So-Young Lim

Person

Gyeonggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Film for a package substrate
- Patent number 10,903,127
- Issue date Jan 26, 2021
- Samsung Electronics Co., Ltd.
- So Young Lim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Film for package substrate, semiconductor package, display device,...
- Patent number 10,699,974
- Issue date Jun 30, 2020
- Samsung Electronics Co., Ltd.
- So Young Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test pad structure, a pad structure for inspecting a semiconductor...
- Patent number 9,869,717
- Issue date Jan 16, 2018
- Samsung Electronics Co., Ltd.
- So-Young Lim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Chip on film package including distributed via plugs
- Patent number 9,437,526
- Issue date Sep 6, 2016
- Samsung Electronics Co., Ltd.
- So-Young Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip on film package and display device including the same
- Patent number 9,280,182
- Issue date Mar 8, 2016
- Samsung Electronics Co., Ltd.
- Jeong-Kyu Ha
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with interposer and method manufacturing same
- Patent number 9,059,067
- Issue date Jun 16, 2015
- Samsung Electronics Co., Ltd.
- Yun-seok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on film (COF) substrate, COF package and display device includ...
- Patent number 9,059,162
- Issue date Jun 16, 2015
- Samsung Electronics Co., Ltd.
- Jeong-Kyu Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape package
- Patent number 8,581,373
- Issue date Nov 12, 2013
- Samsung Electronics Co., Ltd.
- Dong-han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including power ball matrix and power ring ha...
- Patent number 8,502,084
- Issue date Aug 6, 2013
- Samsung Electronics Co., Ltd.
- Eun seok Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor housing package, semiconductor package structure incl...
- Patent number 8,436,462
- Issue date May 7, 2013
- Samsung Electronics Co., Ltd.
- Dong-Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test pad structure, a pad structure for inspecting a semiconductor...
- Patent number 8,384,407
- Issue date Feb 26, 2013
- Samsung Electronics Co., Ltd.
- So-Young Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for semiconductor package
- Patent number 7,936,232
- Issue date May 3, 2011
- Samsung Electronics Co., Ltd.
- Eun-seok Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for semiconductor package
- Patent number 7,760,044
- Issue date Jul 20, 2010
- Samsung Electronics Co., Ltd.
- Eun-seok Song
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIQUID CRYSTAL COMPOSITION INCLUDING CERAMIDE AND METHOD OF PREPARI...
- Publication number 20240225987
- Publication date Jul 11, 2024
- Croda Korea Ltd
- Ji Hye HAN
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
COSMETIC COMPOSITION COMPRISING CERAMIDES AND SPHINGOLIPID
- Publication number 20240173240
- Publication date May 30, 2024
- Croda Korea Ltd
- So Jung LIM
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
LIQUID CRYSTAL COMPOSITION INCLUDING CERAMIDE AND METHOD OF PREPARI...
- Publication number 20240130950
- Publication date Apr 25, 2024
- Croda Korea Ltd
- Ji Hye HAN
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
BISPECIFIC ANTIBODY SPECIFICALLY BINDING TO GPNMB AND CD3, AND USE...
- Publication number 20220135679
- Publication date May 5, 2022
- GREEN CROSS CORPORATION
- Jae Chan PARK
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
FILM FOR A PACKAGE SUBSTRATE
- Publication number 20200303270
- Publication date Sep 24, 2020
- Samsung Electronics Co., Ltd.
- So Young LIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
FILM TYPE PACKAGE AND DISPLAY APPARATUS HAVING THE SAME
- Publication number 20190371691
- Publication date Dec 5, 2019
- Samsung Electronics Co., Ltd.
- Byung Hun HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FOR PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE, DISPLAY DEVICE,...
- Publication number 20190122943
- Publication date Apr 25, 2019
- Samsung Electronics Co., Ltd.
- So Young LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20160351155
- Publication date Dec 1, 2016
- Samsung Electronics Co., Ltd.
- JIN-WOO PARK
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
TEST PAD STRUCTURE, A PAD STRUCTURE FOR INSPECTING A SEMICONDUCTOR...
- Publication number 20160334463
- Publication date Nov 17, 2016
- Samsung Electronics Co., Ltd.
- So-Young LIM
- G01 - MEASURING TESTING
Information Patent Application
CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20160162091
- Publication date Jun 9, 2016
- Samsung Electronics Co., Ltd.
- JEONG-KYU HA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DEVICE AND METHOD FOR PROVIDING POI INFORMATION USING POI GROUPING
- Publication number 20160132513
- Publication date May 12, 2016
- SK PLANET CO., LTD.
- So-Young Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP ON FILM PACKAGE INCLUDING DISTRIBUTED VIA PLUGS
- Publication number 20140327148
- Publication date Nov 6, 2014
- Samsung Electronics Co., Ltd.
- So-Young LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20140246687
- Publication date Sep 4, 2014
- Samsung Electronics Co., Ltd.
- Jeong-Kyu Ha
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Chip on Film (COF) Substrate, COF Package and Display Device Includ...
- Publication number 20140054793
- Publication date Feb 27, 2014
- Jeong-Kyu Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Test Pad Structure, A Pad Structure For Inspecting A Semiconductor...
- Publication number 20130127486
- Publication date May 23, 2013
- Samsung Electronics Co., Ltd.
- So-Young LIM
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND DISPLAY PANEL ASSEMBLY HAVING THE SAME
- Publication number 20120138968
- Publication date Jun 7, 2012
- Na-Rae Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20120126431
- Publication date May 24, 2012
- Samsung Electronics Co., Ltd.
- Yong-Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTERPOSER AND METHOD MANUFACTURING SAME
- Publication number 20120091468
- Publication date Apr 19, 2012
- Samsung Electronics Co., Ltd.
- Yun-seok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLAR CELL MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120085393
- Publication date Apr 12, 2012
- Samsung Electronics Co., Ltd.
- Young-Sang Cho
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SOLAR CELL MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120085383
- Publication date Apr 12, 2012
- Samsung Electronics Co., Ltd.
- Young-Sang Cho
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
TAPE PACKAGE
- Publication number 20120068349
- Publication date Mar 22, 2012
- Samsung Electronics Co., Ltd.
- Dong-han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Housing Package, Semiconductor Package Structure Incl...
- Publication number 20110233755
- Publication date Sep 29, 2011
- Samsung Electronics Co., Ltd.
- Dong-Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING POWER BALL MATRIX AND POWER RING HA...
- Publication number 20100276189
- Publication date Nov 4, 2010
- Samsung Electronics Co., Ltd.
- Eun seok Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR SEMICONDUCTOR PACKAGE
- Publication number 20100264524
- Publication date Oct 21, 2010
- Samsung Electronics Co., Ltd.
- Eun-seok SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Test pad structure, a pad structure for inspecting a semiconductor...
- Publication number 20090322362
- Publication date Dec 31, 2009
- Samsung Electronics Co., Ltd.,
- So-Young Lim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SUBSTRATE FOR SEMICONDUCTOR PACKAGE
- Publication number 20070285188
- Publication date Dec 13, 2007
- Samsung Electronics Co., Ltd.
- Eun-seok SONG
- H01 - BASIC ELECTRIC ELEMENTS

