Simon Yew-Meng Chooi

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Process for predicting and reducing the corrosivity of a hydrocarbo...
- Patent number 8,882,995
- Issue date Nov 11, 2014
- Shell Oil Company
- Lee-Huat Chia
- C10 - PETROLEUM, GAS OR COKE INDUSTRIES TECHNICAL GASES CONTAINING CARBON MON...
Information Patent Grant
Method of copper/copper surface bonding using a conducting polymer...
- Patent number 7,452,808
- Issue date Nov 18, 2008
- Chartered Semiconductor Manufacturing Ltd.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for elimination of arsenic based defects in semiconductor d...
- Patent number 7,268,048
- Issue date Sep 11, 2007
- Chartered Semiconductor Manufacturing Ltd.
- Yin-Min Felicia Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-rich oxide for copper damascene interconnect incorporating...
- Patent number 7,186,640
- Issue date Mar 6, 2007
- Chartered Semiconductor Manufacturing Ltd.
- Liu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Poly(arylene ether) dielectrics
- Patent number 7,179,879
- Issue date Feb 20, 2007
- Chartered Semiconductor Manufacturing Ltd.
- Christopher Lim
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Poly(arylene ether) dielectrics
- Patent number 7,166,250
- Issue date Jan 23, 2007
- Chartered Semiconductor Manufacturing Ltd.
- Christopher Lim
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method to improve adhesion of dielectric films in damascene interco...
- Patent number 7,078,333
- Issue date Jul 18, 2006
- Luona Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Poly(arylene ether) dielectrics
- Patent number 7,071,281
- Issue date Jul 4, 2006
- Chartered Semiconductor Manufacturing Ltd.
- Christopher Lim
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of copper/copper surface bonding using a conducting polymer...
- Patent number 7,060,613
- Issue date Jun 13, 2006
- Chartered Semiconductor Manufacturing Ltd.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal gate process: metals and their silicides
- Patent number 7,005,716
- Issue date Feb 28, 2006
- Chartered Semiconductor Manufacturing Ltd.
- Wenhe Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper diffusion deterrent interface
- Patent number 6,987,321
- Issue date Jan 17, 2006
- Chartered Semiconductor Manufacturing Ltd.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of copper/copper surface bonding using a conducting polymer...
- Patent number 6,967,162
- Issue date Nov 22, 2005
- Chartered Semiconductor Manufacturing Ltd.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to form dual metal gates by incorporating metals and their...
- Patent number 6,891,233
- Issue date May 10, 2005
- Chartered Semiconductor Manufacturing Ltd.
- Wenhe Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Poly(arylene ether) dielectrics
- Patent number 6,846,899
- Issue date Jan 25, 2005
- Chartered Semiconductor Manufacturing Ltd.
- Christopher Lim
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Methods to form dual metal gates by incorporating metals and their...
- Patent number 6,835,989
- Issue date Dec 28, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Wenhe Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of copper/copper surface bonding using a conducting polymer...
- Patent number 6,821,888
- Issue date Nov 23, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Yakub Aliyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods to clean copper contamination on wafer edge
- Patent number 6,813,796
- Issue date Nov 9, 2004
- Chartered Semiconductor
- Sudipto Ranendra Roy
- B08 - CLEANING
Information Patent Grant
Method to improve adhesion of dielectric films in damascene interco...
- Patent number 6,797,605
- Issue date Sep 28, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Luona Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a high performance and low cost CMOS device
- Patent number 6,762,085
- Issue date Jul 13, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Jia Zhen Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal gate process: metals and their silicides
- Patent number 6,750,519
- Issue date Jun 15, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Wenhe Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using silicon rich carbide as a barrier material for fluo...
- Patent number 6,730,591
- Issue date May 4, 2004
- Chartered Semiconductor Manufactoring Ltd.
- Licheng Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using hydrogen plasma to pre-clean copper surfaces during...
- Patent number 6,720,204
- Issue date Apr 13, 2004
- Chartered Semiconductor Manufacturing Ltd.
- John Leonard Sudijono
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of application of conductive cap-layer in flip-chip, cob, an...
- Patent number 6,705,512
- Issue date Mar 16, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Kwok Keung Paul Ho
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for cleaning semiconductor structures using hydrocarbon and...
- Patent number 6,692,579
- Issue date Feb 17, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Sudipto Ranendra Roy
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Damascene structure with reduced capacitance using a boron carbon n...
- Patent number 6,690,091
- Issue date Feb 10, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to create a copper diffusion deterrent interface
- Patent number 6,683,002
- Issue date Jan 27, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to form dual metal gates by incorporating metals and their...
- Patent number 6,677,652
- Issue date Jan 13, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Wenhe Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for obtaining clean silicon surfaces for semiconductor manuf...
- Patent number 6,638,365
- Issue date Oct 28, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Jianhui Ye
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Method for forming a region of low dielectric constant nanoporous m...
- Patent number 6,602,801
- Issue date Aug 5, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Siew Yong Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for stripping copper in damascene interconnects
- Patent number 6,565,664
- Issue date May 20, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Subhash Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Methods for elimination of arsenic based defects
- Publication number 20060030095
- Publication date Feb 9, 2006
- Chartered Semiconductor Manufacturing Ltd.
- Yin-Min Felicia Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel poly(arylene ether) dielectrics
