Soon Lock Goh

Person

Bukit Platu Mutiara, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing a package using plateable encapsulant
- Patent number 11,081,417
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Sook Woon Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package having an optical inspection feature
- Patent number 10,431,560
- Issue date Oct 1, 2019
- Infineon Technologies AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with plateable encapsulant and a method for m...
- Patent number 10,396,007
- Issue date Aug 27, 2019
- Infineon Technologies AG
- Sook Woon Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Embedding additive particles in encapsulant of electronic device
- Patent number 9,852,918
- Issue date Dec 26, 2017
- Infineon Technologies AG
- Peh Hean Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing molded semiconductor packages having an opt...
- Patent number 9,806,043
- Issue date Oct 31, 2017
- Infineon Technologies AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Primer composition, method of forming a primer layer on a semicondu...
- Patent number 9,540,539
- Issue date Jan 10, 2017
- Infineon Technologies AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless semiconductor package with optical inspection feature
- Patent number 9,287,238
- Issue date Mar 15, 2016
- Infineon Technologies AG
- Soon Lock Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 8,945,990
- Issue date Feb 3, 2015
- Infineon Technologies AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device with a package locking...
- Patent number 8,304,295
- Issue date Nov 6, 2012
- Infineon Technologies AG
- Soon Lock Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a power semiconductor module comprising surfac...
- Patent number 7,955,901
- Issue date Jun 7, 2011
- Infineon Technologies AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package with a bump using a...
- Patent number 7,838,332
- Issue date Nov 23, 2010
- Infineon Technologies AG
- Soon Lock Goh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ENCAPSULATED PACKAGE WITH EXPOSED ELECTRICALLY CONDUCTIVE STRUCTURE...
- Publication number 20240006260
- Publication date Jan 4, 2024
- INFINEON TECHNOLOGIES AG
- Chee Hong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Semiconductor Package
- Publication number 20200006267
- Publication date Jan 2, 2020
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing a package using plateable encapsulant
- Publication number 20190341324
- Publication date Nov 7, 2019
- INFINEON TECHNOLOGIES AG
- Sook Woon CHAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PACKAGE WITH NICKEL PLATING AND METHOD OF FABRICATION...
- Publication number 20190027430
- Publication date Jan 24, 2019
- INFINEON TECHNOLOGIES AG
- Soon Lock Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Semiconductor Package Having an Optical Inspection Feature
- Publication number 20180033752
- Publication date Feb 1, 2018
- INFINEON TECHNOLOGIES AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing a package using plateable encapsulant
- Publication number 20170256472
- Publication date Sep 7, 2017
- INFINEON TECHNOLOGIES AG
- Sook Woon CHAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of Manufacturing Molded Semiconductor Packages Having an Opt...
- Publication number 20170256509
- Publication date Sep 7, 2017
- INFINEON TECHNOLOGIES AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedding additive particles in encapsulant of electronic device
- Publication number 20160064298
- Publication date Mar 3, 2016
- INFINEON TECHNOLOGIES AG
- Peh Hean TEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRIMER COMPOSITION, METHOD OF FORMING A PRIMER LAYER ON A SEMICONDU...
- Publication number 20150344730
- Publication date Dec 3, 2015
- INFINEON TECHNOLOGIES AG
- Swee Kah LEE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Leadless Semiconductor Package with Optical Inspection Feature
- Publication number 20150155229
- Publication date Jun 4, 2015
- INFINEON TECHNOLOGIES AG
- Soon Lock Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20130277813
- Publication date Oct 24, 2013
- INFINEON TECHNOLOGIES AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device Package Locking System and Method
- Publication number 20110309493
- Publication date Dec 22, 2011
- Soon Lock Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE WITH A BUMP USING A...
- Publication number 20100129964
- Publication date May 27, 2010
- INFINEON TECHNOLOGIES AG
- Soon Lock Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A POWER SEMICONDUCTOR MODULE COMPRISING SURFAC...
- Publication number 20090093090
- Publication date Apr 9, 2009
- INFINEON TECHNOLOGIES AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS

Soon Lock Goh

Person

Patents Grantslast 30 patents

Manufacturing a package using plateable encapsulant

Molded semiconductor package having an optical inspection feature

Semiconductor package with plateable encapsulant and a method for m...

Embedding additive particles in encapsulant of electronic device

Method of manufacturing molded semiconductor packages having an opt...

Primer composition, method of forming a primer layer on a semicondu...

Leadless semiconductor package with optical inspection feature

Chip package and method of forming the same

Method of manufacturing an electronic device with a package locking...

Method for producing a power semiconductor module comprising surfac...

Method of manufacturing a semiconductor package with a bump using a...

Patents Applicationslast 30 patents

ENCAPSULATED PACKAGE WITH EXPOSED ELECTRICALLY CONDUCTIVE STRUCTURE...

Molded Semiconductor Package

Manufacturing a package using plateable encapsulant

SEMICONDUCTOR PACKAGE WITH NICKEL PLATING AND METHOD OF FABRICATION...

Molded Semiconductor Package Having an Optical Inspection Feature

Manufacturing a package using plateable encapsulant

Method of Manufacturing Molded Semiconductor Packages Having an Opt...

Embedding additive particles in encapsulant of electronic device

PRIMER COMPOSITION, METHOD OF FORMING A PRIMER LAYER ON A SEMICONDU...

Leadless Semiconductor Package with Optical Inspection Feature

CHIP PACKAGE AND METHOD OF FORMING THE SAME

Electronic Device Package Locking System and Method

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE WITH A BUMP USING A...

METHOD FOR PRODUCING A POWER SEMICONDUCTOR MODULE COMPRISING SURFAC...