4, 2012
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating and filling conductive vias and conductive...
- Patent number 8,294,273
- Issue date Oct 23, 2012
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming blind wafer interconnects, and related structure...
- Patent number 7,989,345
- Issue date Aug 2, 2011
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support structure for use in thinning semiconductor substrates and...
- Patent number 7,960,829
- Issue date Jun 14, 2011
- Micron Technology, Inc.
- Alan G. Wood
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Through-wafer interconnects for photoimager and memory wafers
- Patent number 7,956,443
- Issue date Jun 7, 2011
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating and filling conductive vias and conductive...
- Patent number 7,892,972
- Issue date Feb 22, 2011
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and methods for forming interconnects in mi...
- Patent number 7,829,976
- Issue date Nov 9, 2010
- Micron Technology, Inc.
- Kyle K. Kirby
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming blind wafer interconnects
- Patent number 7,772,116
- Issue date Aug 10, 2010
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics devices, having vias, and packaged microelectronic...
- Patent number 7,759,800
- Issue date Jul 20, 2010
- Micron Technology, Inc.
- Sidney B. Rigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for thinning semiconductor substrates that employ support s...
- Patent number 7,713,841
- Issue date May 11, 2010
- Micron Technology, Inc.
- Alan G. Wood
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Microelectronic imagers with optical devices and methods of manufac...
- Patent number 7,709,776
- Issue date May 4, 2010
- Aptina Imaging Corporation
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-wafer interconnects for photoimager and memory wafers
- Patent number 7,683,458
- Issue date Mar 23, 2010
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and methods for forming interconnects in mi...
- Patent number 7,531,453
- Issue date May 12, 2009
- Micron Technology, Inc.
- Kyle K. Kirby
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic imagers with optical devices and methods of manufac...
- Patent number 7,504,615
- Issue date Mar 17, 2009
- Aptina Imaging Corporation
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic imaging units and methods of manufacturing microele...
- Patent number 7,452,743
- Issue date Nov 18, 2008
- Aptina Imaging Corporation
- Steven D. Oliver
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic imagers and methods of packaging microelectronic im...
- Patent number 7,419,841
- Issue date Sep 2, 2008
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming vias in microelectronic devices, and methods fo...
- Patent number 7,413,979
- Issue date Aug 19, 2008
- Micron Technology, Inc.
- Sidney B. Rigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and methods for forming interconnects in mi...
- Patent number 7,329,943
- Issue date Feb 12, 2008
- Micron Technology, Inc.
- Kyle K. Kirby
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-wafer interconnects for photoimager and memory wafers
- Patent number 7,300,857
- Issue date Nov 27, 2007
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic imagers with optical devices and methods of manufac...
- Patent number 7,265,330
- Issue date Sep 4, 2007
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prefabricated housings for microelectronic imagers
- Patent number 7,262,405
- Issue date Aug 28, 2007
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for packaging microelectronic imagers
- Patent number 7,253,390
- Issue date Aug 7, 2007
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and methods for forming interconnects in mi...
- Patent number 7,232,754
- Issue date Jun 19, 2007
- Micron Technology, Inc.
- Kyle K. Kirby
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic imagers and methods of packaging microelectronic im...
- Patent number 7,199,439
- Issue date Apr 3, 2007
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic imagers with optical devices and methods of manufac...
- Patent number 7,189,954
- Issue date Mar 13, 2007
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming vias in microelectronic devices, and methods fo...
- Patent number 7,091,124
- Issue date Aug 15, 2006
- Micron Technology, Inc.
- Sidney B. Rigg
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS
- Publication number 20130295766
- Publication date Nov 7, 2013
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DICE INCLUDING AT LEAST ONE BLIND HOLE, WAFERS INCLUD...
- Publication number 20130043588
- Publication date Feb 21, 2013
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DICE INCLUDING AT LEAST ONE BLIND HOLE, WAFERS INCLUD...
- Publication number 20110272806
- Publication date Nov 10, 2011
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS
- Publication number 20110233777
- Publication date Sep 29, 2011
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING CONDUCTIVE VIAS
- Publication number 20110136336
- Publication date Jun 9, 2011
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING AND FILLING CONDUCTIVE VIAS AND CONDUCTIVE...
- Publication number 20110095429
- Publication date Apr 28, 2011
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS
- Publication number 20100171217
- Publication date Jul 8, 2010
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES AND METHODS FOR FORMING INTERCONNECTS IN MI...
- Publication number 20090191701
- Publication date Jul 30, 2009
- Micron Technology, Inc.
- Kyle K. Kirby
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC IMAGERS WITH OPTICAL DEVICES AND METHODS OF MANUFAC...
- Publication number 20090155949
- Publication date Jun 18, 2009
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES AND METHODS FOR FORMING INTERCONNECTS IN MI...
- Publication number 20080138973
- Publication date Jun 12, 2008
- Micron Technology, Inc.
- Kyle K. Kirby
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS
- Publication number 20080111213
- Publication date May 15, 2008
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING BLIND WAFER INTERCONNECTS, AND RELATED STRUCTURE...
- Publication number 20070257373
- Publication date Nov 8, 2007
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for fabricating and filling conductive vias and conductive...
- Publication number 20070184654
- Publication date Aug 9, 2007
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic imagers with optical devices and methods of manufac...
- Publication number 20070170350
- Publication date Jul 26, 2007
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic imaging units and methods of manufacturing microele...
- Publication number 20070045632
- Publication date Mar 1, 2007
- Micron Technology, Inc.
- Steven D. Oliver
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of forming blind wafer interconnects, and related structure...
- Publication number 20070045780
- Publication date Mar 1, 2007
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic imagers and methods of packaging microelectronic im...
- Publication number 20060261340
- Publication date Nov 23, 2006
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic devices, methods for forming vias in microelectroni...
- Publication number 20060264041
- Publication date Nov 23, 2006
- Micron Technology, Inc.
- Sidney B. Rigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic imagers with optical devices and methods of manufac...
- Publication number 20060243889
- Publication date Nov 2, 2006
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic devices, methods for forming vias in microelectroni...
- Publication number 20060216862
- Publication date Sep 28, 2006
- Micron Technology, Inc.
- Sidney B. Rigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic devices and methods for forming interconnects in mi...
- Publication number 20060199363
- Publication date Sep 7, 2006
- Micron Technology, Inc.
- Kyle K. Kirby
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for packaging microelectronic imagers
- Publication number 20060186317
- Publication date Aug 24, 2006
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic workpieces and methods for forming interconnects in...
- Publication number 20060177999
- Publication date Aug 10, 2006
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through-wafer interconnects for photoimager and memory wafers
- Publication number 20060043599
- Publication date Mar 2, 2006
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic imagers with optical devices and methods of manufac...
- Publication number 20060011809
- Publication date Jan 19, 2006
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Materials for use in programmed material consolidation processes
- Publication number 20060008739
- Publication date Jan 12, 2006
- Alan G. Wood
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Methods for optimizing physical characteristics of selectively cons...
- Publication number 20060003255
- Publication date Jan 5, 2006
- Alan G. Wood
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Support structure for use in thinning semiconductor substrates and...
- Publication number 20060001139
- Publication date Jan 5, 2006
- Alan G. Wood
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Assemblies including semiconductor substrates of reduced thickness...
- Publication number 20060003549
- Publication date Jan 5, 2006
- Alan G. Wood
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Microelectronic devices and methods for forming interconnects in mi...
- Publication number 20050287783
- Publication date Dec 29, 2005
- Kyle K. Kirby
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Sidney B. Rigg

