Membership
Tour
Register
Log in
Stephan Blaszczak
Follow
Person
Freyburg, DE
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Silicone composition
Patent number
11,111,385
Issue date
Sep 7, 2021
OSRAM OLED GmbH
Hansjörg Schöll
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Package for semiconductor components and method for producing the same
Patent number
7,384,822
Issue date
Jun 10, 2008
Infineon Technologies AG
Juergen Zacherl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing a protection for chip edges and system for the...
Patent number
7,229,857
Issue date
Jun 12, 2007
Infineon Technologies AG
Juergen Zacherl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of producing an electronic component and a panel with a plur...
Patent number
7,223,639
Issue date
May 29, 2007
Infineon Technologies AG
Stephan Blaszczak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component and panel and method for producing the same
Patent number
7,034,383
Issue date
Apr 25, 2006
Infineon Technologies AG
Stephan Blaszczak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component with a semiconductor chip, method of producing...
Patent number
6,873,060
Issue date
Mar 29, 2005
Infineon Technologies AG
Stephan Blaszczak
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SILICONE COMPOSITION
Publication number
20190161614
Publication date
May 30, 2019
Osram Opto Semiconductors GmbH
Hansjörg Schöll
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF PRODUCING A LENS FOR AN OPTOELECTRONIC LIGHTING DEVICE
Publication number
20180143414
Publication date
May 24, 2018
Osram Opto Semiconductors GmbH
Hansjoerg Schoell
G02 - OPTICS
Information
Patent Application
Adhesion tape and method for mounting a chip onto a substrate
Publication number
20070221318
Publication date
Sep 27, 2007
Martin Reiss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for manufacturing a flip-chip package, substrate for manufac...
Publication number
20070224729
Publication date
Sep 27, 2007
Martin Reiss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Manufacturing method for an electronic component assembly and corre...
Publication number
20060270109
Publication date
Nov 30, 2006
Stephan Blaszczak
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Package for semiconductor components and method for producing the same
Publication number
20060138632
Publication date
Jun 29, 2006
Juergen Zacherl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Arrangement of a chip package constructed on a substrate and substr...
Publication number
20050121807
Publication date
Jun 9, 2005
Martin Reiss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Substrate-based package for integrated circuits
Publication number
20050104227
Publication date
May 19, 2005
Stephan Blaszczak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for producing an adhesive bond and adhesive bond between a c...
Publication number
20050098890
Publication date
May 12, 2005
Stephan Blaszczak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic component and panel and method for the production thereof
Publication number
20050087889
Publication date
Apr 28, 2005
Stephan Blaszczak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of producing an electronic component and a panel with a plur...
Publication number
20050067721
Publication date
Mar 31, 2005
Infineon Technologies AG
Stephan Blaszczak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Supporting structure for a chip and method for producing the same
Publication number
20040159928
Publication date
Aug 19, 2004
Infineon Technologies AG
Knut Kahlisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic component with a semiconductor chip, method of producing...
Publication number
20030218263
Publication date
Nov 27, 2003
Stephan Blaszczak
H01 - BASIC ELECTRIC ELEMENTS