Soo Doo Chae

Person

Guilderland, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fabricating three-dimensional semiconductor structures
- Patent number 12,193,231
- Issue date Jan 7, 2025
- Tokyo Electron Limited
- Soo Doo Chae
Information Patent Grant
Stress relief in semiconductor wafers
- Patent number 11,990,425
- Issue date May 21, 2024
- Tokyo Electron Limited
- Hojin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extreme ultraviolet lithography patterning method
- Patent number 11,915,931
- Issue date Feb 27, 2024
- Tokyo Electron Limited
- Choong-man Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Raised pad formations for contacts in three-dimensional structures...
- Patent number 11,380,697
- Issue date Jul 5, 2022
- Tokyo Electron Limited
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma treatment method to enhance surface adhesion for lithography
- Patent number 11,243,465
- Issue date Feb 8, 2022
- Tokyo Electron Limited
- Wanjae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition process
- Patent number 10,978,307
- Issue date Apr 13, 2021
- Tokyo Electron Limited
- David O'Meara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming the same
- Patent number 10,923,392
- Issue date Feb 16, 2021
- Tokyo Electron Limited
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device
- Patent number 10,916,561
- Issue date Feb 9, 2021
- Tokyo Electron Limited
- Karthik Pillai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective atomic layer deposition (ALD) of protective caps to enhan...
- Patent number 10,770,294
- Issue date Sep 8, 2020
- Tokyo Electron Limited
- David O'Meara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of integrated circuit fabrication with dual metal power rail
- Patent number 10,580,691
- Issue date Mar 3, 2020
- Tokyo Electron Limited
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming the same
- Patent number 10,541,174
- Issue date Jan 21, 2020
- Tokyo Electron Limited
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a self-aligned contact using selective SiO2 depos...
- Patent number 10,453,749
- Issue date Oct 22, 2019
- Tokyo Electron Limited
- Kandabara N. Tapily
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for high throughput using beam scan size and beam position i...
- Patent number 10,256,095
- Issue date Apr 9, 2019
- TEL Epion Inc.
- Soo Doo Chae
- G05 - CONTROLLING REGULATING
Information Patent Grant
Wrap-around contact integration scheme
- Patent number 10,217,670
- Issue date Feb 26, 2019
- Tokyo Electron Limited
- Kandabara N. Tapily
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of surface profile correction using gas cluster ion beam
- Patent number 9,875,947
- Issue date Jan 23, 2018
- TEL Epion Inc.
- Noel Russell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewall spacer patterning method using gas cluster ion beam
- Patent number 9,500,946
- Issue date Nov 22, 2016
- TEL Epion Inc.
- Soo Doo Chae
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and methods for implementing predicted systematic error c...
- Patent number 9,123,505
- Issue date Sep 1, 2015
- TEL Epion Inc.
- Vincent Lagana-Gizzo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES WITH HYBRID BONDING LAYERS AND PROCESS OF MAK...
- Publication number 20240363564
- Publication date Oct 31, 2024
- TOKYO ELECTRON LIMITED
- Soo Doo CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING SEMICONDUCTOR DEVICES WITH BACKSIDE POWER D...
- Publication number 20240258169
- Publication date Aug 1, 2024
- TOKYO ELECTRON LIMITED
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTREME ULTRAVIOLET LITHOGRAPHY PATTERNING METHOD
- Publication number 20240153773
- Publication date May 9, 2024
- TOKYO ELECTRONIC LIMITED
- Choong-Man Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURES
- Publication number 20240147719
- Publication date May 2, 2024
- TOKYO ELECTRON LIMITED
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING ISOLATION STRUCTURES USING DIRECTIONAL BEAM...
- Publication number 20240145312
- Publication date May 2, 2024
- TOKYO ELECTRON LIMITED
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEXT GENERATION BONDING LAYER FOR 3D HETEROGENEOUS INTEGRATION
- Publication number 20240071984
- Publication date Feb 29, 2024
- TOKYO ELECTRON LIMITED
- Kandabara Tapily
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR FORMING SEMICONDUCTOR DEVICES WITH ISOLATION STRUCTURES
- Publication number 20240071808
