Steve Ostrander

Person

Hopewell Junction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi chip hardware security module
- Patent number 11,882,645
- Issue date Jan 23, 2024
- International Business Machines Corporation
- Sushumna Iruvanti
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mitigating moisture-driven degradation of features designed to prev...
- Patent number 11,569,181
- Issue date Jan 31, 2023
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer for die-to-die communication in an integrated circuit and me...
- Patent number 11,521,952
- Issue date Dec 6, 2022
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixture facilitating heat sink fabrication
- Patent number 11,404,287
- Issue date Aug 2, 2022
- International Business Machines Corporation
- Phillip D. Isaacs
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Stacked via rivets in chip hotspots
- Patent number 11,308,257
- Issue date Apr 19, 2022
- International Business Machines Corporation
- Dureseti Chidambarrao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mitigating thermal-mechanical strain and warpage of an organic lami...
- Patent number 11,239,183
- Issue date Feb 1, 2022
- International Business Machines Corporation
- Tuhin Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting a component to a substrate by adhesion to an oxidized so...
- Patent number 11,228,124
- Issue date Jan 18, 2022
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus having inter-chip stiffener
- Patent number 11,211,262
- Issue date Dec 28, 2021
- International Business Machines Corporation
- Tuhin Sinha
- G11 - INFORMATION STORAGE
Information Patent Grant
Direct bonded heterogeneous integration packaging structures
- Patent number 11,177,217
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure with controlled capillary coverage
- Patent number 11,152,226
- Issue date Oct 19, 2021
- International Business Machines Corporation
- Kevin Drummond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer for die-to-die communication in an integrated circuit
- Patent number 11,031,373
- Issue date Jun 8, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mitigating cracking within integrated circuit (IC) device carrier
- Patent number 10,985,129
- Issue date Apr 20, 2021
- International Business Machines Corporation
- Thomas E. Lombardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixture facilitating heat sink fabrication
- Patent number 10,978,313
- Issue date Apr 13, 2021
- International Business Machines Corporation
- Phillip D. Isaacs
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Multiple chip carrier for bridge assembly
- Patent number 10,916,507
- Issue date Feb 9, 2021
- International Business Machines Corporation
- Charles L Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mitigating moisture-driven degradation of features designed to prev...
- Patent number 10,892,233
- Issue date Jan 12, 2021
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Precision alignment of multi-chip high density interconnects
- Patent number 10,833,051
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multipart lid for a semiconductor package with multiple components
- Patent number 10,777,482
- Issue date Sep 15, 2020
- ELPIS TECHNOLOGIES INC.
- Charles L. Arvin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Direct bonded heterogeneous integration packaging structures
- Patent number 10,580,738
- Issue date Mar 3, 2020
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multipart lid for a semiconductor package with multiple components
- Patent number 10,325,830
- Issue date Jun 18, 2019
- International Business Machines Corporation
- Charles L. Arvin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Determining crackstop strength of integrated circuit assembly at th...
- Patent number 9,947,598
- Issue date Apr 17, 2018
- International Business Machines Corporation
- Krishna R. Tunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under die surface mounted electrical elements
- Patent number 9,601,423
- Issue date Mar 21, 2017
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for shaping a laminate substrate
- Patent number 9,543,253
- Issue date Jan 10, 2017
- GLOBALFOUNDRIES Inc.
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Determining magnitude of compressive loading
- Patent number 9,366,591
- Issue date Jun 14, 2016
- International Business Machines Corporation
- Paul F. Bodenweber
- G01 - MEASURING TESTING
Information Patent Grant
Precast thermal interface adhesive for easy and repeated, separatio...
- Patent number 9,272,498
- Issue date Mar 1, 2016
- GLOBALFOUNDRIES Inc.
- Evan George Colgan
- B32 - LAYERED PRODUCTS
Information Patent Grant
Laminate peripheral clamping to control microelectronic module BSM...
- Patent number 9,219,051
- Issue date Dec 22, 2015
- GLOBALFOUNDRIES Inc.
- Stephanie Allard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fixture for shaping a laminate substrate
- Patent number 9,059,240
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Edmund D. Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for shaping a laminate substrate
- Patent number 9,048,245
- Issue date Jun 2, 2015
- International Business Machines Corporation
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip electronic packages and methods of manufacture
- Patent number 8,906,809
- Issue date Dec 9, 2014
- International Business Machines Corporation
- Martin M. Beaumier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip electronic packages and methods of manufacture
- Patent number 8,900,927
- Issue date Dec 2, 2014
- International Business Machines Corporation
- Martin M. Beaumier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Determining magnitude of compressive loading
- Patent number 8,794,079
- Issue date Aug 5, 2014
- International Business Machines Corporation
- Paul F. Bodenweber
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
MULTI CHIP HARDWARE SECURITY MODULE
- Publication number 20230130104
- Publication date Apr 27, 2023
