Stefan Landau

Person

Wehrheim, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Laminate electronic device
- Patent number 10,020,245
- Issue date Jul 10, 2018
- Infineon Technologies AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a sealant layer including carbon direct...
- Patent number 9,953,952
- Issue date Apr 24, 2018
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module
- Patent number 9,147,649
- Issue date Sep 29, 2015
- Infineon Technologies AG
- Stefan Landau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for providing a reliable light emitting diode sem...
- Patent number 9,142,739
- Issue date Sep 22, 2015
- Infineon Technologies AG
- Andreas Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 8,980,687
- Issue date Mar 17, 2015
- Infineon Technologies AG
- Ivan Nikitin
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor chip package and method
- Patent number 8,969,985
- Issue date Mar 3, 2015
- Infineon Technologies AG
- Volker Strutz
- G01 - MEASURING TESTING
Information Patent Grant
Device including two semiconductor chips and manufacturing thereof
- Patent number 8,866,302
- Issue date Oct 21, 2014
- Infineon Technologies AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 8,836,113
- Issue date Sep 16, 2014
- Infineon Technologies AG
- Stefan Landau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 8,828,804
- Issue date Sep 9, 2014
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including two semiconductor chips and manufacturing thereof
- Patent number 8,816,504
- Issue date Aug 26, 2014
- Infineon Technologies AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die arrangement and method of forming a die arrangement
- Patent number 8,686,569
- Issue date Apr 1, 2014
- Infineon Technologies AG
- Frank Daeche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Housing for a chip arrangement and a method for forming a housing
- Patent number 8,687,370
- Issue date Apr 1, 2014
- Infineon Technologies AG
- Stefan Landau
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of manufacturing a laminate electronic device including sepa...
- Patent number 8,664,043
- Issue date Mar 4, 2014
- Infineon Technologies AG
- Henrik Ewe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module
- Patent number 8,253,241
- Issue date Aug 28, 2012
- Infineon Technologies AG
- Stefan Landau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an integrated circuit module
- Patent number 8,129,225
- Issue date Mar 6, 2012
- Infineon Technologies AG
- Stefan Landau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 8,101,463
- Issue date Jan 24, 2012
- Infineon Technologies AG
- Manfred Mengel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,097,944
- Issue date Jan 17, 2012
- Infineon Technologies AG
- Stefan Landau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including first and second carriers
- Patent number 8,097,959
- Issue date Jan 17, 2012
- Infineon Technologies AG
- Stefan Landau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a power semiconductor module comprising surfac...
- Patent number 7,955,901
- Issue date Jun 7, 2011
- Infineon Technologies AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making semiconductor devices employing first and second c...
- Patent number 7,955,954
- Issue date Jun 7, 2011
- Infineon Technologies AG
- Stefan Landau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module
- Patent number 7,872,350
- Issue date Jan 18, 2011
- Qimonda AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with conductive die attach material
- Patent number 7,667,337
- Issue date Feb 23, 2010
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module having surface-mountable flat external c...
- Patent number 7,479,691
- Issue date Jan 20, 2009
- Infineon Technologies AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LAMINATE ELECTRONIC DEVICE
- Publication number 20140117565
- Publication date May 1, 2014
- INFINEON TECHNOLOGIES AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENTS AND A METHOD FOR FORMING A CHIP ARRANGEMENT
- Publication number 20130341780
- Publication date Dec 26, 2013
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Providing a Reliable Light Emitting Diode Sem...
- Publication number 20130277704
- Publication date Oct 24, 2013
- Andreas EDER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Module
- Publication number 20130264721
- Publication date Oct 10, 2013
- INFINEON TECHNOLOGIES AG
- Stefan Landau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing Thereof
- Publication number 20130200502
- Publication date Aug 8, 2013
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- B32 - LAYERED PRODUCTS
Information Patent Application
HOUSING FOR A CHIP ARRANGEMENT AND A METHOD FOR FORMING A HOUSING
- Publication number 20130120940
- Publication date May 16, 2013
- INFINEON TECHNOLOGIES AG
- Stefan Landau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package and Method
- Publication number 20130049746
- Publication date Feb 28, 2013
- INFINEON TECHNOLOGIES AG
- Volker Strutz
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC MODULE
- Publication number 20120306069
- Publication date Dec 6, 2012
- INFINEON TECHNOLOGIES AG
- Stefan Landau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Including Two Semiconductor Chips and Manufacturing Thereof
- Publication number 20120187565
- Publication date Jul 26, 2012
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ARRANGEMENT AND METHOD OF FORMING A DIE ARRANGEMENT
- Publication number 20120146201
- Publication date Jun 14, 2012
- INFINEON TECHNOLOGIES AG
- Frank Daeche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR PROVIDING A RELIABLE LIGHT EMITTING DIODE SEM...
- Publication number 20120061700
- Publication date Mar 15, 2012
- Andreas EDER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE ELECTRONIC DEVICE
- Publication number 20110127675
- Publication date Jun 2, 2011
- INFINEON TECHNOLOGIES AG
- Henrik Ewe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD INCLUDING FIRST AND SECOND CARRIERS
- Publication number 20110031597
- Publication date Feb 10, 2011
- INFINEON TECHNOLOGIES AG
- Stefan Landau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100276797
- Publication date Nov 4, 2010
- INFINEON TECHNOLOGIES AG
- Stefan Landau
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100200978
- Publication date Aug 12, 2010
- INFINEON TECHNOLOGIES AG
- Manfred Mengel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100044841
- Publication date Feb 25, 2010
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE
- Publication number 20090289354
- Publication date Nov 26, 2009
- INFINEON TECHNOLOGIES AG
- Stefan Landau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20090273066
- Publication date Nov 5, 2009
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD INCLUDING FIRST AND SECOND CARRIERS
- Publication number 20090256247
- Publication date Oct 15, 2009
- INFINEON TECHNOLOGIES AG
- Stefan Landau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE
- Publication number 20090189291
- Publication date Jul 30, 2009
- INFINEON TECHNOLOGIES AG
- Stefan Landau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A POWER SEMICONDUCTOR MODULE COMPRISING SURFAC...
- Publication number 20090093090
- Publication date Apr 9, 2009
- INFINEON TECHNOLOGIES AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONDUCTIVE DIE ATTACH MATERIAL
- Publication number 20090079088
- Publication date Mar 26, 2009
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing an Integrated Circuit Module
- Publication number 20090042337
- Publication date Feb 12, 2009
- INFINEON TECHNOLOGIES AG
- Stefan Landau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Module
- Publication number 20080251912
- Publication date Oct 16, 2008
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with a semiconductor chip stack and plastic ho...
- Publication number 20080067667
- Publication date Mar 20, 2008
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Component Arrangement
- Publication number 20080061449
- Publication date Mar 13, 2008
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power semiconductor module having surface-mountable flat external c...
- Publication number 20070246808
- Publication date Oct 25, 2007
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR PRODUCING POWER SEMICONDUCTOR COMPONENTS USING A MARKER
- Publication number 20070241328
- Publication date Oct 18, 2007
- Infineon Technologies AG
- Stefan Landau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Stefan Landau