Person

Patents Grantslast 30 patents

Through-wafer interconnects for photoimager and memory wafers

Semiconductor dice including at least one blind hole, wafers includ...

Through-wafer interconnects for photoimager and memory wafers

Methods of forming conductive vias

Semiconductor dice including at least one blind hole, wafers includ...

Methods for fabricating and filling conductive vias and conductive...

Methods of forming blind wafer interconnects, and related structure...

Support structure for use in thinning semiconductor substrates and...

Through-wafer interconnects for photoimager and memory wafers

Methods for fabricating and filling conductive vias and conductive...

Microelectronic devices and methods for forming interconnects in mi...

Methods of forming blind wafer interconnects

Microelectronics devices, having vias, and packaged microelectronic...

Methods for thinning semiconductor substrates that employ support s...

Microelectronic imagers with optical devices and methods of manufac...

Through-wafer interconnects for photoimager and memory wafers

Microelectronic devices and methods for forming interconnects in mi...

Microelectronic imagers with optical devices and methods of manufac...

Microelectronic imaging units and methods of manufacturing microele...

Microelectronic imagers and methods of packaging microelectronic im...

Methods for forming vias in microelectronic devices, and methods fo...

Microelectronic devices and methods for forming interconnects in mi...

Through-wafer interconnects for photoimager and memory wafers

Microelectronic imagers with optical devices and methods of manufac...

Prefabricated housings for microelectronic imagers

Methods for packaging microelectronic imagers

Microelectronic devices and methods for forming interconnects in mi...

Microelectronic imagers and methods of packaging microelectronic im...

Microelectronic imagers with optical devices and methods of manufac...

Methods for forming vias in microelectronic devices, and methods fo...

Patents Applicationslast 30 patents

THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS

SEMICONDUCTOR DICE INCLUDING AT LEAST ONE BLIND HOLE, WAFERS INCLUD...

SEMICONDUCTOR DICE INCLUDING AT LEAST ONE BLIND HOLE, WAFERS INCLUD...

THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS

METHODS OF FORMING CONDUCTIVE VIAS

METHODS FOR FABRICATING AND FILLING CONDUCTIVE VIAS AND CONDUCTIVE...

THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS

MICROELECTRONIC DEVICES AND METHODS FOR FORMING INTERCONNECTS IN MI...

MICROELECTRONIC IMAGERS WITH OPTICAL DEVICES AND METHODS OF MANUFAC...

MICROELECTRONIC DEVICES AND METHODS FOR FORMING INTERCONNECTS IN MI...

THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS

METHODS OF FORMING BLIND WAFER INTERCONNECTS, AND RELATED STRUCTURE...

Methods for fabricating and filling conductive vias and conductive...

Microelectronic imagers with optical devices and methods of manufac...

Microelectronic imaging units and methods of manufacturing microele...

Methods of forming blind wafer interconnects, and related structure...

Microelectronic imagers and methods of packaging microelectronic im...

Microelectronic devices, methods for forming vias in microelectroni...

Microelectronic imagers with optical devices and methods of manufac...

Microelectronic devices, methods for forming vias in microelectroni...

Microelectronic devices and methods for forming interconnects in mi...

Methods for packaging microelectronic imagers

Microelectronic workpieces and methods for forming interconnects in...

Through-wafer interconnects for photoimager and memory wafers

Microelectronic imagers with optical devices and methods of manufac...

Materials for use in programmed material consolidation processes

Methods for optimizing physical characteristics of selectively cons...

Support structure for use in thinning semiconductor substrates and...

Assemblies including semiconductor substrates of reduced thickness...

Microelectronic devices and methods for forming interconnects in mi...