Srikant Nekkanty

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package expanded beam connector for on-package optics
- Patent number 12,174,436
- Issue date Dec 24, 2024
- Intel Corporation
- Wesley Morgan
- G02 - OPTICS
Information Patent Grant
Active optical coupler
- Patent number 12,153,269
- Issue date Nov 26, 2024
- Intel Corporation
- Divya Pratap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided socket device with corrugation structures and shield str...
- Patent number 12,009,612
- Issue date Jun 11, 2024
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector with insulated conductive layer
- Patent number 11,935,860
- Issue date Mar 19, 2024
- Intel Corporation
- Morten Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided socket device with corrugation structures
- Patent number 11,916,322
- Issue date Feb 27, 2024
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Differential crosstalk self-cancelation in stackable structures
- Patent number 11,862,547
- Issue date Jan 2, 2024
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided co-packaged optics for high bandwidth networking applica...
- Patent number 11,830,863
- Issue date Nov 28, 2023
- Intel Corporation
- Suresh V. Pothukuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for fast, passive alignment in photonics assembly
- Patent number 11,808,988
- Issue date Nov 7, 2023
- Intel Corporation
- Vineeth Abraham
- G02 - OPTICS
Information Patent Grant
Pressure features to alter the shape of a socket
- Patent number 11,569,596
- Issue date Jan 31, 2023
- Intel Corporation
- Steven A. Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided co-packaged optics for high bandwidth networking applica...
- Patent number 11,217,573
- Issue date Jan 4, 2022
- Intel Corporation
- Suresh V. Pothukuchi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Pin count socket having reduced pin count and pattern transformation
- Patent number 11,212,932
- Issue date Dec 28, 2021
- Intel Corporation
- Srikant Nekkanty
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pin count socket having reduced pin count and pattern transformation
- Patent number 10,716,231
- Issue date Jul 14, 2020
- Intel Corporation
- Srikant Nekkanty
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-mold structures
- Patent number 10,636,716
- Issue date Apr 28, 2020
- Intel Corporation
- Sasha Oster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector for processor package
- Patent number 10,541,494
- Issue date Jan 21, 2020
- Intel Corporation
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package that includes multi-layer stiffener
- Patent number 10,535,615
- Issue date Jan 14, 2020
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket contact techniques and configurations
- Patent number 10,205,292
- Issue date Feb 12, 2019
- Intel Corporation
- Dhanya Athreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal linear edge connector
- Patent number 10,044,115
- Issue date Aug 7, 2018
- Intel Corporation
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array (BGA) with anchoring pins
- Patent number 9,953,909
- Issue date Apr 24, 2018
- Intel Corporation
- Zuyang Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket contact techniques and configurations
- Patent number 9,780,510
- Issue date Oct 3, 2017
- Intel Corporation
- Dhanya Athreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Small form factor sockets and connectors
- Patent number 9,692,147
- Issue date Jun 27, 2017
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-mated edge finger connector
- Patent number 9,502,800
- Issue date Nov 22, 2016
- Intel Corporation
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic socket comprising a substrate and an insulative ins...
- Patent number 9,491,881
- Issue date Nov 8, 2016
- Intel Corporation
- Joshua D. Heppner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Helicoil spring backing socket
- Patent number 8,956,193
- Issue date Feb 17, 2015
- Intel Corporation
- Donald Tran
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL ISOLATORS FOR MULTI-CHANNEL OPTICAL INTERCONNECTS
- Publication number 20250004205
- Publication date Jan 2, 2025
- Intel Corporation
- Dekang CHEN
- G02 - OPTICS
Information Patent Application
ENHANCED I/O SEMICONDUCTOR CHIP PACKAGE AND COOLING ASSEMBLY HAVING...
- Publication number 20240421025
- Publication date Dec 19, 2024
- Intel Corporation
- Lianchang DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATCH INTERPOSER MOLD DESIGN FOR LIQUID METAL CARRIER ARRAY
- Publication number 20240404896
- Publication date Dec 5, 2024
- Intel Corporation
- Eric ERIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH DAMPENERS TO REDUCE VIBRATION EFFECTS
- Publication number 20240355702
- Publication date Oct 24, 2024
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL CONNECTION DEVICE AND METHOD
- Publication number 20240297119
