Sri M. Sri-Jayantha

Person

Ossining, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Warp mitigation using pattern-matched metal layers in organic subst...
- Patent number 11,817,359
- Issue date Nov 14, 2023
- International Business Machines Corporation
- Hien Dang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Server node connector mating condition health monitoring and reporting
- Patent number 11,570,928
- Issue date Jan 31, 2023
- International Business Machines Corporation
- Sri M Sri-Jayantha
- G08 - SIGNALLING
Information Patent Grant
Pressure controllable encapsulated liquid thermal interface
- Patent number 11,545,415
- Issue date Jan 3, 2023
- International Business Machines Corporation
- Sri M. Sri-Jayantha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress mitigation in organic laminates
- Patent number 11,315,803
- Issue date Apr 26, 2022
- International Business Machines Corporation
- Sri M. Sri-Jayantha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimum warp in organic substrates
- Patent number 11,245,075
- Issue date Feb 8, 2022
- International Business Machines Corporation
- Sri Sri-Jayantha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling warp in semiconductor laminated substrates with conduct...
- Patent number 10,886,229
- Issue date Jan 5, 2021
- International Business Machines Corporation
- Hien P Dang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Server node connnector mating condition health monitoring and repor...
- Patent number 10,834,844
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Sri M Sri-Jayantha
- G01 - MEASURING TESTING
Information Patent Grant
TIM strain mitigation in electronic modules
- Patent number 10,796,978
- Issue date Oct 6, 2020
- International Business Machines Corporation
- Gerard McVicker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling warp in semiconductor laminated substrates with conduct...
- Patent number 10,790,232
- Issue date Sep 29, 2020
- International Business Machines Corporation
- Hien P Dang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 10,750,615
- Issue date Aug 18, 2020
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Real-time estimation of solar irradiation
- Patent number 10,371,729
- Issue date Aug 6, 2019
- International Business Machines Corporation
- Hien P. Dang
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 10,368,441
- Issue date Jul 30, 2019
- International Business Machines Corporation
- Michael A. Gaynes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
TIM strain mitigation in electronic modules
- Patent number 10,325,829
- Issue date Jun 18, 2019
- International Business Machines Corporation
- Gerard McVicker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 9,974,179
- Issue date May 15, 2018
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TIM strain mitigation in electronic modules
- Patent number 9,837,332
- Issue date Dec 5, 2017
- International Business Machines Corporation
- Gerard McVicker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 9,627,784
- Issue date Apr 18, 2017
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for thermomechanically decoupling heatsink
- Patent number 9,550,258
- Issue date Jan 24, 2017
- GLOBALFOUNDRIES Inc.
- Sri M Sri-Jayantha
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic components on trenched substrates and method of forming...
- Patent number 9,508,789
- Issue date Nov 29, 2016
- GLOBALFOUNDRIES Inc.
- David Questad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tim strain mitigation in electronic modules
- Patent number 9,437,519
- Issue date Sep 6, 2016
- International Business Machines Corporation
- Gerard McVicker
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Vacuum carriers for substrate bonding
- Patent number 9,227,261
- Issue date Jan 5, 2016
- GLOBALFOUNDRIES Inc.
- Vijayeshwar D. Khanna
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alignment of integrated circuit chip stack
- Patent number 9,171,742
- Issue date Oct 27, 2015
- GlobalFoundries U.S. 2 LLC
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Construction of reliable stacked via in electronic substrates—verti...
- Patent number 9,099,458
- Issue date Aug 4, 2015
- International Business Machines Corporation
- Karan Kacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabricating a small-scale radiation detector
- Patent number 8,987,031
- Issue date Mar 24, 2015
- International Business Machines Corporation
- Michael S. Gordon
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for manufacturing electronic integrated circui...
- Patent number 8,877,552
- Issue date Nov 4, 2014
- International Business Machines Corporation
- Sri M. Sri-Jayantha
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Grant
Construction of reliable stacked via in electronic substrates—verti...
- Patent number 8,866,026
- Issue date Oct 21, 2014
- International Business Machines Corporation
- Karan Kacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
In-plane silicon heat spreader and method therefor
- Patent number 8,853,007
- Issue date Oct 7, 2014
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Road hazard detection and warning system and method
- Patent number 8,766,817
- Issue date Jul 1, 2014
- International Business Machines Corporation
- Sri M Sri-Jayantha
- G08 - SIGNALLING
Information Patent Grant
Stress reduction means for warp control of substrates through clamping
- Patent number 8,685,833
- Issue date Apr 1, 2014
- International Business Machines Corporation
- Vijayeshwar D. Khanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic components on trenched substrates and method of forming...
- Patent number 8,659,119
- Issue date Feb 25, 2014
- International Business Machines Corporation
- Vijayeshwar D. Kharma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Smarter-grid: method to forecast electric energy production and uti...
- Patent number 8,600,572
- Issue date Dec 3, 2013
- International Business Machines Corporation
- Sri M. Sri-Jayantha
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SILICON THERMALIZER FOR CRYOGENIC MICROWAVE APPLICATION USING A COP...
- Publication number 20240230202