So-Young Lim

Person

Patents Grantslast 30 patents

Film for a package substrate

Film for package substrate, semiconductor package, display device,...

Test pad structure, a pad structure for inspecting a semiconductor...

Chip on film package including distributed via plugs

Chip on film package and display device including the same

Semiconductor device with interposer and method manufacturing same

Chip on film (COF) substrate, COF package and display device includ...

Tape package

Semiconductor package including power ball matrix and power ring ha...

Semiconductor housing package, semiconductor package structure incl...

Test pad structure, a pad structure for inspecting a semiconductor...

Substrate for semiconductor package

Substrate for semiconductor package

Patents Applicationslast 30 patents

LIQUID CRYSTAL COMPOSITION INCLUDING CERAMIDE AND METHOD OF PREPARI...

COSMETIC COMPOSITION COMPRISING CERAMIDES AND SPHINGOLIPID

LIQUID CRYSTAL COMPOSITION INCLUDING CERAMIDE AND METHOD OF PREPARI...

BISPECIFIC ANTIBODY SPECIFICALLY BINDING TO GPNMB AND CD3, AND USE...

FILM FOR A PACKAGE SUBSTRATE

FILM TYPE PACKAGE AND DISPLAY APPARATUS HAVING THE SAME

FILM FOR PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE, DISPLAY DEVICE,...

CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

TEST PAD STRUCTURE, A PAD STRUCTURE FOR INSPECTING A SEMICONDUCTOR...

CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

DEVICE AND METHOD FOR PROVIDING POI INFORMATION USING POI GROUPING

CHIP ON FILM PACKAGE INCLUDING DISTRIBUTED VIA PLUGS

CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

Chip on Film (COF) Substrate, COF Package and Display Device Includ...

Test Pad Structure, A Pad Structure For Inspecting A Semiconductor...

SEMICONDUCTOR PACKAGE AND DISPLAY PANEL ASSEMBLY HAVING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE WITH INTERPOSER AND METHOD MANUFACTURING SAME

SOLAR CELL MODULE AND METHOD OF MANUFACTURING THE SAME

SOLAR CELL MODULE AND METHOD OF MANUFACTURING THE SAME

TAPE PACKAGE

Semiconductor Housing Package, Semiconductor Package Structure Incl...

SEMICONDUCTOR PACKAGE INCLUDING POWER BALL MATRIX AND POWER RING HA...

SUBSTRATE FOR SEMICONDUCTOR PACKAGE

Test pad structure, a pad structure for inspecting a semiconductor...

SUBSTRATE FOR SEMICONDUCTOR PACKAGE