Song-Hua Shi

Person

Atlanta, GA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic assemblies and systems with filled no-flow underfill
- Patent number 7,498,678
- Issue date Mar 3, 2009
- Intel Corporation
- Carlos A. Gonzalez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip system and method of making same
- Patent number 7,470,564
- Issue date Dec 30, 2008
- Intel Corporation
- Song-Hua Shi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Temperature sustaining flip chip assembly process
- Patent number 7,391,119
- Issue date Jun 24, 2008
- Intel Corporation
- Song-Hua Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assemblies with filled no-flow underfill
- Patent number 7,323,360
- Issue date Jan 29, 2008
- Intel Corporation
- Carlos A. Gonzalez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material to reduce ball limiting metallurgy delamination...
- Patent number 7,218,007
- Issue date May 15, 2007
- Intel Corporation
- Song-Hua Shi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Microelectronic or optoelectronic package having a polybenzoxazine-...
- Patent number 7,179,684
- Issue date Feb 20, 2007
- Intel Corporation
- Song-Hua Shi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Chip bonding heater with differential heat transfer
- Patent number 7,176,422
- Issue date Feb 13, 2007
- Intel Corporation
- Song-Hua Shi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Guided heating apparatus and method for using the same
- Patent number 7,145,120
- Issue date Dec 5, 2006
- Intel Corporation
- Song-Hua Shi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip bonding heater with differential heat transfer
- Patent number 6,940,053
- Issue date Sep 6, 2005
- Intel Corporation
- Song-Hua Shi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temperature sustaining flip chip assembly process
- Patent number 6,902,954
- Issue date Jun 7, 2005
- Intel Corporation
- Song-Hua Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic or optoelectronic package having a polybenzoxazine-...
- Patent number 6,899,960
- Issue date May 31, 2005
- Intel Corporation
- Song-Hua Shi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Guided heating apparatus and method for using the same
- Patent number 6,794,623
- Issue date Sep 21, 2004
- Intel Corporation
- Song-Hua Shi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
No-flow underfill material
- Patent number 6,794,761
- Issue date Sep 21, 2004
- Intel Corporation
- Song-Hua Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preparing an oligonucleotide array
- Patent number 6,790,613
- Issue date Sep 14, 2004
- Amersham Biosciences AB
- Song Shi
- F26 - DRYING
Information Patent Grant
Process and material for low-cost flip-chip solder interconnect str...
- Patent number 6,746,896
- Issue date Jun 8, 2004
- Georgia Tech Research Corp.
- Song-Hua Shi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polybenzoxazine based wafer-level underfill material
- Patent number 6,730,542
- Issue date May 4, 2004
- Intel Corporation
- Lejun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polybenzoxazine based wafer-level underfill material
- Patent number 6,727,594
- Issue date Apr 27, 2004
- Intel Corporation
- Lejun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill process for flip-chip device
- Patent number 6,703,299
- Issue date Mar 9, 2004
- Intel Corporation
- Song-Hua Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for enhanced bio-conjugation events
- Patent number 6,602,400
- Issue date Aug 5, 2003
- Motorola, Inc.
- Vi-En Choong
- G01 - MEASURING TESTING
Information Patent Grant
Electrochemical detection of single base extension
- Patent number 6,518,024
- Issue date Feb 11, 2003
- Motorola, Inc.
- Vi-En Choong
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Method for characterization and quality control of porous media
- Patent number 6,365,415
- Issue date Apr 2, 2002
- Motorola Inc.
- Changming Li
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Organic electroluminescent apparatus
- Patent number 6,362,566
- Issue date Mar 26, 2002
- Motorola, Inc.
- Ji-Hai Xu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Organic thin film transistor with enhanced carrier mobility
- Patent number 6,326,640
- Issue date Dec 4, 2001
- Motorola, Inc.
- Song Q. Shi
- G02 - OPTICS
Information Patent Grant
Organic electroluminescent device with improved reliability
- Patent number 6,194,089
- Issue date Feb 27, 2001
- Motorola, Inc.
- Vi-en Choong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
No-flow underfill of epoxy resin, anhydride, fluxing agent and surf...
- Patent number 6,180,696
- Issue date Jan 30, 2001
- Georgia Tech Research Corporation
- Ching-Ping Wong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Organic electroluminescent apparatus with mircrocavity
- Patent number 6,140,764
- Issue date Oct 31, 2000
- Motorola, Inc.
- Ji-Hai Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic electroluminescent device with continuous organic medium
- Patent number 6,130,001
- Issue date Oct 10, 2000
- Motorola, Inc.
- Song Q. Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic electroluminescent display device and method of fabrication
- Patent number 6,107,736
- Issue date Aug 22, 2000
- Motorola, Inc.
- Song Q. Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organometallic complexes for use in light emitting devices
- Patent number 6,083,634
- Issue date Jul 4, 2000
- Motorola, Inc.
- Song Q. Shi