- Publication date Feb 29, 2024
- TOKYO ELECTRON LIMITED
- Hojin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR FABRICATING A VERTICAL DRAM STRUCTURE
- Publication number 20230255014
- Publication date Aug 10, 2023
- TOKYO ELECTRON LIMITED
- Sang Cheol Han
- G11 - INFORMATION STORAGE
Information Patent Application
TECHNOLOGIES FOR FABRICATING A 3D MEMORY STRUCTURE
- Publication number 20230133927
- Publication date May 4, 2023
- TOKYO ELECTRON LIMITED
- Sang Cheol Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD USING SELECTIVE DEPOSITION AND SURFACE TREATMENT
- Publication number 20230075263
- Publication date Mar 9, 2023
- TOKYO ELECTRON LIMITED
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Extreme Ultraviolet Lithography Patterning Method
- Publication number 20230054125
- Publication date Feb 23, 2023
- TOKYO ELECTRON LIMITED
- Choong-man Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RAISED PAD FORMATIONS FOR CONTACTS IN THREE-DIMENSIONAL STRUCTURES...
- Publication number 20220246626
- Publication date Aug 4, 2022
- TOKYO ELECTRON LIMITED
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURES
- Publication number 20220115399
- Publication date Apr 14, 2022
- TOKYO ELECTRON LIMITED
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Relief in Semiconductor Wafers
- Publication number 20220102289
- Publication date Mar 31, 2022
- TOKYO ELECTRON LIMITED
- Hojin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STRUCTURES FOR MICROELECTRONIC WORKPIECES
- Publication number 20210288069
- Publication date Sep 16, 2021
- TOKYO ELECTRON LIMITED
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RAISED PAD FORMATIONS FOR CONTACTS IN THREE-DIMENSIONAL STRUCTURES...
- Publication number 20210265369
- Publication date Aug 26, 2021
- TOKYO ELECTRON LIMITED
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION PROCESS
- Publication number 20210057226
- Publication date Feb 25, 2021
- TOKYO ELECTRON LIMITED
- David O'Meara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20200006129
- Publication date Jan 2, 2020
- TOKYO ELECTRON LIMITED
- Soo Doo CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ATOMIC LAYER DEPOSITION (ALD) OF PROTECTIVE CAPS TO ENHAN...
- Publication number 20190393035
- Publication date Dec 26, 2019
- TOKYO ELECTRON LIMITED
- David O'Meara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20190304995
- Publication date Oct 3, 2019
- TOKYO ELECTRON LIMITED
- Karthik Pillai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROTECTING COBALT PLUGS
- Publication number 20190259650
- Publication date Aug 22, 2019
- TOKYO ELECTRON LIMITED
- Sang Cheol Han
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma Treatment Method To Enhance Surface Adhesion For Lithography
- Publication number 20190187556
- Publication date Jun 20, 2019
- TOKYO ELECTRON LIMITED
- Wanjae Park
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF INTEGRATED CIRCUIT FABRICATION WITH DUAL METAL POWER RAIL
- Publication number 20180350665
- Publication date Dec 6, 2018
- TOKYO ELECTRON LIMITED
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SELF-ALIGNED CONTACT USING SELECTIVE SiO2 DEPOS...
- Publication number 20180233407
- Publication date Aug 16, 2018
- TOKYO ELECTRON LIMITED
- Kandabara N. Tapily
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20180211870
- Publication date Jul 26, 2018
- Soo Doo CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WRAP-AROUND CONTACT INTEGRATION SCHEME
- Publication number 20180068899
- Publication date Mar 8, 2018
- TOKYO ELECTRON LIMITED
- Kandabara N. Tapily
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR HIGH THROUGHPUT USING BEAM SCAN SIZE AND BEAM POSITION I...
- Publication number 20170077001
- Publication date Mar 16, 2017
- TEL Epion Inc.
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SURFACE PROFILE CORRECTION USING GAS CLUSTER ION BEAM
- Publication number 20160322266
- Publication date Nov 3, 2016
- TEL Epion Inc.
- Noel Russell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDEWALL SPACER PATTERNING METHOD USING GAS CLUSTER ION BEAM
- Publication number 20160222521
- Publication date Aug 4, 2016
- TEL Epion Inc.
- Soo Doo Chae
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND METHODS FOR IMPLEMENTING PREDICTED SYSTEMATIC ERROR C...
- Publication number 20150243476
- Publication date Aug 27, 2015
- TEL Epion Inc.
- Vincent Lagana-Gizzo
- H01 - BASIC ELECTRIC ELEMENTS

