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Steffen Kroehnert
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Dresden, DE
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device with chip mounted on a substrate
Patent number
8,410,595
Issue date
Apr 2, 2013
Qimonda AG
Steffen Kroehnert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging systems and methods
Patent number
8,004,072
Issue date
Aug 23, 2011
Qimonda AG
Harry Hedler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate for an FBGA semiconductor component
Patent number
7,518,220
Issue date
Apr 14, 2009
Infineon Technologies AG
Steffen Kroehnert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate-based IC package
Patent number
7,030,473
Issue date
Apr 18, 2006
Infineon Technologies AG
Martin Reiss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate-based chip package
Patent number
6,949,820
Issue date
Sep 27, 2005
Infineon Technologies AG
Martin Reiss
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Packaging Systems and Methods
Publication number
20100090322
Publication date
Apr 15, 2010
Harry Hedler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device with Chip Mounted on a Substrate
Publication number
20080157330
Publication date
Jul 3, 2008
Steffen Kroehnert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated chip device in a package
Publication number
20070090527
Publication date
Apr 26, 2007
Jochen Thomas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Manufacturing method for an electronic component assembly and corre...
Publication number
20060270109
Publication date
Nov 30, 2006
Stephan Blaszczak
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Method and casting mold for producing a protective layer on integra...
Publication number
20060255504
Publication date
Nov 16, 2006
Steffen Kroehnert
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
Substrate for producing a soldering connection to a second substrate
Publication number
20060237855
Publication date
Oct 26, 2006
Steffen Kroehnert
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Substrate for an FBGA semiconductor component
Publication number
20060180929
Publication date
Aug 17, 2006
Steffen Kroehnert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for producing an FBGA component and substrate for carrying o...
Publication number
20060180921
Publication date
Aug 17, 2006
Steffen Kroehnert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Substrate-based BGA package, in particular FBGA package
Publication number
20060017149
Publication date
Jan 26, 2006
Martin Reiss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Substrate-based die package with BGA or BGA-like components
Publication number
20050285247
Publication date
Dec 29, 2005
Martin Reiss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Arrangement for improving the reliability of semiconductor modules
Publication number
20050093175
Publication date
May 5, 2005
Martin Reiss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Substrate-based chip package
Publication number
20050006741
Publication date
Jan 13, 2005
Martin Reiss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Substrate-based IC package
Publication number
20040256705
Publication date
Dec 23, 2004
Martin Reiss
H01 - BASIC ELECTRIC ELEMENTS