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Multicolored organic electroluminescent display
- Patent number 6,084,347
- Issue date Jul 4, 2000
- Motorola, Inc.
- Ji-Hai Xu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC ASSEMBLIES AND SYSTEMS WITH FILLED NO-FLOW UNDERFILL
- Publication number 20070278655
- Publication date Dec 6, 2007
- Intel Corporation
- Carlos A. Gonzalez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic or optoelectronic package having a polybenzoxazine-...
- Publication number 20070117263
- Publication date May 24, 2007
- Song-Hua Shi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Underfill material to reduce ball limiting metallurgy delamination...
- Publication number 20060071337
- Publication date Apr 6, 2006
- Song-Hua Shi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Chip bonding heater with differential heat transfer
- Publication number 20050230817
- Publication date Oct 20, 2005
- Song-Hua Shi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Underfill system for die-over-die arrangements
- Publication number 20050196907
- Publication date Sep 8, 2005
- Glenn Ratificar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic or optoelectronic package having a polybenzoxazine-...
- Publication number 20050196906
- Publication date Sep 8, 2005
- Song-Hua Shi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Temperature sustaining flip chip assembly process
- Publication number 20050121762
- Publication date Jun 9, 2005
- Song-Hua Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip bonding heater with differential heat transfer
- Publication number 20050103774
- Publication date May 19, 2005
- Song-Hua Shi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
System to couple integrated circuit die to substrate
- Publication number 20050095744
- Publication date May 5, 2005
- Song-Hua Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Guided heating apparatus and method for using the same
- Publication number 20050035113
- Publication date Feb 17, 2005
- Song-Hua Shi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic assembly having a die with rounded corner edge portions...
- Publication number 20050017371
- Publication date Jan 27, 2005
- Zhiyong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Temperature sustaining flip chip assembly process
- Publication number 20040187306
- Publication date Sep 30, 2004
- Song-Hua Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill process for flip-chip device
- Publication number 20040159945
- Publication date Aug 19, 2004
- Intel Corporation
- Song-Hua Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-chip system and method of making same
- Publication number 20040082107
- Publication date Apr 29, 2004
- Intel Corporation
- Song-Hua Shi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Methods and compositions relating to electrical detection of nuclei...
- Publication number 20030209432
- Publication date Nov 13, 2003
- Vi-En Choong
- C40 - COMBINATORIAL CHEMISTRY
Information Patent Application
Microelectronic or optoelectronic package having a polybenzoxazine-...
- Publication number 20030190477
- Publication date Oct 9, 2003
- Song-Hua Shi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Polybenzoxazine based wafer-level underfill material
- Publication number 20030137043
- Publication date Jul 24, 2003
- Lejun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polybenzoxazine based wafer-level underfill material
- Publication number 20030122241
- Publication date Jul 3, 2003
- Lejun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill process for flip-chip device
- Publication number 20030116864
- Publication date Jun 26, 2003
- Intel Corporation
- Song-Hua Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrochemical detection of single base extension
- Publication number 20030096283
- Publication date May 22, 2003
- Motorola Inc, A Corporation of the State of Delaware
- Vi-En Choong
- G01 - MEASURING TESTING
Information Patent Application
Guided heating apparatus and method for using the same
- Publication number 20030089705
- Publication date May 15, 2003
- Song-Hua Shi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic assembly with filled no-flow underfill and methods of ma...
- Publication number 20030080437
- Publication date May 1, 2003
- Intel Corporation
- Carlos A. Gonzalez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Siloxirane based no-flow underfill material
- Publication number 20020190370
- Publication date Dec 19, 2002
- Song-Hua Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High density column and row addressable electrode arrays
- Publication number 20020090649
- Publication date Jul 11, 2002
- Tony Chan
- B82 - NANO-TECHNOLOGY
Information Patent Application
ELECTROCHEMICAL DETECTION OF SINGLE BASE EXTENSION
- Publication number 20020064775
- Publication date May 30, 2002
- VI-EN CHOONG
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
REPORTERLESS GENOSENSORS USING ELECTRICAL DETECTION METHODS
- Publication number 20020051975
- Publication date May 2, 2002
- CHANGMING LI
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
ORGANIC ELECTROLUMINESCENT APPARATUS
- Publication number 20020011780
- Publication date Jan 31, 2002
- JI-HAI XU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Organic electroluminescent device with enhanced performance
- Publication number 20010009690
- Publication date Jul 26, 2001
- Vi-en Choong
- H01 - BASIC ELECTRIC ELEMENTS

