Stanford W. Crane, Jr.

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Backplane system having high-density electrical connectors
- Patent number 7,803,020
- Issue date Sep 28, 2010
- Stanford W. Crane, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die package for connection to a substrate
- Patent number 7,253,365
- Issue date Aug 7, 2007
- Quantum Leap Packaging, Inc.
- Stanford W. Crane, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip carrier affording a high-density external interface
- Patent number 7,183,646
- Issue date Feb 27, 2007
- Silicon Bandwidth, Inc.
- Stanford W. Crane, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic seal
- Patent number 7,135,768
- Issue date Nov 14, 2006
- Silicon Bandwidth Inc.
- Stanford W. Crane, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling capacitor for an integrated circuit and method of manufa...
- Patent number 7,123,465
- Issue date Oct 17, 2006
- Silicon Bandwidth, Inc.
- Stanford W. Crane, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backplane system having high-density electrical connectors
- Patent number 7,103,753
- Issue date Sep 5, 2006
- Silicon Bandwith Inc.
- Stanford W. Crane, Jr.
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High performance optoelectronic packaging assembly
- Patent number 7,070,340
- Issue date Jul 4, 2006
- Silicon Bandwidth Inc.
- Stanford W. Crane, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prefabricated semiconductor chip carrier
- Patent number 6,977,432
- Issue date Dec 20, 2005
- Quantum Leap Packaging, Inc.
- Stanford W. Crane, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modular coaxial electrical interconnect system having a modular fra...
- Patent number 6,905,367
- Issue date Jun 14, 2005
- Silicon Bandwidth, Inc.
- Stanford W. Crane, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for and method of manufacturing a semiconductor die carrier
- Patent number 6,857,173
- Issue date Feb 22, 2005
- Silicon Bandwidth, Inc.
- Stanford W. Crane, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device for radio frequency shielding
- Patent number 6,847,115
- Issue date Jan 25, 2005
- Silicon Bandwidth Inc.
- Stanford W. Crane, Jr.
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BACKPLANE SYSTEM HAVING HIGH-DENSITY ELECTRICAL CONNECTORS
- Publication number 20100323536
- Publication date Dec 23, 2010
- WOLPASS CAPITAL INV., L.L.C.
- Stanford W. Crane, JR.
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor die package having mesh power and ground planes
- Publication number 20020117751
- Publication date Aug 29, 2002
- Silicon Bandwidth, Inc.
- Stanford W. Crane, Jr.
- H01 - BASIC ELECTRIC ELEMENTS

Stanford W. Crane, Jr.

Person

Patents Grantslast 30 patents

Backplane system having high-density electrical connectors

Die package for connection to a substrate

Semiconductor chip carrier affording a high-density external interface

Hermetic seal

Decoupling capacitor for an integrated circuit and method of manufa...

Backplane system having high-density electrical connectors

High performance optoelectronic packaging assembly

Prefabricated semiconductor chip carrier

Modular coaxial electrical interconnect system having a modular fra...

Apparatus for and method of manufacturing a semiconductor die carrier

Packaged semiconductor device for radio frequency shielding

Patents Applicationslast 30 patents

BACKPLANE SYSTEM HAVING HIGH-DENSITY ELECTRICAL CONNECTORS

Semiconductor die package having mesh power and ground planes