- Publication date Jul 11, 2024
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON THERMALIZER FOR CRYOGENIC MICROWAVE APPLICATION USING A COP...
- Publication number 20240133609
- Publication date Apr 25, 2024
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CONDUCTION LAYER
- Publication number 20230058897
- Publication date Feb 23, 2023
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER CREEP LIMITING RIGID SPACER FOR STACKED DIE C4 PACKAGING
- Publication number 20230058638
- Publication date Feb 23, 2023
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WARP MITIGATION USING PATTERN-MATCHED METAL LAYERS IN ORGANIC SUBST...
- Publication number 20220068735
- Publication date Mar 3, 2022
- International Business Machines Corporation
- Hien Dang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OPTIMUM WARP IN ORGANIC SUBSTRATES
- Publication number 20210367152
- Publication date Nov 25, 2021
- International Business Machines Corporation
- Sri Sri-Jayantha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS MITIGATION IN ORGANIC LAMINATES
- Publication number 20210358769
- Publication date Nov 18, 2021
- International Business Machines Corporation
- Sri M. Sri-Jayantha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE CONTROLLABLE ENCAPSULATED LIQUID THERMAL INTERFACE
- Publication number 20210183742
- Publication date Jun 17, 2021
- International Business Machines Corporation
- Sri M. Sri-Jayantha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SERVER NODE CONNNECTOR MATING CONDITION HEALTH MONITORING AND REPOR...
- Publication number 20200389994
- Publication date Dec 10, 2020
- International Business Machines Corporation
- Sri M. Sri-Jayantha
- G01 - MEASURING TESTING
Information Patent Application
SERVER NODE CONNNECTOR MATING CONDITION HEALTH MONITORING AND REPOR...
- Publication number 20200146172
- Publication date May 7, 2020
- International Business Machines Corporation
- Sri M. Sri-Jayantha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROLLING WARP IN SEMICONDUCTOR LAMINATED SUBSTRATES WITH CONDUCT...
- Publication number 20200126916
- Publication date Apr 23, 2020
- Hien P. Dang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONTROLLING WARP IN SEMICONDUCTOR LAMINATED SUBSTRATES WITH CONDUCT...
- Publication number 20200091074
- Publication date Mar 19, 2020
- International Business Machines Corporation
- Hien P. Dang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...
- Publication number 20190281702
- Publication date Sep 12, 2019
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIM STRAIN MITIGATION IN ELECTRONIC MODULES
- Publication number 20190206762
- Publication date Jul 4, 2019
- International Business Machines Corporation
- Gerard McVicker
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...
- Publication number 20180213645
- Publication date Jul 26, 2018
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIM STRAIN MITIGATION IN ELECTRONIC MODULES
- Publication number 20180047654
- Publication date Feb 15, 2018
- International Business Machines Corporation
- Gerard McVicker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REAL-TIME ESTIMATION OF SOLAR IRRADIATION
- Publication number 20170212156
- Publication date Jul 27, 2017
- International Business Machines Corporation
- Hien P. Dang
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...
- Publication number 20170196089
- Publication date Jul 6, 2017
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIM STRAIN MITIGATION IN ELECTRONIC MODULES
- Publication number 20160365297
- Publication date Dec 15, 2016
- International Business Machines Corporation
- Gerard McVicker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIM STRAIN MITIGATION IN ELECTRONIC MODULES
- Publication number 20150243570
- Publication date Aug 27, 2015
- International Business Machines Corporation
- Gerard McVicker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM CARRIERS FOR SUBSTRATE BONDING
- Publication number 20150041524
- Publication date Feb 12, 2015
- International Business Machines Corporation
- Vijayeshwar D. Khanna
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
ALIGNMENT OF INTEGRATED CIRCUIT CHIP STACK
- Publication number 20150024549
- Publication date Jan 22, 2015
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR THERMOMECHANICALLY DECOUPLING HEATSINK
- Publication number 20150000868
- Publication date Jan 1, 2015
- International Business Machines Corporation
- Sri M Sri-Jayantha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR THERMOMECHANICALLY DECOUPLING HEATSINK
- Publication number 20150000097
- Publication date Jan 1, 2015
- International Business Machines Corporation
- Sri M. Sri-Jayantha
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATING A SMALL-SCALE RADIATION DETECTOR
- Publication number 20140329351
- Publication date Nov 6, 2014
- International Business Machines Corporation
- MICHAEL S. GORDON
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC COMPONENTS ON TRENCHED SUBSTRATES AND METHOD OF FORMING...
- Publication number 20140151849
- Publication date Jun 5, 2014
- International Business Machines Corporation
- David Questad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS REDUCTION MEANS FOR WARP CONTROL OF SUBSTRATES THROUGH CLAMPING
- Publication number 20130260534
- Publication date Oct 3, 2013
- International Business Machines Corporation
- Vijayeshwar D. Khanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conformal Coining of Solder Joints in Electronic Packages
- Publication number 20120309187
- Publication date Dec 6, 2012
- International Business Machines Corporation
- Sri M. Sri-Jayantha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONSTRUCTION OF RELIABLE STACKED VIA IN ELECTRONIC SUBSTRATES - VER...
- Publication number 20120299195
- Publication date Nov 29, 2012
- International Business Machines Corporation
- Karan Kacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CLUSTERED STACKED VIAS FOR RELIABLE ELECTRONIC SUBSTRATES
- Publication number 20120279061
- Publication date Nov 8, 2012
- International Business Machines Corporation
- Karan Kacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Sri M. Sri-Jayantha