- Publication number 20050159576
- Publication date Jul 21, 2005
- Chartered Semiconductor Manufacturing Ltd.
- Christopher Lim
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Novel poly(arylene ether) dielectrics
- Publication number 20050124767
- Publication date Jun 9, 2005
- Chartered Semiconductor Manufacturing Ltd.
- Christopher Lim
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Novel poly(arylene ether) dielectrics
- Publication number 20050119420
- Publication date Jun 2, 2005
- Chartered Semiconductor Manufacturing Ltd.
- Christopher Lim
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method of copper/copper surface bonding using a conducting polymer...
- Publication number 20050112799
- Publication date May 26, 2005
- Chartered Semiconductor Manufacturing Ltd.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of copper/copper surface bonding using a conducting polymer...
- Publication number 20050090102
- Publication date Apr 28, 2005
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of copper/copper surface bonding using a conducting polymer...
- Publication number 20050090037
- Publication date Apr 28, 2005
- Chartered Semiconductor Manufacturing Ltd.
- Yakub Aliyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of copper/copper surface bonding using a conducting polymer...
- Publication number 20050090039
- Publication date Apr 28, 2005
- Chartered Semiconductor Manufacturing Ltd.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to improve adhesion of dielectric films in damascene interco...
- Publication number 20050032392
- Publication date Feb 10, 2005
- Chartered Semiconductor Manufacturing Ltd.
- Luona Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to create a copper diffusion deterrent interface
- Publication number 20040227247
- Publication date Nov 18, 2004
- CHARTERED SEMICONDUCTOR MANFACTURING LTD.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual metal gate process: metals and their silicides
- Publication number 20040217429
- Publication date Nov 4, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Wenhe Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods to form dual metal gates by incorporating metals and their...
- Publication number 20040132239
- Publication date Jul 8, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Wenhe Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods to form dual metal gates by incorporating metals and their...
- Publication number 20040132296
- Publication date Jul 8, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Wenhe Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deposition of barrier metal in damascene interconnects using metal...
- Publication number 20040082169
- Publication date Apr 29, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Simon Chooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel poly(arylene ether) dielectrics
- Publication number 20040068082
- Publication date Apr 8, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Christopher Lim
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Dual metal gate process: metals and their silicides
- Publication number 20040065930
- Publication date Apr 8, 2004
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Wenhe Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a high performance and low cost CMOS device
- Publication number 20040063264
- Publication date Apr 1, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Jia Zhen Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming gate insulating layer having multiple dielectric...
- Publication number 20040029321
- Publication date Feb 12, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Chew Hoe Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon-rich oxide for copper damascene interconnect incorporating...
- Publication number 20030235980
- Publication date Dec 25, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Liu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective & damage free Cu cleaning process for pre-dep, post etch/CMP
- Publication number 20030196989
- Publication date Oct 23, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Mei Sheng Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of using hydrogen plasma to pre-clean copper surfaces during...
- Publication number 20030192943
- Publication date Oct 16, 2003
- Chartered Semiconductor Manufacturing Ltd.
- John Leonard Sudijono
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Apparatus and methods to clean copper contamination on wafer edge
- Publication number 20030140943
- Publication date Jul 31, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Sudipto Ranendra Roy
- B08 - CLEANING
Information Patent Application
METHOD FOR FORMING A REGION OF LOW DIELECTRIC CONSTANT NANOPOROUS M...
- Publication number 20030092240
- Publication date May 15, 2003
- CHARTERED SEMICONDUCTORS MANUFACTURED LIMITED
- Siew Yong Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods to form dual metal gates by incorporating metals and their...
- Publication number 20030075766
- Publication date Apr 24, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Wenhe Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for obtaining clean silicon surfaces for semiconductor manuf...
- Publication number 20030069151
- Publication date Apr 10, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Jianhui Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of copper/copper surface bonding using a conducting polymer...
- Publication number 20030032275
- Publication date Feb 13, 2003
- Yakub Aliyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to improve adhesion of dielectric films in damascene interco...
- Publication number 20030022472
- Publication date Jan 30, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Luona Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of using silicon rich carbide as a barrier material for fluo...
- Publication number 20020164872
- Publication date Nov 7, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Licheng Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Endpoint detection and novel chemicals in copper stripping
- Publication number 20020153030
- Publication date Oct 24, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Simon Chooi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for stripping copper in damascene interconnects
- Publication number 20020115580
- Publication date Aug 22, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Subhash Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Simon Yew-Meng Chooi

