Stefan Reif

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Munich, DE

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Patents Applicationslast 30 patents

Information Patent Application
THIN CLIENT FORM FACTOR ASSEMBLY
- Publication number 20230317705
- Publication date Oct 5, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED TERMINAL DEVICE WITH SPLIT SIGNAL AND POWER ROUTING
- Publication number 20230317562
- Publication date Oct 5, 2023
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE LAYERS FOR STRESS MONITORING AND METHOD
- Publication number 20230307300
- Publication date Sep 28, 2023
- Intel Corporation
- Jan Proschwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR IMPROVED HEAT DISSIPATION AND METHOD
- Publication number 20230307313
- Publication date Sep 28, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING NANOWIRE AND SOLDER INTERCONNECTS
- Publication number 20230299032
- Publication date Sep 21, 2023
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS