Sriram Muthukumar

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-configurable sensing array and methods of using same
- Patent number 11,782,055
- Issue date Oct 10, 2023
- EnLiSense, LLC
- Sriram Muthukumar
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Stacked-chip packages in package-on-package apparatus, methods of a...
- Patent number 11,217,516
- Issue date Jan 4, 2022
- Intel Corporation
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-chip packages in package-on-package apparatus, methods of a...
- Patent number 10,186,480
- Issue date Jan 22, 2019
- Intel Corporation
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage compensation metal for wafer level packaging technology
- Patent number 10,134,689
- Issue date Nov 20, 2018
- Maxim Integrated Products, Inc.
- Vivek S. Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Biosensing system and methods using electron-ionic mechanisms at fl...
- Patent number 10,006,882
- Issue date Jun 26, 2018
- EnLiSense, LLC
- Shalini Prasad
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Wafer level device and method with cantilever pillar structure
- Patent number 9,806,047
- Issue date Oct 31, 2017
- Maxim Integrated Products, Inc.
- Karthik Thambidurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated WLUF and SOD process
- Patent number 9,728,515
- Issue date Aug 8, 2017
- Intel Corporation
- Rubayat Mahmud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated WLUF and SOD process
- Patent number 9,349,698
- Issue date May 24, 2016
- Intel Corporation
- Rubayat Mahmud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of stiffening coreless package substrate
- Patent number 8,860,205
- Issue date Oct 14, 2014
- Intel Corporation
- Sriram Muthukumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatuses to stiffen integrated circuit package
- Patent number 8,502,400
- Issue date Aug 6, 2013
- Intel Corporation
- Prasanna Karpur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making multi-chip packaging using an interposer
- Patent number 8,387,240
- Issue date Mar 5, 2013
- Intel Corporation
- Sriram Muthukumar
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods and apparatuses to stiffen integrated circuit package
- Patent number 8,143,110
- Issue date Mar 27, 2012
- Intel Corporation
- Prasanna Karpur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-metal bonding of compliant interconnect
- Patent number 8,030,782
- Issue date Oct 4, 2011
- Intel Corporation
- Shriram Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packaging using an interposer such as a silicon based in...
- Patent number 7,882,628
- Issue date Feb 8, 2011
- Intel Corporation
- Sriram Muthukumar
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of stiffening coreless package substrate
- Patent number 7,851,269
- Issue date Dec 14, 2010
- Intel Corporation
- Sriram Muthukumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip packaging using an interposer with through-vias
- Patent number 7,841,080
- Issue date Nov 30, 2010
- Intel Corporation
- Sriram Muthukumar
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Metal-metal bonding of compliant interconnect
- Patent number 7,750,487
- Issue date Jul 6, 2010
- Intel Corporation
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin silicon based substrate
- Patent number 7,589,424
- Issue date Sep 15, 2009
- Intel Corporation
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin silicon based substrate
- Patent number 7,443,030
- Issue date Oct 28, 2008
- Intel Corporation
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant multi-composition interconnects
- Patent number 7,400,041
- Issue date Jul 15, 2008
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant interconnects for semiconductors and micromachines
- Patent number 7,378,742
- Issue date May 27, 2008
- Intel Corporation
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance integrated inductor
- Patent number 7,294,525
- Issue date Nov 13, 2007
- Intel Corporation
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated inductors and compliant interconnects for semiconductor...
- Patent number 7,279,391
- Issue date Oct 9, 2007
- Intel Corporation
- Rockwell Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing of thin based substrate
- Patent number 7,049,208
- Issue date May 23, 2006
- Intel Corporation
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR MULTI-MODAL AND MULTIPLEXED ELECTROCHEMICAL...
- Publication number 20240393287
- Publication date Nov 28, 2024
- EnLiSense LLC
- Vikram Narayanan Dhamu
- G01 - MEASURING TESTING
Information Patent Application
MULTI-CONFIGURABLE SENSING ARRAY AND METHODS OF USING SAME
- Publication number 20230408499
- Publication date Dec 21, 2023
- EnLiSense LLC
- Sriram Muthukumar
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
MACHINE-LEARNING BASED BIOSENSOR SYSTEM
- Publication number 20220160265
- Publication date May 26, 2022
- Devangsingh Gajendarsingh Sankhala
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