Person

Patents Grantslast 30 patents

Process for predicting and reducing the corrosivity of a hydrocarbo...

Method of copper/copper surface bonding using a conducting polymer...

Methods for elimination of arsenic based defects in semiconductor d...

Silicon-rich oxide for copper damascene interconnect incorporating...

Poly(arylene ether) dielectrics

Poly(arylene ether) dielectrics

Method to improve adhesion of dielectric films in damascene interco...

Poly(arylene ether) dielectrics

Method of copper/copper surface bonding using a conducting polymer...

Dual metal gate process: metals and their silicides

Copper diffusion deterrent interface

Method of copper/copper surface bonding using a conducting polymer...

Methods to form dual metal gates by incorporating metals and their...

Poly(arylene ether) dielectrics

Methods to form dual metal gates by incorporating metals and their...

Method of copper/copper surface bonding using a conducting polymer...

Apparatus and methods to clean copper contamination on wafer edge

Method to improve adhesion of dielectric films in damascene interco...

Method of forming a high performance and low cost CMOS device

Dual metal gate process: metals and their silicides

Method of using silicon rich carbide as a barrier material for fluo...

Method of using hydrogen plasma to pre-clean copper surfaces during...

Method of application of conductive cap-layer in flip-chip, cob, an...

Method for cleaning semiconductor structures using hydrocarbon and...

Damascene structure with reduced capacitance using a boron carbon n...

Method to create a copper diffusion deterrent interface

Methods to form dual metal gates by incorporating metals and their...

Method for obtaining clean silicon surfaces for semiconductor manuf...

Method for forming a region of low dielectric constant nanoporous m...

Method for stripping copper in damascene interconnects

Patents Applicationslast 30 patents

Methods for elimination of arsenic based defects

Novel poly(arylene ether) dielectrics

Novel poly(arylene ether) dielectrics

Novel poly(arylene ether) dielectrics

Method of copper/copper surface bonding using a conducting polymer...

Method of copper/copper surface bonding using a conducting polymer...

Method of copper/copper surface bonding using a conducting polymer...

Method of copper/copper surface bonding using a conducting polymer...

Method to improve adhesion of dielectric films in damascene interco...

Method to create a copper diffusion deterrent interface

Dual metal gate process: metals and their silicides

Methods to form dual metal gates by incorporating metals and their...

Methods to form dual metal gates by incorporating metals and their...

Deposition of barrier metal in damascene interconnects using metal...

Novel poly(arylene ether) dielectrics

Dual metal gate process: metals and their silicides

Method of forming a high performance and low cost CMOS device

Method for forming gate insulating layer having multiple dielectric...

Silicon-rich oxide for copper damascene interconnect incorporating...

Selective & damage free Cu cleaning process for pre-dep, post etch/CMP

Method of using hydrogen plasma to pre-clean copper surfaces during...

Apparatus and methods to clean copper contamination on wafer edge

METHOD FOR FORMING A REGION OF LOW DIELECTRIC CONSTANT NANOPOROUS M...

Methods to form dual metal gates by incorporating metals and their...

Method for obtaining clean silicon surfaces for semiconductor manuf...

Method of copper/copper surface bonding using a conducting polymer...

Method to improve adhesion of dielectric films in damascene interco...

Method of using silicon rich carbide as a barrier material for fluo...

Endpoint detection and novel chemicals in copper stripping

Method for stripping copper in damascene interconnects