Spyridon Skordas

Person

Troy, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Paint on micro chip touch screens
- Patent number 11,790,072
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Maryam Ashoori
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Oxide-bonded wafer pair separation using laser debonding
- Patent number 11,355,379
- Issue date Jun 7, 2022
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective etching of silicon wafer
- Patent number 11,322,361
- Issue date May 3, 2022
- International Business Machines Corporation
- Da Song
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Cu—Cu bonding for interconnects on bridge chip attached to chips an...
- Patent number 11,239,167
- Issue date Feb 1, 2022
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cognitive system for automatic risk assessment, solution identifica...
- Patent number 11,182,722
- Issue date Nov 23, 2021
- International Business Machines Corporation
- Alex Richard Hubbard
- G05 - CONTROLLING REGULATING
Information Patent Grant
Granting requests for authorization using data of devices associate...
- Patent number 11,068,896
- Issue date Jul 20, 2021
- International Business Machines Corporation
- Spyridon Skordas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Paint on micro chip touch screens
- Patent number 10,915,620
- Issue date Feb 9, 2021
- International Business Machines Corporation
- Maryam Ashoori
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Gas-controlled bonding platform for edge defect reduction during wa...
- Patent number 10,777,433
- Issue date Sep 15, 2020
- ELPIS TECHNOLOGIES INC.
- Wei Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Caller identity verification based on unique multi-device signatures
- Patent number 10,681,207
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Richard C. Johnson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device including built-in crack-arresting film structure
- Patent number 10,615,139
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paint on micro chip touch screens
- Patent number 10,404,306
- Issue date Sep 3, 2019
- International Business Machines Corporation
- Maryam Ashoori
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Advanced chip to wafer stacking
- Patent number 10,269,760
- Issue date Apr 23, 2019
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including built-in crack-arresting film structure
- Patent number 10,211,178
- Issue date Feb 19, 2019
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced chip to wafer stacking
- Patent number 10,170,447
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas-controlled bonding platform for edge defect reduction during wa...
- Patent number 10,157,757
- Issue date Dec 18, 2018
- International Business Machines Corporation
- Wei Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Edge trim processes and resultant structures
- Patent number 10,134,577
- Issue date Nov 20, 2018
- GLOBALFOUNDRIES Inc.
- Richard F. Indyk
- B32 - LAYERED PRODUCTS
Information Patent Grant
Gas-controlled bonding platform for edge defect reduction during wa...
- Patent number 10,056,272
- Issue date Aug 21, 2018
- International Business Machines Corporation
- Wei Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including built-in crack-arresting film structure
- Patent number 10,020,279
- Issue date Jul 10, 2018
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas-controlled bonding platform for edge defect reduction during wa...
- Patent number 9,922,851
- Issue date Mar 20, 2018
- International Business Machines Corporation
- Wei Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Advanced chip to wafer stacking
- Patent number 9,881,896
- Issue date Jan 30, 2018
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-loss large-grain optical waveguide for interconnecting componen...
- Patent number 9,784,917
- Issue date Oct 10, 2017
- International Business Machines Corporation
- Stephen M. Gates
- G02 - OPTICS
Information Patent Grant
Wafer to wafer alignment
- Patent number 9,671,215
- Issue date Jun 6, 2017
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding using boron and nitrogen based bonding stack
- Patent number 9,640,514
- Issue date May 2, 2017
- GLOBALFOUNDRIES Inc.
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding with diffusion barrier structures
- Patent number 9,620,481
- Issue date Apr 11, 2017
- GLOBALFOUNDRIES Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with structures for cooling fluid retention
- Patent number 9,564,386
- Issue date Feb 7, 2017
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strain detection structures for bonded wafers and chips
- Patent number 9,553,054
- Issue date Jan 24, 2017
- GLOBALFOUNDRIES Inc.
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combination of TSV and back side wiring in 3D integration
- Patent number 9,543,229
- Issue date Jan 10, 2017
- International Business Machines Corporation
- Pooja R. Batra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including built-in crack-arresting film structure
- Patent number 9,536,853
- Issue date Jan 3, 2017
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combination of TSV and back side wiring in 3D integration
- Patent number 9,536,809
- Issue date Jan 3, 2017
- International Business Machines Corporation
- Pooja R. Batra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-loss large-grain optical waveguide for interconnecting componen...
- Patent number 9,472,710
- Issue date Oct 18, 2016
- International Business Machines Corporation
- Stephen M. Gates
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RELEASE LAYER CONTAINING SEMICONDUCTOR-ON-INSULATOR SUBSTRATES
- Publication number 20250048730
- Publication date Feb 6, 2025
