Claims
- 1. A method comprising:
placing a semiconductor wafer at a dispensing mechanism; and introducing an underfill material to a surface of said semiconductor wafer at said dispensing mechanism to form a coating thereat, said underfill material being a polybenzoxazine based underfill material.
- 2. The method of claim 1 further comprising reducing a viscosity of said underfill material by heating prior to said introducing.
- 3. The method of claim 1 wherein the introducing employs one of a meniscus coating technique and a stencil printing technique.
- 4. The method of claim 1 wherein the introducing comprises placing said semiconductor wafer on a spinning mechanism to rotate said semiconductor wafer.
- 5. The method of claim 4 further comprising rotating said semiconductor wafer during said introducing.
- 6. The method of claim 4 further comprising rotating said semiconductor wafer after beginning and introducing.
- 7. The method of claim 1 wherein said semiconductor wafer includes a conductive mechanism at said surface and said coating is of a thickness greater than a height of said conductive mechanism.
- 8. The method of claim 7 wherein said conductive mechanism comprises conductive bumps, said thickness of said coating up to about 50 microns greater than said height of said conductive bumps.
- 9. The method of claim 1 further comprising heating said semiconductor wafer to a temperature above room temperature prior to said introducing.
- 10. The method of claim 9 wherein at least one property of said polybenzoxazine based underfill material is a factor in establishing one of a rate of said introducing, a time to begin said rotating relative to said introducing, a rate of said rotating, a duration of said rotating, and said temperature above room temperature.
- 11. A method comprising:
placing a semiconductor wafer at a sawing apparatus, said semiconductor wafer having a coating of polybenzoxazine based underfill material at a surface thereof; and sawing said semiconductor wafer into individual chips with said sawing apparatus.
- 12. The method of claim 11 further comprising placing wafer tape on said coating prior to said sawing.
- 13. A method comprising:
placing a semiconductor wafer at a dispensing mechanism; introducing an underfill material to a surface of said semiconductor wafer at said dispensing mechanism to form a coating thereat, said underfill material being a polybenzoxazine based underfill material; and sawing said semiconductor wafer into individual chips.
- 14. The method of claim 13 further comprising placing a chip of said chips at a surface of a package substrate.
- 15. The method of claim 14 further comprising curing said polybenzoxazine based underfill material by heating to physically couple said chip to said package substrate.
- 16. The method of claim 14 further comprising heating conductive bumps of said chip to cause a flux of said conductive bumps onto bond pads of said package substrate to electrically couple said chip to said package substrate.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This is a divisional of co-pending application Ser. No. 10/038,710, filed Jan. 2, 2002, and claims the priority of that filing date.
Divisions (1)
|
Number |
Date |
Country |
Parent |
10038710 |
Jan 2002 |
US |
Child |
10339982 |
Jan 2003 |
US |