Steve J. Bezuk

Person

Inver Grove Heights, MN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interface substrate and method of making the same
- Patent number 10,516,092
- Issue date Dec 24, 2019
- QUALCOMM Incorporated
- Jon Gregory Aday
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package without sidewall cracking
- Patent number 9,318,405
- Issue date Apr 19, 2016
- QUALCOMM Incorporated
- Jianwen Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising wires as vias in an encapsulation layer
- Patent number 9,209,110
- Issue date Dec 8, 2015
- QUALCOMM Incorporated
- Reynante Tamunan Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked redistribution layers on die
- Patent number 9,171,782
- Issue date Oct 27, 2015
- QUALCOMM Incorporated
- Christine Sung-An Hau-Riege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of stretching solder joints
- Patent number 5,441,195
- Issue date Aug 15, 1995
- Unisys Corporation
- Jerry I. Tustaniwskyj
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect for layered integrated circuit assembly
- Patent number 4,845,542
- Issue date Jul 4, 1989
- Unisys Corporation
- Steve J. Bezuk
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERFACE SUBSTRATE AND METHOD OF MAKING THE SAME
- Publication number 20200066964
- Publication date Feb 27, 2020
- QUALCOMM Incorporated
- Jon Gregory ADAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER (RDL) FAN-OUT WAFER LEVEL PACKAGING (FOWLP) ST...
- Publication number 20170373032
- Publication date Dec 28, 2017
- QUALCOMM Incorporated
- Jihoon OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERFACE SUBSTRATE AND METHOD OF MAKING THE SAME
- Publication number 20170323926
- Publication date Nov 9, 2017
- QUALCOMM Incorporated
- Jon Gregory ADAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING WIRES AS VIAS IN AN ENCAPSULATION LAYER
- Publication number 20150325496
- Publication date Nov 12, 2015
- QUALCOMM Incorporated
- Reynante Tamunan Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE AND FAN OUT RECONSTITUTION PROCESS FOR MAKING T...
- Publication number 20150318229
- Publication date Nov 5, 2015
- QUALCOMM Incorporated
- Jianwen XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED REDISTRIBUTION LAYERS ON DIE
- Publication number 20150041982
- Publication date Feb 12, 2015
- QUALCOMM Incorporated
- Christine Sung-An Hau-Riege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Vias Having More Than One Material
- Publication number 20110204517
- Publication date Aug 25, 2011
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS

Steve J. Bezuk

Person

Patents Grantslast 30 patents

Interface substrate and method of making the same

Wafer level package without sidewall cracking

Integrated device comprising wires as vias in an encapsulation layer

Stacked redistribution layers on die

Method of stretching solder joints

Interconnect for layered integrated circuit assembly

Patents Applicationslast 30 patents

INTERFACE SUBSTRATE AND METHOD OF MAKING THE SAME

REDISTRIBUTION LAYER (RDL) FAN-OUT WAFER LEVEL PACKAGING (FOWLP) ST...

INTERFACE SUBSTRATE AND METHOD OF MAKING THE SAME

INTEGRATED DEVICE COMPRISING WIRES AS VIAS IN AN ENCAPSULATION LAYER

WAFER LEVEL PACKAGE AND FAN OUT RECONSTITUTION PROCESS FOR MAKING T...

STACKED REDISTRIBUTION LAYERS ON DIE

Semiconductor Device with Vias Having More Than One Material