Stefanie M. Lotz

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 12,113,026
- Issue date Oct 8, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density organic bridge device and method
- Patent number 12,002,762
- Issue date Jun 4, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 11,876,053
- Issue date Jan 16, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 11,824,008
- Issue date Nov 21, 2023
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 10,923,429
- Issue date Feb 16, 2021
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package substrate
- Patent number 10,770,387
- Issue date Sep 8, 2020
- Intel Corporation
- Qinglei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 10,763,216
- Issue date Sep 1, 2020
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density organic bridge device and method
- Patent number 10,672,713
- Issue date Jun 2, 2020
- Intel Corporation
- Mihir K. Roy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 10,510,669
- Issue date Dec 17, 2019
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package substrate
- Patent number 10,325,843
- Issue date Jun 18, 2019
- Intel Corporation
- Qinglei Zhang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High density organic bridge device and method
- Patent number 10,103,105
- Issue date Oct 16, 2018
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 9,875,969
- Issue date Jan 23, 2018
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package substrate
- Patent number 9,831,169
- Issue date Nov 28, 2017
- Intel Corporation
- Qinglei Zhang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High density organic bridge device and method
- Patent number 9,548,264
- Issue date Jan 17, 2017
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package substrate
- Patent number 9,508,636
- Issue date Nov 29, 2016
- Intel Corporation
- Qinglei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density organic bridge device and method
- Patent number 9,496,209
- Issue date Nov 15, 2016
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser cavity formation for embedded dies or components in substrate...
- Patent number 9,202,803
- Issue date Dec 1, 2015
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate with high density interconnect design to capture...
- Patent number 9,119,313
- Issue date Aug 25, 2015
- Intel Corporation
- Chong Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 8,227,904
- Issue date Jul 24, 2012
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser ablation and imprinting hybrid processing for fabrication of...
- Patent number 7,332,429
- Issue date Feb 19, 2008
- Intel Corporation
- Stefanie M. Lotz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20240429173
- Publication date Dec 26, 2024
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD
- Publication number 20240321762
- Publication date Sep 26, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20240038671
- Publication date Feb 1, 2024
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20230016326
- Publication date Jan 19, 2023
- Intel Corporation
- Henning M. Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20210134726
- Publication date May 6, 2021
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20200357747
- Publication date Nov 12, 2020
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD
- Publication number 20200294924
- Publication date Sep 17, 2020
- Intel Corporation
- Mihir K. Roy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20200075493
- Publication date Mar 5, 2020
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SUBSTRATE
- Publication number 20190304892
- Publication date Oct 3, 2019
- Intel Corporation
- Qinglei ZHANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD
- Publication number 20190019755
- Publication date Jan 17, 2019
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20180145031
- Publication date May 24, 2018
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SUBSTRATE
- Publication number 20180138118
- Publication date May 17, 2018
- Intel Corporation
- Qinglei ZHANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD
- Publication number 20170125349
- Publication date May 4, 2017
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SUBSTRATE
- Publication number 20160379923
- Publication date Dec 29, 2016
- Intel Corporation
- Qinglei ZHANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD
- Publication number 20160133552
- Publication date May 12, 2016
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SUBSTRATE
- Publication number 20150318236
- Publication date Nov 5, 2015
- Qinglei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER CAVITY FORMATION FOR EMBEDDED DIES OR COMPONENTS IN SUBSTRATE...
- Publication number 20150279817
- Publication date Oct 1, 2015
- Chong ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF A SUBSTRATE WITH AN EMBEDDED DIE USING PROJECTION PA...
- Publication number 20150048515
- Publication date Feb 19, 2015
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH HIGH DENSITY INTERCONNECT DESIGN TO CAPTURE...
- Publication number 20140321091
- Publication date Oct 30, 2014
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20120261838
- Publication date Oct 18, 2012
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip package and method of providing die-to-die interconnects...
- Publication number 20100327424
- Publication date Dec 30, 2010
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser patterning and conductive interconnect/materials forming tech...
- Publication number 20080001297
- Publication date Jan 3, 2008
- Stefanie Lotz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser ablation and imprinting hybrid processing for fabrication of...
- Publication number 20070158854
- Publication date Jul 12, 2007
- Intel Corporation
- Stefanie M. Lotz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Stefanie M. Lotz

Person

Patents Grantslast 30 patents

Multi-chip package and method of providing die-to-die interconnects...

High density organic bridge device and method

Multi-chip package and method of providing die-to-die interconnects...

Multi-chip package and method of providing die-to-die interconnects...

Multi-chip package and method of providing die-to-die interconnects...

Integrated circuit package substrate

Multi-chip package and method of providing die-to-die interconnects...

High density organic bridge device and method

Multi-chip package and method of providing die-to-die interconnects...

Integrated circuit package substrate

High density organic bridge device and method

Multi-chip package and method of providing die-to-die interconnects...

Integrated circuit package substrate

High density organic bridge device and method

Integrated circuit package substrate

High density organic bridge device and method

Laser cavity formation for embedded dies or components in substrate...

Package substrate with high density interconnect design to capture...

Multi-chip package and method of providing die-to-die interconnects...

Laser ablation and imprinting hybrid processing for fabrication of...

Patents Applicationslast 30 patents

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

INTEGRATED CIRCUIT PACKAGE SUBSTRATE

HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

INTEGRATED CIRCUIT PACKAGE SUBSTRATE

HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

INTEGRATED CIRCUIT PACKAGE SUBSTRATE

HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

INTEGRATED CIRCUIT PACKAGE SUBSTRATE

LASER CAVITY FORMATION FOR EMBEDDED DIES OR COMPONENTS IN SUBSTRATE...

FABRICATION OF A SUBSTRATE WITH AN EMBEDDED DIE USING PROJECTION PA...

PACKAGE SUBSTRATE WITH HIGH DENSITY INTERCONNECT DESIGN TO CAPTURE...

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

Multi-chip package and method of providing die-to-die interconnects...

Laser patterning and conductive interconnect/materials forming tech...

Laser ablation and imprinting hybrid processing for fabrication of...