- Publication date Sep 5, 2024
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKETS HAVING FINE PITCH 3D FEATURES
- Publication number 20240283197
- Publication date Aug 22, 2024
- Intel Corporation
- Saikat Mondal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES
- Publication number 20240213156
- Publication date Jun 27, 2024
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR FAST, PASSIVE ALIGNMENT IN PHOTONICS ASSEMBLY
- Publication number 20240111098
- Publication date Apr 4, 2024
- Intel Corporation
- Vineeth ABRAHAM
- G02 - OPTICS
Information Patent Application
LIQUID METAL BASED FIRST LEVEL INTERCONNECTS
- Publication number 20240006400
- Publication date Jan 4, 2024
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURE INCLUDING DIE BONDING FILM BETWEEN EMBEDD...
- Publication number 20230317619
- Publication date Oct 5, 2023
- Intel Corporation
- Ravindranath V. Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONICS PACKAGE INCLUDING OPTIC PLUG RECEPTACLE WITH SUPPORT PORT...
- Publication number 20230204878
- Publication date Jun 29, 2023
- Intel Corporation
- Wesley B. Morgan
- G02 - OPTICS
Information Patent Application
LIQUID METAL INTERCONNECT FOR MODULAR PACKAGE SERVER ARCHITECTURE
- Publication number 20230197621
- Publication date Jun 22, 2023
- Intel Corporation
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERPOSER SERVE...
- Publication number 20230197622
- Publication date Jun 22, 2023
- Intel Corporation
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERCONNECT SER...
- Publication number 20230197594
- Publication date Jun 22, 2023
- Intel Corporation
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL CONNECTION DEVICE AND METHOD
- Publication number 20230187850
- Publication date Jun 15, 2023
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE LIQUID METAL CONNECTION DEVICE AND METHOD
- Publication number 20230187337
- Publication date Jun 15, 2023
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR OPTICAL COUPLING TO PHOTONIC INTEGRATED CIRCUITS
- Publication number 20230095039
- Publication date Mar 30, 2023
- Intel Corporation
- Srikant Nekkanty
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT TO GLASS SUBSTRATE ALIGNMENT THROUGH DU...
- Publication number 20230077939
- Publication date Mar 16, 2023
- Changhua Liu
- G02 - OPTICS
Information Patent Application
TECHNOLOGIES FOR APPLYING GOLD-PLATED CONTACT PADS TO CIRCUIT BOARDS
- Publication number 20230074269
- Publication date Mar 9, 2023
- Intel Corporation
- Donald Tiendung Tran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE, METHOD AND SYSTEM FOR OPTICAL COMMUNICATION WITH A PHOTONIC...
- Publication number 20220413214
- Publication date Dec 29, 2022
- Intel Corporation
- Changhua Liu
- G02 - OPTICS
Information Patent Application
SUBSTRATE CAVITY WITH ALIGNMENT FEATURES TO ALIGN AN OPTICAL CONNECTOR
- Publication number 20220413240
- Publication date Dec 29, 2022
- Intel Corporation
- Srikant NEKKANTY
- G02 - OPTICS
Information Patent Application
HETEROGENOUS SOCKET CONTACT FOR ELECTRICAL AND MECHANICAL PERFORMAN...
- Publication number 20220407254
- Publication date Dec 22, 2022
- Intel Corporation
- Zhichao Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE EXPANDED BEAM CONNECTOR FOR ON-PACKAGE OPTICS
- Publication number 20220308294
- Publication date Sep 29, 2022
- Intel Corporation
- Wesley MORGAN
- G02 - OPTICS
Information Patent Application
ACTIVE OPTICAL COUPLER
- Publication number 20220196942
- Publication date Jun 23, 2022
- Intel Corporation
- Divya PRATAP
- G02 - OPTICS
Information Patent Application
MICRO SOCKET ELECTRICAL COUPLINGS FOR DIES
- Publication number 20220200183
- Publication date Jun 23, 2022
- Intel Corporation
- Srikant NEKKANTY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED SOCKET DEVICE WITH CORRUGATION STRUCTURES
- Publication number 20220102883
- Publication date Mar 31, 2022
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED SOCKET DEVICE WITH CORRUGATION STRUCTURES AND SHIELD STR...
- Publication number 20220102892
- Publication date Mar 31, 2022
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED CO-PACKAGED OPTICS FOR HIGH BANDWIDTH NETWORKING APPLICA...
- Publication number 20220085001
- Publication date Mar 17, 2022
- Intel Corporation
- Suresh V. POTHUKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SOCKET PIN FOR SELF-RETENTION TO A CONDUCTIVE INTERPOSER
- Publication number 20220069532
- Publication date Mar 3, 2022
- Intel Corporation
- Feroz Mohammad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR FAST, PASSIVE ALIGNMENT IN PHOTONICS ASSEMBLY
- Publication number 20220011517
- Publication date Jan 13, 2022
- Intel Corporation
- Vineeth ABRAHAM
- G02 - OPTICS

Srikant Nekkanty

Person

Patents Grantslast 30 patents

Package expanded beam connector for on-package optics

Active optical coupler

Dual-sided socket device with corrugation structures and shield str...