Soo Doo Chae

Person

Patents Grantslast 30 patents

Fabricating three-dimensional semiconductor structures

Stress relief in semiconductor wafers

Extreme ultraviolet lithography patterning method

Raised pad formations for contacts in three-dimensional structures...

Plasma treatment method to enhance surface adhesion for lithography

Deposition process

Interconnect structure and method of forming the same

Method of fabricating semiconductor device

Selective atomic layer deposition (ALD) of protective caps to enhan...

Method of integrated circuit fabrication with dual metal power rail

Interconnect structure and method of forming the same

Method of forming a self-aligned contact using selective SiO2 depos...

Method for high throughput using beam scan size and beam position i...

Wrap-around contact integration scheme

Method of surface profile correction using gas cluster ion beam

Sidewall spacer patterning method using gas cluster ion beam

Apparatus and methods for implementing predicted systematic error c...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES WITH HYBRID BONDING LAYERS AND PROCESS OF MAK...

METHODS FOR FABRICATING SEMICONDUCTOR DEVICES WITH BACKSIDE POWER D...

EXTREME ULTRAVIOLET LITHOGRAPHY PATTERNING METHOD

FABRICATING THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURES

METHODS FOR FABRICATING ISOLATION STRUCTURES USING DIRECTIONAL BEAM...

NEXT GENERATION BONDING LAYER FOR 3D HETEROGENEOUS INTEGRATION

METHODS FOR FORMING SEMICONDUCTOR DEVICES WITH ISOLATION STRUCTURES

TECHNOLOGIES FOR FABRICATING A VERTICAL DRAM STRUCTURE

TECHNOLOGIES FOR FABRICATING A 3D MEMORY STRUCTURE

WAFER BONDING METHOD USING SELECTIVE DEPOSITION AND SURFACE TREATMENT

Extreme Ultraviolet Lithography Patterning Method

RAISED PAD FORMATIONS FOR CONTACTS IN THREE-DIMENSIONAL STRUCTURES...

FABRICATING THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURES

Stress Relief in Semiconductor Wafers

THREE-DIMENSIONAL STRUCTURES FOR MICROELECTRONIC WORKPIECES

RAISED PAD FORMATIONS FOR CONTACTS IN THREE-DIMENSIONAL STRUCTURES...

DEPOSITION PROCESS

INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

SELECTIVE ATOMIC LAYER DEPOSITION (ALD) OF PROTECTIVE CAPS TO ENHAN...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

METHOD FOR PROTECTING COBALT PLUGS

Plasma Treatment Method To Enhance Surface Adhesion For Lithography

METHOD OF INTEGRATED CIRCUIT FABRICATION WITH DUAL METAL POWER RAIL

METHOD OF FORMING A SELF-ALIGNED CONTACT USING SELECTIVE SiO2 DEPOS...

INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

WRAP-AROUND CONTACT INTEGRATION SCHEME

METHOD FOR HIGH THROUGHPUT USING BEAM SCAN SIZE AND BEAM POSITION I...

METHOD OF SURFACE PROFILE CORRECTION USING GAS CLUSTER ION BEAM

SIDEWALL SPACER PATTERNING METHOD USING GAS CLUSTER ION BEAM

APPARATUS AND METHODS FOR IMPLEMENTING PREDICTED SYSTEMATIC ERROR C...