Song-Hua Shi

Person

Patents Grantslast 30 patents

Electronic assemblies and systems with filled no-flow underfill

Flip-chip system and method of making same

Temperature sustaining flip chip assembly process

Electronic assemblies with filled no-flow underfill

Underfill material to reduce ball limiting metallurgy delamination...

Microelectronic or optoelectronic package having a polybenzoxazine-...

Chip bonding heater with differential heat transfer

Guided heating apparatus and method for using the same

Chip bonding heater with differential heat transfer

Temperature sustaining flip chip assembly process

Microelectronic or optoelectronic package having a polybenzoxazine-...

Guided heating apparatus and method for using the same

No-flow underfill material

Method of preparing an oligonucleotide array

Process and material for low-cost flip-chip solder interconnect str...

Polybenzoxazine based wafer-level underfill material

Polybenzoxazine based wafer-level underfill material

Underfill process for flip-chip device

Method for enhanced bio-conjugation events

Electrochemical detection of single base extension

Method for characterization and quality control of porous media

Organic electroluminescent apparatus

Organic thin film transistor with enhanced carrier mobility

Organic electroluminescent device with improved reliability

No-flow underfill of epoxy resin, anhydride, fluxing agent and surf...

Organic electroluminescent apparatus with mircrocavity

Organic electroluminescent device with continuous organic medium

Organic electroluminescent display device and method of fabrication

Organometallic complexes for use in light emitting devices

Multicolored organic electroluminescent display

Patents Applicationslast 30 patents

ELECTRONIC ASSEMBLIES AND SYSTEMS WITH FILLED NO-FLOW UNDERFILL

Microelectronic or optoelectronic package having a polybenzoxazine-...

Underfill material to reduce ball limiting metallurgy delamination...

Chip bonding heater with differential heat transfer

Underfill system for die-over-die arrangements

Microelectronic or optoelectronic package having a polybenzoxazine-...

Temperature sustaining flip chip assembly process

Chip bonding heater with differential heat transfer

System to couple integrated circuit die to substrate

Guided heating apparatus and method for using the same

Electronic assembly having a die with rounded corner edge portions...

Temperature sustaining flip chip assembly process

Underfill process for flip-chip device

Flip-chip system and method of making same

Methods and compositions relating to electrical detection of nuclei...

Microelectronic or optoelectronic package having a polybenzoxazine-...

Polybenzoxazine based wafer-level underfill material

Polybenzoxazine based wafer-level underfill material

Underfill process for flip-chip device

Electrochemical detection of single base extension

Guided heating apparatus and method for using the same

Electronic assembly with filled no-flow underfill and methods of ma...

Siloxirane based no-flow underfill material

High density column and row addressable electrode arrays

ELECTROCHEMICAL DETECTION OF SINGLE BASE EXTENSION

REPORTERLESS GENOSENSORS USING ELECTRICAL DETECTION METHODS

ORGANIC ELECTROLUMINESCENT APPARATUS

Organic electroluminescent device with enhanced performance