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICOMPONENT MODULE DESIGN AND FABRICATION
- Publication number 20220308564
- Publication date Sep 29, 2022
- International Business Machines Corporation
- Kirk D. Peterson
- G05 - CONTROLLING REGULATING
Information Patent Application
MITIGATING THERMAL-MECHANICAL STRAIN AND WARPAGE OF AN ORGANIC LAMI...
- Publication number 20210242139
- Publication date Aug 5, 2021
- International Business Machines Corporation
- Tuhin Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CORNER GUARD FOR CHIP-PACKAGE INTERACTION FAILURE MITIGATION
- Publication number 20210233824
- Publication date Jul 29, 2021
- International Business Machines Corporation
- Shidong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS HAVING INTER-CHIP STIFFENER
- Publication number 20210225665
- Publication date Jul 22, 2021
- International Business Machines Corporation
- TUHIN SINHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER FOR DIE-TO-DIE COMMUNICATION IN AN INTEGRATED CIRCUIT
- Publication number 20210175207
- Publication date Jun 10, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATING MOISTURE-DRIVEN DEGRADATION OF FEATURES DESIGNED TO PREV...
- Publication number 20210118819
- Publication date Apr 22, 2021
- International Business Machines Corporation
- SUSHUMNA IRUVANTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE WITH CONTROLLED CAPILLARY COVERAGE
- Publication number 20210111039
- Publication date Apr 15, 2021
- International Business Machines Corporation
- Kevin Drummond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXTURE FACILITATING HEAT SINK FABRICATION
- Publication number 20210111037
- Publication date Apr 15, 2021
- International Business Machines Corporation
- Phillip D. ISAACS
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
Mitigating Cracking Within Integrated Circuit (IC) Device Carrier
- Publication number 20200328177
- Publication date Oct 15, 2020
- Thomas E. Lombardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER FOR DIE-TO-DIE COMMUNICATION IN AN INTEGRATED CIRCUIT
- Publication number 20200312812
- Publication date Oct 1, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRECISION ALIGNMENT OF MULTI-CHIP HIGH DENSITY INTERCONNECTS
- Publication number 20200243479
- Publication date Jul 30, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE CHIP CARRIER FOR BRIDGE ASSEMBLY
- Publication number 20200176383
- Publication date Jun 4, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED HETEROGENEOUS INTEGRATION PACKAGING STRUCTURES
- Publication number 20200144187
- Publication date May 7, 2020
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATING MOISTURE-DRIVEN DEGRADATION OF FEATURES DESIGNED TO PREV...
- Publication number 20200135662
- Publication date Apr 30, 2020
- International Business Machines Corporation
- SUSHUMNA IRUVANTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED HETEROGENEOUS INTEGRATION PACKAGING STRUCTURES
- Publication number 20190295952
- Publication date Sep 26, 2019
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXTURE FACILITATING HEAT SINK FABRICATION
- Publication number 20190259632
- Publication date Aug 22, 2019
- International Business Machines Corporation
- Phillip D. ISAACS
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
MULTIPART LID FOR A SEMICONDUCTOR PACKAGE WITH MULTIPLE COMPONENTS
- Publication number 20190259683
- Publication date Aug 22, 2019
- International Business Machines Corporation
- CHARLES L. ARVIN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MULTIPART LID FOR A SEMICONDUCTOR PACKAGE WITH MULTIPLE COMPONENTS
- Publication number 20190164864
- Publication date May 30, 2019
- International Business Machines Corporation
- CHARLES L. ARVIN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
METHOD FOR SHAPING A LAMINATE SUBSTRATE
- Publication number 20150136838
- Publication date May 21, 2015
- International Business Machines Corporation
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE PERIPHERAL CLAMPING TO CONTROL MICROELECTRONIC MODULE BSM...
- Publication number 20140359996
- Publication date Dec 11, 2014
- Stephanie Allard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETERMINING MAGNITUDE OF COMPRESSIVE LOADING
- Publication number 20140331792
- Publication date Nov 13, 2014
- Paul F. Bodenweber
- G01 - MEASURING TESTING
Information Patent Application
FIXTURE FOR SHAPING A LAMINATE SUBSTRATE
- Publication number 20130323345
- Publication date Dec 5, 2013
- International Business Machines Corporation
- Edmund D. Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SHAPING A LAMINATE SUBSTRATE
- Publication number 20130320069
- Publication date Dec 5, 2013
- International Business Machines Corporation
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETERMINING MAGNITUDE OF COMPRESSIVE LOADING
- Publication number 20130112006
- Publication date May 9, 2013
- International Business Machines Corporation
- PAUL F. BODENWEBER
- G01 - MEASURING TESTING
Information Patent Application
PRECAST THERMAL INTERFACE ADHESIVE FOR EASY AND REPEATED, SEPARATIO...
- Publication number 20120276375
- Publication date Nov 1, 2012
- International Business Machines Corporation
- Evan George Colgan
- B32 - LAYERED PRODUCTS
Information Patent Application
MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE
- Publication number 20120241944
- Publication date Sep 27, 2012
- International Business Machines Corporation
- Martin M. BEAUMIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLEMENTING LOADING AND HEAT REMOVAL FOR HUB MODULE ASSEMBLY
- Publication number 20120147563
- Publication date Jun 14, 2012
- International Business Machines Corporation
- John L. Colbert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
UNDERFILL METHOD AND CHIP PACKAGE
- Publication number 20120119353
- Publication date May 17, 2012
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE
- Publication number 20120039046
- Publication date Feb 16, 2012
- International Business Machines Corporation
- Martin M. BEAUMIER
- H01 - BASIC ELECTRIC ELEMENTS