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BOND INTEGRATION FOR MULTI-DIE ASSEMBLY
- Publication number 20240332239
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS
- Publication number 20240113055
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAINT ON MICRO CHIP TOUCH SCREENS
- Publication number 20230409692
- Publication date Dec 21, 2023
- International Business Machines Corporation
- Maryam Ashoori
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RESIST PATTERNED REDISTRIBUTION WIRING ON COPPER POLYIMIDE VIA LAYER
- Publication number 20230268275
- Publication date Aug 24, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXIDE-BONDED WAFER PAIR SEPARATION USING LASER DEBONDING
- Publication number 20220165601
- Publication date May 26, 2022
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu-Cu Bonding for Interconnects on Bridge Chip Attached to Chips an...
- Publication number 20210175174
- Publication date Jun 10, 2021
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COGNITIVE SYSTEM FOR AUTOMATIC RISK ASSESSMENT, SOLUTION IDENTIFICA...
- Publication number 20200302352
- Publication date Sep 24, 2020
- International Business Machines Corporation
- Alex Richard Hubbard
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SELECTIVE ETCHING OF SILICON WAFER
- Publication number 20190371615
- Publication date Dec 5, 2019
- International Business Machines Corporation
- Da Song
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PAINT ON MICRO CHIP TOUCH SCREENS
- Publication number 20190325126
- Publication date Oct 24, 2019
- International Business Machines Corporation
- Maryam Ashoori
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PAINT ON MICRO CHIP TOUCH SCREENS
- Publication number 20190325127
- Publication date Oct 24, 2019
- International Business Machines Corporation
- Maryam Ashoori
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SELF-ORIENTATION AND SELF-PLACEMENT OF COMPUTING DEVICES IN A FLUID
- Publication number 20190313533
- Publication date Oct 10, 2019
- International Business Machines Corporation
- Spyridon Skordas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GRANTING REQUESTS FOR AUTHORIZATION USING DATA OF DEVICES ASSOCIATE...
- Publication number 20190164163
- Publication date May 30, 2019
- International Business Machines Corporation
- Spyridon SKORDAS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
GAS-CONTROLLED BONDING PLATFORM FOR EDGE DEFECT REDUCTION DURING WA...
- Publication number 20180350639
- Publication date Dec 6, 2018
- International Business Machines Corporation
- Wei Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PAINT ON MICRO CHIP TOUCH SCREENS
- Publication number 20180351596
- Publication date Dec 6, 2018
- International Business Machines Corporation
- Maryam Ashoori
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BUILT-IN CRACK-ARRESTING FILM STRUCTURE
- Publication number 20180226374
- Publication date Aug 9, 2018
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS-CONTROLLED BONDING PLATFORM FOR EDGE DEFECT REDUCTION DURING WA...
- Publication number 20180082863
- Publication date Mar 22, 2018
- International Business Machines Corporation
- Wei Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GAS-CONTROLLED BONDING PLATFORM FOR EDGE DEFECT REDUCTION DURING WA...
- Publication number 20180082864
- Publication date Mar 22, 2018
- International Business Machines Corporation
- Wei Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADVANCED CHIP TO WAFER STACKING
- Publication number 20180076170
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED CHIP TO WAFER STACKING
- Publication number 20180068974
- Publication date Mar 8, 2018
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BUILT-IN CRACK-ARRESTING FILM STRUCTURE
- Publication number 20170221850
- Publication date Aug 3, 2017
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED CHIP TO WAFER STACKING
- Publication number 20170179077
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-Loss Large-Grain Optical Waveguide For Interconnecting Componen...
- Publication number 20170097467
- Publication date Apr 6, 2017
- International Business Machines Corporation
- Stephen M. Gates
- G02 - OPTICS
Information Patent Application
EDGE TRIM PROCESSES AND RESULTANT STRUCTURES
- Publication number 20160343564
- Publication date Nov 24, 2016
- International Business Machines Corporation
- Richard F. INDYK
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BUILT-IN CRACK-ARRESTING FILM STRUCTURE
- Publication number 20160322324
- Publication date Nov 3, 2016
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TO WAFER ALIGNMENT
- Publication number 20160178344
- Publication date Jun 23, 2016
- International Business Machines Corporation
- Mukta G. Farooq
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BUILT-IN CRACK-ARRESTING FILM STRUCTURE
- Publication number 20160141263
- Publication date May 19, 2016
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRAIN DETECTION STRUCTURES FOR BONDED WAFERS AND CHIPS
- Publication number 20160118348
- Publication date Apr 28, 2016
- International Business Machines Corporation
- Mukta G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID COOLING OF SEMICONDUCTOR CHIPS UTILIZING SMALL SCALE STRUCT...
- Publication number 20160064307
- Publication date Mar 3, 2016
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLER WAFER REMOVAL BY USE OF SACRIFICIAL INERT LAYER
- Publication number 20160035616
- Publication date Feb 4, 2016
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Spyridon Skordas

Person

Patents Grantslast 30 patents

Paint on micro chip touch screens

Oxide-bonded wafer pair separation using laser debonding

Selective etching of silicon wafer

Cu—Cu bonding for interconnects on bridge chip attached to chips an...