Person

Patents Grantslast 30 patents

Warp mitigation using pattern-matched metal layers in organic subst...

Server node connector mating condition health monitoring and reporting

Pressure controllable encapsulated liquid thermal interface

Stress mitigation in organic laminates

Optimum warp in organic substrates

Controlling warp in semiconductor laminated substrates with conduct...

Server node connnector mating condition health monitoring and repor...

TIM strain mitigation in electronic modules

Controlling warp in semiconductor laminated substrates with conduct...

Method and apparatus for strain relieving surface mount attached co...

Real-time estimation of solar irradiation

Method and apparatus for strain relieving surface mount attached co...

TIM strain mitigation in electronic modules

Method and apparatus for strain relieving surface mount attached co...

TIM strain mitigation in electronic modules

Method and apparatus for strain relieving surface mount attached co...

Method and system for thermomechanically decoupling heatsink

Electronic components on trenched substrates and method of forming...

Tim strain mitigation in electronic modules

Vacuum carriers for substrate bonding

Alignment of integrated circuit chip stack

Construction of reliable stacked via in electronic substrates—verti...

Fabricating a small-scale radiation detector

Method and apparatus for manufacturing electronic integrated circui...

Construction of reliable stacked via in electronic substrates—verti...

In-plane silicon heat spreader and method therefor

Road hazard detection and warning system and method

Stress reduction means for warp control of substrates through clamping

Electronic components on trenched substrates and method of forming...

Smarter-grid: method to forecast electric energy production and uti...

Patents Applicationslast 30 patents

SILICON THERMALIZER FOR CRYOGENIC MICROWAVE APPLICATION USING A COP...

SILICON THERMALIZER FOR CRYOGENIC MICROWAVE APPLICATION USING A COP...

THERMAL CONDUCTION LAYER

SOLDER CREEP LIMITING RIGID SPACER FOR STACKED DIE C4 PACKAGING

WARP MITIGATION USING PATTERN-MATCHED METAL LAYERS IN ORGANIC SUBST...

OPTIMUM WARP IN ORGANIC SUBSTRATES

STRESS MITIGATION IN ORGANIC LAMINATES

PRESSURE CONTROLLABLE ENCAPSULATED LIQUID THERMAL INTERFACE

SERVER NODE CONNNECTOR MATING CONDITION HEALTH MONITORING AND REPOR...

SERVER NODE CONNNECTOR MATING CONDITION HEALTH MONITORING AND REPOR...

CONTROLLING WARP IN SEMICONDUCTOR LAMINATED SUBSTRATES WITH CONDUCT...

CONTROLLING WARP IN SEMICONDUCTOR LAMINATED SUBSTRATES WITH CONDUCT...

METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...

TIM STRAIN MITIGATION IN ELECTRONIC MODULES

METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...

TIM STRAIN MITIGATION IN ELECTRONIC MODULES

REAL-TIME ESTIMATION OF SOLAR IRRADIATION

METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...

TIM STRAIN MITIGATION IN ELECTRONIC MODULES

TIM STRAIN MITIGATION IN ELECTRONIC MODULES

VACUUM CARRIERS FOR SUBSTRATE BONDING

ALIGNMENT OF INTEGRATED CIRCUIT CHIP STACK

METHOD AND SYSTEM FOR THERMOMECHANICALLY DECOUPLING HEATSINK

METHOD AND SYSTEM FOR THERMOMECHANICALLY DECOUPLING HEATSINK

FABRICATING A SMALL-SCALE RADIATION DETECTOR

ELECTRONIC COMPONENTS ON TRENCHED SUBSTRATES AND METHOD OF FORMING...

STRESS REDUCTION MEANS FOR WARP CONTROL OF SUBSTRATES THROUGH CLAMPING

Conformal Coining of Solder Joints in Electronic Packages

CONSTRUCTION OF RELIABLE STACKED VIA IN ELECTRONIC SUBSTRATES - VER...

CLUSTERED STACKED VIAS FOR RELIABLE ELECTRONIC SUBSTRATES