Sivakumar Nagarajan

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Two material high K thermal encapsulant system
- Patent number 10,475,715
- Issue date Nov 12, 2019
- Intel Corporation
- Venmathy McMahan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of promoting adhesion between underfill and conductive bump...
- Patent number 10,115,606
- Issue date Oct 30, 2018
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluxing-encapsulant material for microelectronic packages assembled...
- Patent number 9,504,168
- Issue date Nov 22, 2016
- Intel Corporation
- Sivakumar Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of promoting adhesion between underfill and conductive bump...
- Patent number 9,330,993
- Issue date May 3, 2016
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material including block copolymer to tune coefficient of...
- Patent number 9,245,815
- Issue date Jan 26, 2016
- Intel Corporation
- Sivakumar Nagarajan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Techniques and configurations for surface treatment of an integrate...
- Patent number 8,895,365
- Issue date Nov 25, 2014
- Intel Corporation
- Suriyakala Ramalingam
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
HYBRID INTEGRATION OF BACK-END-OF-LINE LAYERS FOR DISAGGREGATED TEC...
- Publication number 20240222274
- Publication date Jul 4, 2024
- Intel Corporation
- Praneeth Kumar Akkinepally
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNABLE CAPACITOR ARRANGEMENTS IN INTEGRATED CIRCUIT PACKAGE SUBSTR...
- Publication number 20210066265
- Publication date Mar 4, 2021
- Intel Corporation
- Feras Eid
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
TWO MATERIAL HIGH K THERMAL ENCAPSULANT SYSTEM
- Publication number 20170170088
- Publication date Jun 15, 2017
- Intel Corporation
- Venmathy McMahan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED...
- Publication number 20170042043
- Publication date Feb 9, 2017
- SIVAKUMAR NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PROMOTING ADHESION BETWEEN UNDERFILL AND CONDUCTIVE BUMP...
- Publication number 20160240395
- Publication date Aug 18, 2016
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL MATERIAL INCLUDING BLOCK COPOLYMER TO TUNE COEFFICIENT OF...
- Publication number 20160099190
- Publication date Apr 7, 2016
- Intel Corporation
- Sivakumar Nagarajan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
UNDERFILL MATERIAL INCLUDING BLOCK COPOLYMER TO TUNE COEFFICIENT OF...
- Publication number 20150311134
- Publication date Oct 29, 2015
- Sivakumar Nagarajan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DIE CONNECTIONS USING DIFFERENT UNDERFILL TYPES FOR DIFFERENT REGIONS
- Publication number 20150001736
- Publication date Jan 1, 2015
- Hualiang Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PROMOTING ADHESION BETWEEN UNDERFILL AND CONDUCTIVE BUMP...
- Publication number 20140175634
- Publication date Jun 26, 2014
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES AND CONFIGURATIONS FOR SURFACE TREATMENT OF AN INTEGRATE...
- Publication number 20140061902
- Publication date Mar 6, 2014
- Suriyakala Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED...
- Publication number 20130263446
- Publication date Oct 10, 2013
- Intel Corporation
- Sivakumar Nagarajan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Sivakumar Nagarajan

Person

Patents Grantslast 30 patents

Two material high K thermal encapsulant system

Methods of promoting adhesion between underfill and conductive bump...

Fluxing-encapsulant material for microelectronic packages assembled...

Methods of promoting adhesion between underfill and conductive bump...

Underfill material including block copolymer to tune coefficient of...

Techniques and configurations for surface treatment of an integrate...

Patents Applicationslast 30 patents

HYBRID INTEGRATION OF BACK-END-OF-LINE LAYERS FOR DISAGGREGATED TEC...

TUNABLE CAPACITOR ARRANGEMENTS IN INTEGRATED CIRCUIT PACKAGE SUBSTR...

TWO MATERIAL HIGH K THERMAL ENCAPSULANT SYSTEM

FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED...

METHODS OF PROMOTING ADHESION BETWEEN UNDERFILL AND CONDUCTIVE BUMP...

UNDERFILL MATERIAL INCLUDING BLOCK COPOLYMER TO TUNE COEFFICIENT OF...

UNDERFILL MATERIAL INCLUDING BLOCK COPOLYMER TO TUNE COEFFICIENT OF...

DIE CONNECTIONS USING DIFFERENT UNDERFILL TYPES FOR DIFFERENT REGIONS

METHODS OF PROMOTING ADHESION BETWEEN UNDERFILL AND CONDUCTIVE BUMP...

TECHNIQUES AND CONFIGURATIONS FOR SURFACE TREATMENT OF AN INTEGRATE...

FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED...