Stephen J. Benner

Person

Lansdale, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
System for measuring and controlling the level of vacuum applied to...
- Patent number 8,025,555
- Issue date Sep 27, 2011
- TBW Industries Inc.
- Stephen J. Benner
- B24 - GRINDING POLISHING
Information Patent Grant
Cleaning cup system for chemical mechanical planarization apparatus
- Patent number 7,913,705
- Issue date Mar 29, 2011
- TBW Industries, Inc.
- Stephen J. Benner
- B24 - GRINDING POLISHING
Information Patent Grant
Vacuum line clean-out separator system
- Patent number 7,909,910
- Issue date Mar 22, 2011
- TBW Industries Inc.
- Stephen J. Benner
- B04 - CENTRIFUGAL APPARATUS OR MACHINES FOR CARRYING-OUT PHYSICAL OR CHEMICAL...
Information Patent Grant
Method for controlling the forces applied to a vacuum-assisted pad...
- Patent number 7,901,267
- Issue date Mar 8, 2011
- TBW Industries, Inc.
- Stephen J. Benner
- B24 - GRINDING POLISHING
Information Patent Grant
Vacuum-assisted pad conditioning system
- Patent number 7,575,503
- Issue date Aug 18, 2009
- TBW Industries, Inc.
- Stephen J. Benner
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for controlling the forces applied to a vacuum-assisted p...
- Patent number 7,544,113
- Issue date Jun 9, 2009
- TBW Industries, Inc.
- Stephen J. Benner
- B24 - GRINDING POLISHING
Information Patent Grant
Vacuum-assisted pad conditioning system
- Patent number 7,258,600
- Issue date Aug 21, 2007
- TBW Industries, Inc.
- Stephen J. Benner
- B24 - GRINDING POLISHING
Information Patent Grant
Enhanced end effector arm arrangement for CMP pad conditioning
- Patent number 7,217,172
- Issue date May 15, 2007
- TBW Industries Inc.
- Stephen J. Benner
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical planarization process control utilizing in-situ...
- Patent number 7,166,014
- Issue date Jan 23, 2007
- TBW Industries Inc.
- Stephen J. Benner
- B24 - GRINDING POLISHING
Information Patent Grant
Vacuum-assisted pad conditioning system and method utilizing an ape...
- Patent number 7,052,371
- Issue date May 30, 2006
- TBW Industries Inc.
- Stephen J. Benner
- B24 - GRINDING POLISHING
Information Patent Grant
Multi-step, in-situ pad conditioning system and method for chemical...
- Patent number 7,040,967
- Issue date May 9, 2006
- TBW Industries Inc.
- Stephen J. Benner
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad conditioning system
- Patent number 6,508,697
- Issue date Jan 21, 2003
- Robert Lyle Benner
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Slurry Slip Stream Controller For CMP System
- Publication number 20170355059
- Publication date Dec 14, 2017
- Confluense LLC
- Stephen J. Benner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Active Tribology Management of CMP Polishing Material
- Publication number 20110177623
- Publication date Jul 21, 2011
- CONFLUENSE LLC
- Stephen J. Benner
- B24 - GRINDING POLISHING
Information Patent Application
Apertured Abrasive Disk Assembly With Improved Flow Dynamics
- Publication number 20110039485
- Publication date Feb 17, 2011
- Stephen J. Benner
- B24 - GRINDING POLISHING
Information Patent Application
In-line effluent analysis method and apparatus for CMP process control
- Publication number 20090287340
- Publication date Nov 19, 2009
- Confluense LLC
- Stephen J. Benner
- G05 - CONTROLLING REGULATING
Information Patent Application
Cleaning cup system for chemical mechanical planarization apparatus
- Publication number 20080202568
- Publication date Aug 28, 2008
- TBW Industries, Inc.
- Stephen J. Benner
- B24 - GRINDING POLISHING
Information Patent Application
Abrasive configuration for fluid dynamic removal of abraded materia...
- Publication number 20080160883
- Publication date Jul 3, 2008
- TBW Industries, Inc.
- Stephen J. Benner
- B24 - GRINDING POLISHING
Information Patent Application
Vacuum line clean-out separator system
- Publication number 20080092734
- Publication date Apr 24, 2008
- TBW Industries Inc.
- Stephen J. Benner
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Vacuum-assisted pad conditioning system and method utilizing an ape...
- Publication number 20070281592
- Publication date Dec 6, 2007
- Stephen J. Benner
- B24 - GRINDING POLISHING
Information Patent Application
Enhanced end effector arm arrangement for CMP pad conditioning
- Publication number 20070207705
- Publication date Sep 6, 2007
- Stephen J. Benner
- B24 - GRINDING POLISHING
Information Patent Application
Apertured conditioning brush for chemical mechanical planarization...
- Publication number 20070087672
- Publication date Apr 19, 2007
- TBW Industries, Inc.
- Stephen J. Benner
- B24 - GRINDING POLISHING
Information Patent Application
Enhanced end effector arm arrangement for CMP pad conditioning
- Publication number 20070010172
- Publication date Jan 11, 2007
- TBW Industries Inc.
- Stephen J. Benner
- B24 - GRINDING POLISHING
Information Patent Application
Multi-step, in-situ pad conditioning system and method for chemical...
- Publication number 20050186891
- Publication date Aug 25, 2005
- TBW Industries Inc.
- Stephen J. Benner
- B24 - GRINDING POLISHING
Information Patent Application
Chemical mechanical planarization process control utilizing in-situ...
- Publication number 20050164606
- Publication date Jul 28, 2005
- TBW Industries Inc.
- Stephen J. Benner
- B24 - GRINDING POLISHING
Information Patent Application
Method of using multiple, different slurries in a CMP polishing pro...
- Publication number 20040241989
- Publication date Dec 2, 2004
- Stephen J. Benner
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD CONDITIONING SYSTEM
- Publication number 20030013381
- Publication date Jan 16, 2003
- Robert Lyle Benner
- B24 - GRINDING POLISHING

Stephen J. Benner

Person

Patents Grantslast 30 patents

System for measuring and controlling the level of vacuum applied to...

Cleaning cup system for chemical mechanical planarization apparatus

Vacuum line clean-out separator system

Method for controlling the forces applied to a vacuum-assisted pad...

Vacuum-assisted pad conditioning system

Apparatus for controlling the forces applied to a vacuum-assisted p...

Vacuum-assisted pad conditioning system

Enhanced end effector arm arrangement for CMP pad conditioning

Chemical mechanical planarization process control utilizing in-situ...

Vacuum-assisted pad conditioning system and method utilizing an ape...

Multi-step, in-situ pad conditioning system and method for chemical...

Polishing pad conditioning system

Patents Applicationslast 30 patents

Slurry Slip Stream Controller For CMP System

Active Tribology Management of CMP Polishing Material

Apertured Abrasive Disk Assembly With Improved Flow Dynamics

In-line effluent analysis method and apparatus for CMP process control

Cleaning cup system for chemical mechanical planarization apparatus

Abrasive configuration for fluid dynamic removal of abraded materia...

Vacuum line clean-out separator system

Vacuum-assisted pad conditioning system and method utilizing an ape...

Enhanced end effector arm arrangement for CMP pad conditioning

Apertured conditioning brush for chemical mechanical planarization...

Enhanced end effector arm arrangement for CMP pad conditioning

Multi-step, in-situ pad conditioning system and method for chemical...

Chemical mechanical planarization process control utilizing in-situ...

Method of using multiple, different slurries in a CMP polishing pro...

POLISHING PAD CONDITIONING SYSTEM