Cognitive system for automatic risk assessment, solution identifica...

Granting requests for authorization using data of devices associate...

Paint on micro chip touch screens

Gas-controlled bonding platform for edge defect reduction during wa...

Caller identity verification based on unique multi-device signatures

Semiconductor device including built-in crack-arresting film structure

Paint on micro chip touch screens

Advanced chip to wafer stacking

Semiconductor device including built-in crack-arresting film structure

Advanced chip to wafer stacking

Gas-controlled bonding platform for edge defect reduction during wa...

Edge trim processes and resultant structures

Gas-controlled bonding platform for edge defect reduction during wa...

Semiconductor device including built-in crack-arresting film structure

Gas-controlled bonding platform for edge defect reduction during wa...

Advanced chip to wafer stacking

Low-loss large-grain optical waveguide for interconnecting componen...

Wafer to wafer alignment

Wafer bonding using boron and nitrogen based bonding stack

Substrate bonding with diffusion barrier structures

Semiconductor package with structures for cooling fluid retention

Strain detection structures for bonded wafers and chips

Combination of TSV and back side wiring in 3D integration

Semiconductor device including built-in crack-arresting film structure

Combination of TSV and back side wiring in 3D integration

Low-loss large-grain optical waveguide for interconnecting componen...

Patents Applicationslast 30 patents

RELEASE LAYER CONTAINING SEMICONDUCTOR-ON-INSULATOR SUBSTRATES

HYBRID BOND INTEGRATION FOR MULTI-DIE ASSEMBLY

STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS

PAINT ON MICRO CHIP TOUCH SCREENS

RESIST PATTERNED REDISTRIBUTION WIRING ON COPPER POLYIMIDE VIA LAYER

OXIDE-BONDED WAFER PAIR SEPARATION USING LASER DEBONDING

Cu-Cu Bonding for Interconnects on Bridge Chip Attached to Chips an...

COGNITIVE SYSTEM FOR AUTOMATIC RISK ASSESSMENT, SOLUTION IDENTIFICA...

SELECTIVE ETCHING OF SILICON WAFER

PAINT ON MICRO CHIP TOUCH SCREENS

PAINT ON MICRO CHIP TOUCH SCREENS

SELF-ORIENTATION AND SELF-PLACEMENT OF COMPUTING DEVICES IN A FLUID

GRANTING REQUESTS FOR AUTHORIZATION USING DATA OF DEVICES ASSOCIATE...

GAS-CONTROLLED BONDING PLATFORM FOR EDGE DEFECT REDUCTION DURING WA...

PAINT ON MICRO CHIP TOUCH SCREENS

SEMICONDUCTOR DEVICE INCLUDING BUILT-IN CRACK-ARRESTING FILM STRUCTURE

GAS-CONTROLLED BONDING PLATFORM FOR EDGE DEFECT REDUCTION DURING WA...

GAS-CONTROLLED BONDING PLATFORM FOR EDGE DEFECT REDUCTION DURING WA...

ADVANCED CHIP TO WAFER STACKING

ADVANCED CHIP TO WAFER STACKING

SEMICONDUCTOR DEVICE INCLUDING BUILT-IN CRACK-ARRESTING FILM STRUCTURE

ADVANCED CHIP TO WAFER STACKING

Low-Loss Large-Grain Optical Waveguide For Interconnecting Componen...

EDGE TRIM PROCESSES AND RESULTANT STRUCTURES

SEMICONDUCTOR DEVICE INCLUDING BUILT-IN CRACK-ARRESTING FILM STRUCTURE

WAFER TO WAFER ALIGNMENT

SEMICONDUCTOR DEVICE INCLUDING BUILT-IN CRACK-ARRESTING FILM STRUCTURE

STRAIN DETECTION STRUCTURES FOR BONDED WAFERS AND CHIPS

LIQUID COOLING OF SEMICONDUCTOR CHIPS UTILIZING SMALL SCALE STRUCT...

HANDLER WAFER REMOVAL BY USE OF SACRIFICIAL INERT LAYER