Stephen B. ROBIE

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Cupertino, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of depositing copper using physical vapor deposition
- Patent number 9,728,414
- Issue date Aug 8, 2017
- Cypress Semiconductor Corporation
- Wen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing copper using physical vapor deposition
- Patent number 8,791,018
- Issue date Jul 29, 2014
- Spansion LLC
- Wen Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF DEPOSITING COPPER USING PHYSICAL VAPOR DEPOSITION
- Publication number 20140377949
- Publication date Dec 25, 2014
- Wen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITING COPPER USING PHYSICAL VAPOR DEPOSITION
- Publication number 20140377948
- Publication date Dec 25, 2014
- Wen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of depositing copper using physical vapor deposition
- Publication number 20080146028
- Publication date Jun 19, 2008
- Wen Yu
- H01 - BASIC ELECTRIC ELEMENTS