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Sonbol Vaziri
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Salt Lake City, UT, US
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Patent Application
RELIABLE WAFER-LEVEL CHIP-SCALE SOLDER BUMP STRUCTURE
Publication number
20100117231
Publication date
May 13, 2010
Dennis Lang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
RELIABLE WAFER-LEVEL CHIP-SCALE PACKAGE SOLDER BUMP STRUCTURE IN A...
Publication number
20080054461
Publication date
Mar 6, 2008
Dennis Lang
H01 - BASIC ELECTRIC ELEMENTS