Stefan Macheiner

Person

Kissing, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Molded semiconductor package having a negative standoff
- Patent number 11,862,541
- Issue date Jan 2, 2024
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip to chip interconnect in encapsulant of molded semiconductor pa...
- Patent number 11,569,196
- Issue date Jan 31, 2023
- Infineon Technologies AG
- Khay Chwan Saw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame-based semiconductor package
- Patent number 11,469,161
- Issue date Oct 11, 2022
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe leads having fully plated end faces
- Patent number 11,342,252
- Issue date May 24, 2022
- Infineon Technologies AG
- Stefan Macheiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with top or bottom side cooling and method fo...
- Patent number 11,145,578
- Issue date Oct 12, 2021
- Infineon Technologies AG
- Stefan Macheiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip to chip interconnect in encapsulant of molded semiconductor pa...
- Patent number 11,133,281
- Issue date Sep 28, 2021
- Infineon Technologies AG
- Khay Chwan Saw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having leads with a negative standoff
- Patent number 11,101,201
- Issue date Aug 24, 2021
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe leads having fully plated end faces
- Patent number 10,796,986
- Issue date Oct 6, 2020
- Infineon Technologies AG
- Stefan Macheiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a filled conductive cavity
- Patent number 10,770,399
- Issue date Sep 8, 2020
- Infineon Technologies AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for multiphase circuitry device
- Patent number 10,147,703
- Issue date Dec 4, 2018
- Infineon Technologies AG
- Stefan Macheiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced solder pad
- Patent number 10,121,753
- Issue date Nov 6, 2018
- Infineon Technologies AG
- Jens Oetjen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overmolded substrate-chip arrangement with heat sink
- Patent number 9,385,059
- Issue date Jul 5, 2016
- Infineon Technologies AG
- Peter Ossimitz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor arrangement
- Patent number 9,087,829
- Issue date Jul 21, 2015
- Infineon Technologies AG
- Stefan Macheiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package
- Patent number 8,704,269
- Issue date Apr 22, 2014
- Infineon Technologies AG
- Stefan Macheiner
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING A SEMICONDUCTOR DIE SANDWICHED BETW...
- Publication number 20250105108
- Publication date Mar 27, 2025
- INFINEON TECHNOLOGIES AG
- Stefan MACHEINER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods for Manufacturing Thereof
- Publication number 20230095545
- Publication date Mar 30, 2023
- Paul Armand Calo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME-BASED SEMICONDUCTOR PACKAGE
- Publication number 20220068773
- Publication date Mar 3, 2022
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip to Chip Interconnect in Encapsulant of Molded Semiconductor Pa...
- Publication number 20210391298
- Publication date Dec 16, 2021
- Khay Chwan Saw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE HAVING A NEGATIVE STANDOFF
- Publication number 20210358836
- Publication date Nov 18, 2021
- INFINEON TECHNOLOGIES AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Top or Bottom Side Cooling
- Publication number 20210090979
- Publication date Mar 25, 2021
- Stefan Macheiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME LEADS HAVING FULLY PLATED END FACES
- Publication number 20210020553
- Publication date Jan 21, 2021
- INFINEON TECHNOLOGIES AG
- Stefan Macheiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip to Chip Interconnect in Encapsulant of Molded Semiconductor Pa...
- Publication number 20200321276
- Publication date Oct 8, 2020
- Khay Chwan Saw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having Leads with a Negative Standoff
- Publication number 20200279795
- Publication date Sep 3, 2020
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having a Filled Conductive Cavity
- Publication number 20200258842
- Publication date Aug 13, 2020
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Semiconductor Package with C-Wing and Gull-Wing Leads
- Publication number 20190139869
- Publication date May 9, 2019
- INFINEON TECHNOLOGIES AG
- Cher Hau Danny Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR MULTIPHASE CIRCUITRY DEVICE
- Publication number 20180277513
- Publication date Sep 27, 2018
- INFINEON TECHNOLOGIES AG
- Stefan Macheiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED SOLDER PAD
- Publication number 20180012854
- Publication date Jan 11, 2018
- INFINEON TECHNOLOGIES AG
- Jens Oetjen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME LEADS HAVING FULLY PLATED END FACES
- Publication number 20170271246
- Publication date Sep 21, 2017
- INFINEON TECHNOLOGIES AG
- Stefan Macheiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP SEMICONDUCTOR POWER PACKAGE
- Publication number 20170213783
- Publication date Jul 27, 2017
- INFINEON TECHNOLOGIES AG
- Andreas Meiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Overmolded substrate-chip arrangement with heat sink
- Publication number 20150062825
- Publication date Mar 5, 2015
- INFINEON TECHNOLOGIES AG
- Peter Ossimitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Arrangement
- Publication number 20130032855
- Publication date Feb 7, 2013
- INFINEON TECHNOLOGIES AG
- Stefan Macheiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE
- Publication number 20120161128
- Publication date Jun 28, 2012
- INFINEON TECHNOLOGIES AG
- Stefan Macheiner
- H01 - BASIC ELECTRIC ELEMENTS

Stefan Macheiner

Person

Patents Grantslast 30 patents

Molded semiconductor package having a negative standoff

Chip to chip interconnect in encapsulant of molded semiconductor pa...

Lead frame-based semiconductor package

Leadframe leads having fully plated end faces

Semiconductor package with top or bottom side cooling and method fo...

Chip to chip interconnect in encapsulant of molded semiconductor pa...

Semiconductor package having leads with a negative standoff

Leadframe leads having fully plated end faces

Semiconductor package having a filled conductive cavity

Semiconductor package for multiphase circuitry device

Enhanced solder pad

Overmolded substrate-chip arrangement with heat sink

Semiconductor arrangement

Die package

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE COMPRISING A SEMICONDUCTOR DIE SANDWICHED BETW...

Semiconductor Packages and Methods for Manufacturing Thereof

LEAD FRAME-BASED SEMICONDUCTOR PACKAGE

Chip to Chip Interconnect in Encapsulant of Molded Semiconductor Pa...

MOLDED SEMICONDUCTOR PACKAGE HAVING A NEGATIVE STANDOFF

Semiconductor Package with Top or Bottom Side Cooling

LEADFRAME LEADS HAVING FULLY PLATED END FACES

Chip to Chip Interconnect in Encapsulant of Molded Semiconductor Pa...

Semiconductor Package Having Leads with a Negative Standoff

Semiconductor Package Having a Filled Conductive Cavity

Molded Semiconductor Package with C-Wing and Gull-Wing Leads

SEMICONDUCTOR PACKAGE FOR MULTIPHASE CIRCUITRY DEVICE

ENHANCED SOLDER PAD

LEADFRAME LEADS HAVING FULLY PLATED END FACES

MULTI-CHIP SEMICONDUCTOR POWER PACKAGE

Overmolded substrate-chip arrangement with heat sink

Semiconductor Arrangement

DIE PACKAGE