Electrical connector with insulated conductive layer

Dual-sided socket device with corrugation structures

Differential crosstalk self-cancelation in stackable structures

Dual-sided co-packaged optics for high bandwidth networking applica...

Method and device for fast, passive alignment in photonics assembly

Pressure features to alter the shape of a socket

Dual-sided co-packaged optics for high bandwidth networking applica...

Pin count socket having reduced pin count and pattern transformation

Pin count socket having reduced pin count and pattern transformation

Through-mold structures

Connector for processor package

Electronic package that includes multi-layer stiffener

Socket contact techniques and configurations

Universal linear edge connector

Ball grid array (BGA) with anchoring pins

Socket contact techniques and configurations

Small form factor sockets and connectors

Double-mated edge finger connector

Microelectronic socket comprising a substrate and an insulative ins...

Helicoil spring backing socket

Patents Applicationslast 30 patents

OPTICAL ISOLATORS FOR MULTI-CHANNEL OPTICAL INTERCONNECTS

ENHANCED I/O SEMICONDUCTOR CHIP PACKAGE AND COOLING ASSEMBLY HAVING...

PATCH INTERPOSER MOLD DESIGN FOR LIQUID METAL CARRIER ARRAY

INTEGRATED CIRCUIT PACKAGES WITH DAMPENERS TO REDUCE VIBRATION EFFECTS

LIQUID METAL CONNECTION DEVICE AND METHOD

SOCKETS HAVING FINE PITCH 3D FEATURES

LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES

METHOD AND DEVICE FOR FAST, PASSIVE ALIGNMENT IN PHOTONICS ASSEMBLY

LIQUID METAL BASED FIRST LEVEL INTERCONNECTS

MICROELECTRONIC STRUCTURE INCLUDING DIE BONDING FILM BETWEEN EMBEDD...

PHOTONICS PACKAGE INCLUDING OPTIC PLUG RECEPTACLE WITH SUPPORT PORT...

LIQUID METAL INTERCONNECT FOR MODULAR PACKAGE SERVER ARCHITECTURE

LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERPOSER SERVE...

LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERCONNECT SER...

LIQUID METAL CONNECTION DEVICE AND METHOD

FLEXIBLE LIQUID METAL CONNECTION DEVICE AND METHOD

TECHNOLOGIES FOR OPTICAL COUPLING TO PHOTONIC INTEGRATED CIRCUITS

PHOTONIC INTEGRATED CIRCUIT TO GLASS SUBSTRATE ALIGNMENT THROUGH DU...

TECHNOLOGIES FOR APPLYING GOLD-PLATED CONTACT PADS TO CIRCUIT BOARDS

DEVICE, METHOD AND SYSTEM FOR OPTICAL COMMUNICATION WITH A PHOTONIC...

SUBSTRATE CAVITY WITH ALIGNMENT FEATURES TO ALIGN AN OPTICAL CONNECTOR

HETEROGENOUS SOCKET CONTACT FOR ELECTRICAL AND MECHANICAL PERFORMAN...

PACKAGE EXPANDED BEAM CONNECTOR FOR ON-PACKAGE OPTICS

ACTIVE OPTICAL COUPLER

MICRO SOCKET ELECTRICAL COUPLINGS FOR DIES

DUAL-SIDED SOCKET DEVICE WITH CORRUGATION STRUCTURES

DUAL-SIDED SOCKET DEVICE WITH CORRUGATION STRUCTURES AND SHIELD STR...

DUAL-SIDED CO-PACKAGED OPTICS FOR HIGH BANDWIDTH NETWORKING APPLICA...

ELECTRONIC SOCKET PIN FOR SELF-RETENTION TO A CONDUCTIVE INTERPOSER

METHOD AND DEVICE FOR FAST, PASSIVE ALIGNMENT IN PHOTONICS ASSEMBLY