Stefan Martens

Person

Muenchen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Module and method of manufacturing a module
- Patent number 9,691,687
- Issue date Jun 27, 2017
- Infineon Technologies AG
- Daniel Kehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded package structure with glue bleed stopper for sealing a MEMs...
- Patent number 9,475,691
- Issue date Oct 25, 2016
- Infineon Technologies AG
- Kok Yau Chua
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having an identification mark
- Patent number 9,312,226
- Issue date Apr 12, 2016
- Infineon Technologies AG
- Stefan Martens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing process for semiconductor devices
- Patent number 9,099,547
- Issue date Aug 4, 2015
- Infineon Technologies AG
- Stefan Martens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separation of semiconductor devices from a wafer carrier
- Patent number 8,883,565
- Issue date Nov 11, 2014
- Infineon Technologies AG
- Mathias Vaupel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module and method of manufacturing a module
- Patent number 8,749,056
- Issue date Jun 10, 2014
- Infineon Technologies AG
- Daniel Kehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 8,535,983
- Issue date Sep 17, 2013
- Infineon Technologies AG
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PROCESSING A CHIP
- Publication number 20150087131
- Publication date Mar 26, 2015
- INFINEON TECHNOLOGIES AG
- Stefan Martens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module and Method of Manufacturing a Module
- Publication number 20140231974
- Publication date Aug 21, 2014
- INFINEON TECHNOLOGIES AG
- Daniel Kehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having an Identification Mark
- Publication number 20140167272
- Publication date Jun 19, 2014
- INFINEON TECHNOLOGIES AG
- Stefan Martens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Separation of Semiconductor Devices from a Wafer Carrier
- Publication number 20130084658
- Publication date Apr 4, 2013
- INFINEON TECHNOLOGIES AG
- Mathias Vaupel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Testing Process for Semiconductor Devices
- Publication number 20130084659
- Publication date Apr 4, 2013
- INFINEON TECHNOLOGIES AG
- Stefan Martens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Semiconductor Device
- Publication number 20120309130
- Publication date Dec 6, 2012
- INFINEON TECHNOLOGIES AG
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module and Method of Manufacturing a Module
- Publication number 20120299170
- Publication date Nov 29, 2012
- Daniel Kehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Semiconductor Device
- Publication number 20120273935
- Publication date Nov 1, 2012
- Stefan Martens
- H01 - BASIC ELECTRIC ELEMENTS

Stefan Martens

Person

Patents Grantslast 30 patents

Module and method of manufacturing a module

Molded package structure with glue bleed stopper for sealing a MEMs...

Semiconductor device having an identification mark

Testing process for semiconductor devices

Separation of semiconductor devices from a wafer carrier

Module and method of manufacturing a module

Method of manufacturing a semiconductor device

Patents Applicationslast 30 patents

METHOD FOR PROCESSING A CHIP

Module and Method of Manufacturing a Module

Semiconductor Device Having an Identification Mark

Separation of Semiconductor Devices from a Wafer Carrier

Testing Process for Semiconductor Devices

Method of Manufacturing a Semiconductor Device

Module and Method of Manufacturing a Module

Semiconductor Device and Method of Making a Semiconductor Device