Person

Patents Grantslast 30 patents

Laminate electronic device

Semiconductor device having a sealant layer including carbon direct...

Multi-chip module

Method and system for providing a reliable light emitting diode sem...

Semiconductor device and method of manufacturing thereof

Semiconductor chip package and method

Device including two semiconductor chips and manufacturing thereof

Electronic module

Semiconductor device and method

Device including two semiconductor chips and manufacturing thereof

Die arrangement and method of forming a die arrangement

Housing for a chip arrangement and a method for forming a housing

Method of manufacturing a laminate electronic device including sepa...

Electronic module

Method of manufacturing an integrated circuit module

Method of manufacturing a semiconductor device

Semiconductor device

Semiconductor device including first and second carriers

Method for producing a power semiconductor module comprising surfac...

Method of making semiconductor devices employing first and second c...

Multi-chip module

Semiconductor device with conductive die attach material

Power semiconductor module having surface-mountable flat external c...

Patents Applicationslast 30 patents

LAMINATE ELECTRONIC DEVICE

CHIP ARRANGEMENTS AND A METHOD FOR FORMING A CHIP ARRANGEMENT

Method and System for Providing a Reliable Light Emitting Diode Sem...

Electronic Module

Semiconductor Device and Method of Manufacturing Thereof

HOUSING FOR A CHIP ARRANGEMENT AND A METHOD FOR FORMING A HOUSING

Semiconductor Chip Package and Method

ELECTRONIC MODULE

Device Including Two Semiconductor Chips and Manufacturing Thereof

DIE ARRANGEMENT AND METHOD OF FORMING A DIE ARRANGEMENT

METHOD AND SYSTEM FOR PROVIDING A RELIABLE LIGHT EMITTING DIODE SEM...

LAMINATE ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND METHOD INCLUDING FIRST AND SECOND CARRIERS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

ELECTRONIC MODULE

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR DEVICE AND METHOD INCLUDING FIRST AND SECOND CARRIERS

MULTI-CHIP MODULE

METHOD FOR PRODUCING A POWER SEMICONDUCTOR MODULE COMPRISING SURFAC...

SEMICONDUCTOR DEVICE WITH CONDUCTIVE DIE ATTACH MATERIAL

Method of Manufacturing an Integrated Circuit Module

Multi-Chip Module

Semiconductor device with a semiconductor chip stack and plastic ho...

Semiconductor Component Arrangement

Power semiconductor module having surface-mountable flat external c...

PROCESS FOR PRODUCING POWER SEMICONDUCTOR COMPONENTS USING A MARKER