Song-Bor Lee

Person

Zhubei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor devices and semiconductor dev...
- Patent number 12,040,381
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Yi Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,990,510
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Yi Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package component with stepped passivation layer
- Patent number 11,961,762
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layers for semiconductor devices
- Patent number 11,929,422
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yi Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer structures for semiconductor devices
- Patent number 11,881,530
- Issue date Jan 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yi Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core-shell nanostructures for semiconductor devices
- Patent number 11,824,089
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yi Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layers for semiconductor devices
- Patent number 11,695,055
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yi Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and semiconductor dev...
- Patent number 11,621,343
- Issue date Apr 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Yi Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package component with stepped passivation layer
- Patent number 11,450,567
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer structures for semiconductor devices
- Patent number 11,233,149
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Yi Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core-shell nanostructures for semiconductor devices
- Patent number 11,233,119
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Yi Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 11,101,360
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yi Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,075,269
- Issue date Jul 27, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yi Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and semiconductor dev...
- Patent number 11,069,791
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yi Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having thinner gate dielectric and method of making
- Patent number 9,666,483
- Issue date May 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer back side processing structure and apparatus
- Patent number 9,443,721
- Issue date Sep 13, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chien Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 9,406,559
- Issue date Aug 2, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-Wei Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer back side processing structure and apparatus
- Patent number 9,123,673
- Issue date Sep 1, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chien Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for designing an integrated circuit layout hav...
- Patent number 9,122,828
- Issue date Sep 1, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Yu Chiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and system for enhanced integrated circuit layout
- Patent number 9,009,639
- Issue date Apr 14, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chiang Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Guard ring for through vias
- Patent number 8,890,293
- Issue date Nov 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming through-silicon vias
- Patent number 7,825,024
- Issue date Nov 2, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuan-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...
- Publication number 20240322011
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yi PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240282820
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yi PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivation Layers For Semiconductor Devices
- Publication number 20240243184
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yi PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPONENT WITH STEPPED PASSIVATION LAYER
- Publication number 20240222194
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230411279
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Liang-Hsuan PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Core-Shell Nanostructures For Semiconductor Devices
- Publication number 20230411455
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Yi PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER STRUCTURES FOR SEMICONDUCTOR DEVICES
- Publication number 20230387302
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Yi PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...
- Publication number 20230307522
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yi PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Component with Stepped Passivation Layer
- Publication number 20220336276
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE-SHELL NANOSTRUCTURES FOR SEMICONDUCTOR DEVICES
- Publication number 20220149155
- Publication date May 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Yi PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spacer Structures for Semiconductor Devices
- Publication number 20220149178
- Publication date May 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Yi PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Component with Stepped Passivation Layer
- Publication number 20210375675
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210359085
- Publication date Nov 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yi PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...
- Publication number 20210351282
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yi PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION LAYERS FOR SEMICONDUCTOR DEVICES
- Publication number 20210280486
- Publication date Sep 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Yi PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spacer Structures for Semiconductor Devices
- Publication number 20210280716
- Publication date Sep 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Yi PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE-SHELL NANOSTRUCTURES FOR SEMICONDUCTOR DEVICES
- Publication number 20210273050
- Publication date Sep 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Yi PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200176566
- Publication date Jun 4, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Yi PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
- Publication number 20200168716
- Publication date May 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Yi PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...
- Publication number 20200135891
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Yi PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20160005650
- Publication date Jan 7, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Han-Wei YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Back Side Processing Structure and Apparatus
- Publication number 20150357186
- Publication date Dec 10, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chien Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR ENHANCED INTEGRATED CIRCUIT LAYOUT
- Publication number 20150020041
- Publication date Jan 15, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chiang HUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS AND METHOD FOR DESIGNING AN INTEGRATED CIRCUIT LAYOUT HA...
- Publication number 20140344770
- Publication date Nov 20, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Yu CHIANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Wafer Back Side Processing Structure and Apparatus
- Publication number 20140273508
- Publication date Sep 18, 2014
- Cheng-Chien Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING THINNER GATE DIELECTRIC AND METHOD OF MAKING
- Publication number 20130207200
- Publication date Aug 15, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hung LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Guard Ring for Through Vias
- Publication number 20130154048
- Publication date Jun 20, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Through-Silicon Vias
- Publication number 20100130003
- Publication date May 27, 2010
- Chuan-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and methods for inspection control
- Publication number 20060178767
- Publication date Aug 10, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Song-Bor Lee
- G06 - COMPUTING CALCULATING COUNTING

Song-Bor Lee

Person

Patents Grantslast 30 patents

Method of manufacturing semiconductor devices and semiconductor dev...

Semiconductor device and manufacturing method thereof

Package component with stepped passivation layer

Passivation layers for semiconductor devices

Spacer structures for semiconductor devices

Core-shell nanostructures for semiconductor devices

Passivation layers for semiconductor devices

Method of manufacturing semiconductor devices and semiconductor dev...

Package component with stepped passivation layer

Spacer structures for semiconductor devices

Core-shell nanostructures for semiconductor devices

Method of manufacturing a semiconductor device and a semiconductor...

Semiconductor device and manufacturing method thereof

Method of manufacturing semiconductor devices and semiconductor dev...

Integrated circuit having thinner gate dielectric and method of making

Wafer back side processing structure and apparatus

Semiconductor structure and method for forming the same

Wafer back side processing structure and apparatus

Apparatus and method for designing an integrated circuit layout hav...

Method and system for enhanced integrated circuit layout

Guard ring for through vias

Method of forming through-silicon vias

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Passivation Layers For Semiconductor Devices

PACKAGE COMPONENT WITH STEPPED PASSIVATION LAYER

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

Core-Shell Nanostructures For Semiconductor Devices

SPACER STRUCTURES FOR SEMICONDUCTOR DEVICES

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...

Package Component with Stepped Passivation Layer

CORE-SHELL NANOSTRUCTURES FOR SEMICONDUCTOR DEVICES

Spacer Structures for Semiconductor Devices

Package Component with Stepped Passivation Layer

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...

PASSIVATION LAYERS FOR SEMICONDUCTOR DEVICES

Spacer Structures for Semiconductor Devices

CORE-SHELL NANOSTRUCTURES FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

Wafer Back Side Processing Structure and Apparatus

METHOD AND SYSTEM FOR ENHANCED INTEGRATED CIRCUIT LAYOUT

APPARATUS AND METHOD FOR DESIGNING AN INTEGRATED CIRCUIT LAYOUT HA...

Wafer Back Side Processing Structure and Apparatus

INTEGRATED CIRCUIT HAVING THINNER GATE DIELECTRIC AND METHOD OF MAKING

Guard Ring for Through Vias

Method of Forming Through-Silicon Vias

Systems and methods for inspection control