Stephen J. Fuerniss

Person

Endicott, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Promoting adhesion between a polymer and a metallic substrate
- Patent number 6,908,684
- Issue date Jun 21, 2005
- International Business Machines Corporation
- Anastasios P. Angelopoulos
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Forming a through hole in a photoimageable dielectric structure
- Patent number 6,830,875
- Issue date Dec 14, 2004
- International Business Machines Corporation
- Stephen J. Fuerniss
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead protective coating composition, process and structure thereof
- Patent number 6,790,473
- Issue date Sep 14, 2004
- International Business Machines Corporation
- Konstantinos I. Papathomas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Promoting adhesion between a polymer and a metallic substrate
- Patent number 6,730,409
- Issue date May 4, 2004
- International Business Machines Corporation
- Anastasios P. Angelopoulos
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Dielectric structure and method of formation
- Patent number 6,699,350
- Issue date Mar 2, 2004
- International Business Machines Corporation
- Anilkumar C. Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through hole in a photoimageable dielectric structure with wired an...
- Patent number 6,521,844
- Issue date Feb 18, 2003
- International Business Machines Corporation
- Stephen J. Fuerniss
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric structure and method of formation
- Patent number 6,495,239
- Issue date Dec 17, 2002
- International Business Corporation
- Anilkumar C. Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for masking a hole in a substrate during plating
- Patent number 6,485,892
- Issue date Nov 26, 2002
- International Business Machines Corporation
- Lawrence Robert Blumberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gray scale etching for thin flexible interposer
- Patent number 6,156,484
- Issue date Dec 5, 2000
- International Business Machines Corporation
- Ernest Bassous
- G01 - MEASURING TESTING
Information Patent Grant
Component carrier with raised bonding sites
- Patent number 6,150,726
- Issue date Nov 21, 2000
- International Business Machines Corp.
- Natalie Barbara Feilchenfeld
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of planarizing a curved substrate and resulting structure
- Patent number 6,150,255
- Issue date Nov 21, 2000
- International Business Machines Corporation
- Francis Joseph Downes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulating a solder joint with a photo cured epoxy resin or cyanate
- Patent number 6,129,955
- Issue date Oct 10, 2000
- International Business Machines Corporation
- Konstantinos I. Papathomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for filling holes in printed wiring boards
- Patent number 6,015,520
- Issue date Jan 18, 2000
- International Business Machines Corporation
- Bernd Karl-Heinz Appelt
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of planarizing a curved substrate and resulting structure
- Patent number 5,940,729
- Issue date Aug 17, 1999
- International Business Machines Corp.
- Francis Joseph Downes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Toughened photosensitive polycyanurate resist, and structure made t...
- Patent number 5,919,596
- Issue date Jul 6, 1999
- International Business Machines Corporation
- Jeffrey C. Hedrick
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Chip carrier and cable assembly reinforced at edges
- Patent number 5,872,337
- Issue date Feb 16, 1999
- International Business Machines Corporation
- Donald Seton Farquhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a component carrier
- Patent number 5,759,737
- Issue date Jun 2, 1998
- International Business Machines Corporation
- Natalie Barbara Feilchenfeld
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Forming a polymide pattern on a substrate
- Patent number 4,883,744
- Issue date Nov 28, 1989
- International Business Machines Corporation
- Natalie B. Feilchenfeld
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
Promoting adhesion between a polymer and a metallic substrate
- Publication number 20040166438
- Publication date Aug 26, 2004
- International Business Machines Corporation
- Anastasios P. Angelopoulos
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Forming a through hole in a photoimageable dielectric structure
- Publication number 20030047357
- Publication date Mar 13, 2003
- Stephen J. Fuerniss
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Dielectric structure and method of formation
- Publication number 20030010440
- Publication date Jan 16, 2003
- Anilkumar C. Bhatt
- B32 - LAYERED PRODUCTS
Information Patent Application
Lead protective coating composition, process and structure thereof
- Publication number 20020132873
- Publication date Sep 19, 2002
- Konstantinos I. Papathomas
- H01 - BASIC ELECTRIC ELEMENTS

Stephen J. Fuerniss

Person

Patents Grantslast 30 patents

Promoting adhesion between a polymer and a metallic substrate

Forming a through hole in a photoimageable dielectric structure

Lead protective coating composition, process and structure thereof

Promoting adhesion between a polymer and a metallic substrate

Dielectric structure and method of formation

Through hole in a photoimageable dielectric structure with wired an...

Dielectric structure and method of formation

Method for masking a hole in a substrate during plating

Gray scale etching for thin flexible interposer

Component carrier with raised bonding sites

Method of planarizing a curved substrate and resulting structure

Encapsulating a solder joint with a photo cured epoxy resin or cyanate

Method for filling holes in printed wiring boards

Method of planarizing a curved substrate and resulting structure

Toughened photosensitive polycyanurate resist, and structure made t...

Chip carrier and cable assembly reinforced at edges

Method of making a component carrier

Forming a polymide pattern on a substrate

Patents Applicationslast 30 patents

Promoting adhesion between a polymer and a metallic substrate

Forming a through hole in a photoimageable dielectric structure

Dielectric structure and method of formation

Lead protective coating composition, process and structure thereof