DISEASE DIAGNOSTICS USING A MULTI-CONFIGURABLE SENSING ARRAY
- Publication number 20210325380
- Publication date Oct 21, 2021
- EnLiSense, LLC
- Sriram Muthukumar
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY ANALOG MULTIPEXING
- Publication number 20200054259
- Publication date Feb 20, 2020
- EnLiSense, LLC
- Devangsingh Gajendarsingh Sankhala
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
MULTI-CONFIGURABLE SENSING ARRAY AND METHODS OF USING SAME
- Publication number 20190250153
- Publication date Aug 15, 2019
- EnLiSense, LLC
- Sriram Muthukumar
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
STACKED-CHIP PACKAGES IN PACKAGE-ON-PACKAGE APPARATUS, METHODS OF A...
- Publication number 20190148275
- Publication date May 16, 2019
- Intel Corporation
- Sriram MUTHUKUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEARABLE BIOSENSORS WITH ROOM TEMPERATURE IONIC LIQUID BUFFER
- Publication number 20190069818
- Publication date Mar 7, 2019
- Shalini Prasad
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
INTEGRATED WLUF AND SOD PROCESS
- Publication number 20160247774
- Publication date Aug 25, 2016
- Intel Corporation
- Rubayat Mahmud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIOSENSING SYSTEM AND METHODS USING ELECTRON IONIC MECHANISMS AT FL...
- Publication number 20160146754
- Publication date May 26, 2016
- EnLiSense, LLC
- Shalini Prasad
- G01 - MEASURING TESTING
Information Patent Application
WAFER LEVEL DEVICE AND METHOD WITH CANTILEVER PILLAR STRUCTURE
- Publication number 20150279799
- Publication date Oct 1, 2015
- Maxim Integrated Products, Inc.
- Karthik Thambidurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED WLUF AND SOD PROCESS
- Publication number 20140001631
- Publication date Jan 2, 2014
- Rubayat Mahmud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED-CHIP PACKAGES IN PACKAGE-ON-PACKAGE APPARATUS, METHODS OF A...
- Publication number 20130127054
- Publication date May 23, 2013
- Sriram MUTHUKUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES TO STIFFEN INTEGRATED CIRCUIT PACKAGE
- Publication number 20120187583
- Publication date Jul 26, 2012
- Intel Corporation
- Prasanna Karpur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES TO STIFFEN INTEGRATED CIRCUIT PACKAGE
- Publication number 20110147912
- Publication date Jun 23, 2011
- Prasanna Karpur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGING USING AN INTERPOSER SUCH AS A SILICON BASED IN...
- Publication number 20110067236
- Publication date Mar 24, 2011
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked-chip packages in package-on-package apparatus, methods of a...
- Publication number 20100327419
- Publication date Dec 30, 2010
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF STIFFENING CORELESS PACKAGE SUBSTRATE
- Publication number 20100301492
- Publication date Dec 2, 2010
- Sriram Muthukumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL-METAL BONDING OF COMPLIANT INTERCONNECT
- Publication number 20100237505
- Publication date Sep 23, 2010
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of stiffening coreless package substrate
- Publication number 20100207265
- Publication date Aug 19, 2010
- Sriram Muthukumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thin Silicon based substrate
- Publication number 20080303159
- Publication date Dec 11, 2008
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGING USING AN INTERPOSER SUCH AS A SILICON BASED IN...
- Publication number 20080295325
- Publication date Dec 4, 2008
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGING USING AN INTERPOSER SUCH AS A SILICON BASED IN...
- Publication number 20080295329
- Publication date Dec 4, 2008
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electropolishing metal features on a semiconductor wafer
- Publication number 20080217183
- Publication date Sep 11, 2008
- Sriram Muthukumar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH PERFORMANCE INTEGRATED INDUCTOR
- Publication number 20080023791
- Publication date Jan 31, 2008
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INDUCTORS AND COMPLIANT INTERCONNECTS FOR SEMICONDUCTOR...
- Publication number 20070290362
- Publication date Dec 20, 2007
- Rockwell Hsu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Composite metal layer formed using metal nanocrystalline particles...
- Publication number 20060290000
- Publication date Dec 28, 2006
- Wojciech Worwag
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Process for coating thick resist over polymer features
- Publication number 20060286487
- Publication date Dec 21, 2006
- Charles D. Hill
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High performance integrated inductor
- Publication number 20060270065
- Publication date Nov 30, 2006
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Offset solder bump method and apparatus
- Publication number 20060264021
- Publication date Nov 23, 2006
- Intel Corporation
- Mohammad M. Farahani
- H01 - BASIC ELECTRIC ELEMENTS

