Sidney J. Clouser

Person

Chardon, OH, US

People

Patents Grantslast 30 patents

Information Patent Grant
Process for improving adhesion of resistive foil to laminating mate...
- Patent number 6,824,880
- Issue date Nov 30, 2004
- Ga-Tek, Inc.
- Atnaf Admasu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Protective coatings for improved tarnish resistance in metal foils
- Patent number 6,805,964
- Issue date Oct 19, 2004
- Nikko Materials USA, Inc.
- Sidney J. Clouser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resistor component with multiple layers of resistive material
- Patent number 6,771,160
- Issue date Aug 3, 2004
- Nikko Materials USA, Inc.
- Jiangtao Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for manufacturing copper foil on a metal carrier substrate
- Patent number 6,770,976
- Issue date Aug 3, 2004
- Nikko Materials USA, Inc.
- Jiangtao Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resistor component with multiple layers of resistive material
- Patent number 6,622,374
- Issue date Sep 23, 2003
- Gould Electronics Inc.
- Jiangtao Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protective coatings for improved tarnish resistance in metal foils
- Patent number 6,537,675
- Issue date Mar 25, 2003
- Ga-Tek, Inc.
- Sidney J. Clouser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin copper on usable carrier and method of forming same
- Patent number 6,447,929
- Issue date Sep 10, 2002
- Gould Electronics Inc.
- Jiangtao Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Anode structure for manufacture of metallic foil
- Patent number 6,183,607
- Issue date Feb 6, 2001
- GA-TEK Inc.
- Sidney J. Clouser
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
High fatigue ductility electrodeposited copper foil
- Patent number 6,132,887
- Issue date Oct 17, 2000
- Gould Electronics Inc.
- Sidney J. Clouser
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper wire and process for making copper wire
- Patent number 6,123,788
- Issue date Sep 26, 2000
- ElectroCopper Products Limited
- Sidney J. Clouser
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
High performance flexible laminate
- Patent number 5,863,666
- Issue date Jan 26, 1999
- Gould Electronics Inc.
- Harish D. Merchant
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper wire
- Patent number 5,830,583
- Issue date Nov 3, 1998
- Sidney J. Clouser
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrodeposited copper foil
- Patent number 5,454,926
- Issue date Oct 3, 1995
- Gould Electronics Inc.
- Sidney J. Clouser
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrodeposited copper foil and process for making same using elec...
- Patent number 5,421,985
- Issue date Jun 6, 1995
- Gould Inc.
- Sidney J. Clouser
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrodeposited copper foil and process for making same using elec...
- Patent number 5,403,465
- Issue date Apr 4, 1995
- Gould Inc.
- R. Duane Apperson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for making copper foil
- Patent number 5,366,612
- Issue date Nov 22, 1994
- Magma Copper Company
- Sidney J. Clouser
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Resistive metal layers and method for making same
- Patent number 5,243,320
- Issue date Sep 7, 1993
- Gould Inc.
- Sidney J. Clouser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrodeposited foil with controlled properties for printed circui...
- Patent number 5,215,645
- Issue date Jun 1, 1993
- Gould Inc.
- Dino F. DiFranco
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper foils for printed circuit board applications and procedures...
- Patent number 5,171,417
- Issue date Dec 15, 1992
- Gould Inc.
- Dino F. DiFranco
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for printed circuit board pattern making using selectively e...
- Patent number 5,017,271
- Issue date May 21, 1991
- Gould Inc.
- Christopher J. Whewell
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Method of plating metal onto titanium
- Publication number 20090090634
- Publication date Apr 9, 2009
- Sifco Selective Plating
- Darrin K. Radatz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Protective coatings for improved tarnish resistance in metal foils
- Publication number 20030178139
- Publication date Sep 25, 2003
- Sidney J. Clouser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for manufacturing copper foil on a metal carrier substrate
- Publication number 20030153169
- Publication date Aug 14, 2003
- Gould Electronics Inc.
- Jiangtao Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Resistor component with multiple layers of resistive material
- Publication number 20020047773
- Publication date Apr 25, 2002
- GA-TEK Inc. (dba Gould Electronics Inc.)
- Jiangtao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resistor component with multiple layers of resistive material
- Publication number 20020047771
- Publication date Apr 25, 2002
- Gould Electronics Inc.
- Jiangtao Wang
- H01 - BASIC ELECTRIC ELEMENTS

Sidney J. Clouser

Person

Patents Grantslast 30 patents

Process for improving adhesion of resistive foil to laminating mate...

Protective coatings for improved tarnish resistance in metal foils

Resistor component with multiple layers of resistive material

Process for manufacturing copper foil on a metal carrier substrate

Resistor component with multiple layers of resistive material

Protective coatings for improved tarnish resistance in metal foils

Thin copper on usable carrier and method of forming same

Anode structure for manufacture of metallic foil

High fatigue ductility electrodeposited copper foil

Copper wire and process for making copper wire

High performance flexible laminate

Copper wire

Electrodeposited copper foil

Electrodeposited copper foil and process for making same using elec...

Electrodeposited copper foil and process for making same using elec...

Process for making copper foil

Resistive metal layers and method for making same

Electrodeposited foil with controlled properties for printed circui...

Copper foils for printed circuit board applications and procedures...

Method for printed circuit board pattern making using selectively e...

Patents Applicationslast 30 patents

Method of plating metal onto titanium

Protective coatings for improved tarnish resistance in metal foils

Process for manufacturing copper foil on a metal carrier substrate

Resistor component with multiple layers of resistive material

Resistor component with multiple layers of resistive material