Stefan Miethaner

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a package having an adhesion promoter
- Patent number 12,288,727
- Issue date Apr 29, 2025
- Infineon Technologies AG
- Edmund Riedl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a package having an adhesion promoter
- Patent number 12,230,547
- Issue date Feb 18, 2025
- Infineon Technologies AG
- Edmund Riedl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inorganic encapsulant for electronic component with adhesion promoter
- Patent number 11,652,012
- Issue date May 16, 2023
- Infineon Technologies AG
- Edmund Riedl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat lead package formation method
- Patent number 11,652,084
- Issue date May 16, 2023
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-purpose non-linear semiconductor package assembly line
- Patent number 11,302,668
- Issue date Apr 12, 2022
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molding compound and semiconductor package with a molding compound
- Patent number 11,069,626
- Issue date Jul 20, 2021
- Infineon Technologies AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-purpose non-linear semiconductor package assembly line
- Patent number 10,566,309
- Issue date Feb 18, 2020
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion manipulation methods and related apparatuses and systems for se...
- Patent number 10,497,587
- Issue date Dec 3, 2019
- Infineon Technologies AG
- Rabie Djemour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for writing to magnetoresistive memory cells and magnetoresi...
- Patent number 7,408,803
- Issue date Aug 5, 2008
- Infineon Technologies AG
- Martin Freitag
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory cell arrangement and method of fabricating it
- Patent number 6,943,393
- Issue date Sep 13, 2005
- Infineon Technologies AG
- Stefan Miethaner
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory cell configuration and method for operating the configuration
- Patent number 6,574,138
- Issue date Jun 3, 2003
- Infineon Technologies AG
- Siegfried Schwarzl
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of fabricating a micro-technical structure, and micro-techni...
- Patent number 6,458,603
- Issue date Oct 1, 2002
- Infineon Technologies AG
- Alfred Kersch
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of Manufacturing a Package Having an Adhesion Promoter
- Publication number 20230260860
- Publication date Aug 17, 2023
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flat Lead Package Formation Method
- Publication number 20210043603
- Publication date Feb 11, 2021
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inorganic Encapsulant for Electronic Component with Adhesion Promoter
- Publication number 20200411400
- Publication date Dec 31, 2020
- Edmund Riedl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Purpose Non-Linear Semiconductor Package Assembly Line
- Publication number 20200203310
- Publication date Jun 25, 2020
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ion Manipulation Methods and Related Apparatuses and Systems for Se...
- Publication number 20190385866
- Publication date Dec 19, 2019
- INFINEON TECHNOLOGIES AG
- Rabie Djemour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molding Compound and Semiconductor Package with a Molding Compound
- Publication number 20190318996
- Publication date Oct 17, 2019
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Purpose Non-Linear Semiconductor Package Assembly Line
- Publication number 20180096966
- Publication date Apr 5, 2018
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for writing to magnetoresistive memory cells and magnetoresi...
- Publication number 20060171196
- Publication date Aug 3, 2006
- Martin Freitag
- G11 - INFORMATION STORAGE
Information Patent Application
Memory cell arrangement and method for the production thereof
- Publication number 20040004884
- Publication date Jan 8, 2004
- Stefan Miethaner
- G11 - INFORMATION STORAGE
Information Patent Application
Memory cell configuration and method for operating the configuration
- Publication number 20020154537
- Publication date Oct 24, 2002
- Siegfried Schwarzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating a micro-technical structure, and micro-techni...
- Publication number 20020042158
- Publication date Apr 11, 2002
- Alfred Kersch
- H01 - BASIC ELECTRIC ELEMENTS

Stefan Miethaner

Person

Patents Grantslast 30 patents

Method of manufacturing a package having an adhesion promoter

Method of manufacturing a package having an adhesion promoter

Inorganic encapsulant for electronic component with adhesion promoter

Flat lead package formation method

Multi-purpose non-linear semiconductor package assembly line

Molding compound and semiconductor package with a molding compound

Multi-purpose non-linear semiconductor package assembly line

Ion manipulation methods and related apparatuses and systems for se...

Method for writing to magnetoresistive memory cells and magnetoresi...

Memory cell arrangement and method of fabricating it

Memory cell configuration and method for operating the configuration

Method of fabricating a micro-technical structure, and micro-techni...

Patents Applicationslast 30 patents

Method of Manufacturing a Package Having an Adhesion Promoter

Flat Lead Package Formation Method

Inorganic Encapsulant for Electronic Component with Adhesion Promoter

Multi-Purpose Non-Linear Semiconductor Package Assembly Line

Ion Manipulation Methods and Related Apparatuses and Systems for Se...

Molding Compound and Semiconductor Package with a Molding Compound

Multi-Purpose Non-Linear Semiconductor Package Assembly Line

Method for writing to magnetoresistive memory cells and magnetoresi...

Memory cell arrangement and method for the production thereof

Memory cell configuration and method for operating the configuration

Method of fabricating a micro-technical structure, and micro-techni...