Siping Bai

Person

Zhuhai City, Guangdong, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,917,768
- Issue date Feb 27, 2024
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Microwave dielectric component and manufacturing method thereof
- Patent number 11,552,617
- Issue date Jan 10, 2023
- RICHVIEW ELECTRONICS CO., LTD.
- Zhijian Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,266,027
- Issue date Mar 1, 2022
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,032,915
- Issue date Jun 8, 2021
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 10,757,821
- Issue date Aug 25, 2020
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 10,757,820
- Issue date Aug 25, 2020
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 10,321,581
- Issue date Jun 11, 2019
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...
- Publication number 20220151081
- Publication date May 12, 2022
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROWAVE DIELECTRIC COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20210083648
- Publication date Mar 18, 2021
- RICHVIEW ELECTRONICS CO., LTD.
- Zhijian WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...
- Publication number 20200344895
- Publication date Oct 29, 2020
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...
- Publication number 20200329567
- Publication date Oct 15, 2020
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...
- Publication number 20190306991
- Publication date Oct 3, 2019
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...
- Publication number 20190239363
- Publication date Aug 1, 2019
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...
- Publication number 20180324958
- Publication date Nov 8, 2018
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Single-layer circuit board, multi-layer circuit board, and manufact...

Microwave dielectric component and manufacturing method thereof

Single-layer circuit board, multi-layer circuit board, and manufact...

Single-layer circuit board, multi-layer circuit board, and manufact...

Single-layer circuit board, multi-layer circuit board, and manufact...

Single-layer circuit board, multi-layer circuit board, and manufact...

Single-layer circuit board, multi-layer circuit board, and manufact...

Patents Applicationslast 30 patents

SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...

MICROWAVE DIELECTRIC COMPONENT AND MANUFACTURING METHOD THEREOF

SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...

SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...

SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...

SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...

SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...