Sriram Muthukumar

Person

Patents Grantslast 30 patents

Multi-configurable sensing array and methods of using same

Stacked-chip packages in package-on-package apparatus, methods of a...

Stacked-chip packages in package-on-package apparatus, methods of a...

Warpage compensation metal for wafer level packaging technology

Biosensing system and methods using electron-ionic mechanisms at fl...

Wafer level device and method with cantilever pillar structure

Integrated WLUF and SOD process

Integrated WLUF and SOD process

Method of stiffening coreless package substrate

Methods and apparatuses to stiffen integrated circuit package

Methods for making multi-chip packaging using an interposer

Methods and apparatuses to stiffen integrated circuit package

Metal-metal bonding of compliant interconnect

Multi-chip packaging using an interposer such as a silicon based in...

Method of stiffening coreless package substrate

Multi-chip packaging using an interposer with through-vias

Metal-metal bonding of compliant interconnect

Thin silicon based substrate

Thin silicon based substrate

Compliant multi-composition interconnects

Compliant interconnects for semiconductors and micromachines

High performance integrated inductor

Integrated inductors and compliant interconnects for semiconductor...

Method of manufacturing of thin based substrate

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR MULTI-MODAL AND MULTIPLEXED ELECTROCHEMICAL...

MULTI-CONFIGURABLE SENSING ARRAY AND METHODS OF USING SAME

MACHINE-LEARNING BASED BIOSENSOR SYSTEM

DISEASE DIAGNOSTICS USING A MULTI-CONFIGURABLE SENSING ARRAY

HIGH DENSITY ANALOG MULTIPEXING

MULTI-CONFIGURABLE SENSING ARRAY AND METHODS OF USING SAME

STACKED-CHIP PACKAGES IN PACKAGE-ON-PACKAGE APPARATUS, METHODS OF A...

WEARABLE BIOSENSORS WITH ROOM TEMPERATURE IONIC LIQUID BUFFER

INTEGRATED WLUF AND SOD PROCESS

BIOSENSING SYSTEM AND METHODS USING ELECTRON IONIC MECHANISMS AT FL...

WAFER LEVEL DEVICE AND METHOD WITH CANTILEVER PILLAR STRUCTURE

INTEGRATED WLUF AND SOD PROCESS

STACKED-CHIP PACKAGES IN PACKAGE-ON-PACKAGE APPARATUS, METHODS OF A...

METHODS AND APPARATUSES TO STIFFEN INTEGRATED CIRCUIT PACKAGE

METHODS AND APPARATUSES TO STIFFEN INTEGRATED CIRCUIT PACKAGE

MULTI-CHIP PACKAGING USING AN INTERPOSER SUCH AS A SILICON BASED IN...

Stacked-chip packages in package-on-package apparatus, methods of a...

METHOD OF STIFFENING CORELESS PACKAGE SUBSTRATE

METAL-METAL BONDING OF COMPLIANT INTERCONNECT

Method of stiffening coreless package substrate

Thin Silicon based substrate

MULTI-CHIP PACKAGING USING AN INTERPOSER SUCH AS A SILICON BASED IN...

MULTI-CHIP PACKAGING USING AN INTERPOSER SUCH AS A SILICON BASED IN...

Electropolishing metal features on a semiconductor wafer

HIGH PERFORMANCE INTEGRATED INDUCTOR

INTEGRATED INDUCTORS AND COMPLIANT INTERCONNECTS FOR SEMICONDUCTOR...

Composite metal layer formed using metal nanocrystalline particles...

Process for coating thick resist over polymer features

High performance integrated inductor

Offset solder bump method and apparatus