Soo Gil Park

Person

Radebeul, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Die configurations and methods of manufacture
- Patent number 7,476,980
- Issue date Jan 13, 2009
- Infineon Technologies AG
- Kenneth Rebibis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Lamination Tape for Reducing Chip Warpage and Semiconductor Device...
- Publication number 20090218703
- Publication date Sep 3, 2009
- Soo Gil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT
- Publication number 20090032946
- Publication date Feb 5, 2009
- Soo Gil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die configurations and methods of manufacture
- Publication number 20070298603
- Publication date Dec 27, 2007
- Kenneth Rebibis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating a BGA device and BGA device
- Publication number 20070224779
- Publication date Sep 27, 2007
- Soo Gil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing semiconductor components
- Publication number 20070216038
- Publication date Sep 20, 2007
- Soo Gil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Anti-warp heat spreader for semiconductor devices
- Publication number 20070001291
- Publication date Jan 4, 2007
- Infineon Technologies AG
- Soo Gil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method for an electronic component assembly and corre...
- Publication number 20060270109
- Publication date Nov 30, 2006
- Stephan Blaszczak
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Substrate for producing a soldering connection to a second substrate
- Publication number 20060237855
- Publication date Oct 26, 2006
- Steffen Kroehnert
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Soo Gil Park

Person

Patents Grantslast 30 patents

Die configurations and methods of manufacture

Patents Applicationslast 30 patents

Lamination Tape for Reducing Chip Warpage and Semiconductor Device...

INTEGRATED CIRCUIT

Die configurations and methods of manufacture

Method for fabricating a BGA device and BGA device

Method for producing semiconductor components

Anti-warp heat spreader for semiconductor devices

Manufacturing method for an electronic component assembly and corre...

Substrate for producing a soldering connection to a second substrate