Steve Ostrander

Person

Patents Grantslast 30 patents

Multi chip hardware security module

Mitigating moisture-driven degradation of features designed to prev...

Spacer for die-to-die communication in an integrated circuit and me...

Fixture facilitating heat sink fabrication

Stacked via rivets in chip hotspots

Mitigating thermal-mechanical strain and warpage of an organic lami...

Connecting a component to a substrate by adhesion to an oxidized so...

Electronic apparatus having inter-chip stiffener

Direct bonded heterogeneous integration packaging structures

Structure with controlled capillary coverage

Spacer for die-to-die communication in an integrated circuit

Mitigating cracking within integrated circuit (IC) device carrier

Fixture facilitating heat sink fabrication

Multiple chip carrier for bridge assembly

Mitigating moisture-driven degradation of features designed to prev...

Precision alignment of multi-chip high density interconnects

Multipart lid for a semiconductor package with multiple components

Direct bonded heterogeneous integration packaging structures

Multipart lid for a semiconductor package with multiple components

Determining crackstop strength of integrated circuit assembly at th...

Under die surface mounted electrical elements

Method for shaping a laminate substrate

Determining magnitude of compressive loading

Precast thermal interface adhesive for easy and repeated, separatio...

Laminate peripheral clamping to control microelectronic module BSM...

Fixture for shaping a laminate substrate

Method for shaping a laminate substrate

Multichip electronic packages and methods of manufacture

Multichip electronic packages and methods of manufacture

Determining magnitude of compressive loading

Patents Applicationslast 30 patents

MULTI CHIP HARDWARE SECURITY MODULE

MULTICOMPONENT MODULE DESIGN AND FABRICATION

MITIGATING THERMAL-MECHANICAL STRAIN AND WARPAGE OF AN ORGANIC LAMI...

CHIP CORNER GUARD FOR CHIP-PACKAGE INTERACTION FAILURE MITIGATION

ELECTRONIC APPARATUS HAVING INTER-CHIP STIFFENER

SPACER FOR DIE-TO-DIE COMMUNICATION IN AN INTEGRATED CIRCUIT

MITIGATING MOISTURE-DRIVEN DEGRADATION OF FEATURES DESIGNED TO PREV...

STRUCTURE WITH CONTROLLED CAPILLARY COVERAGE

FIXTURE FACILITATING HEAT SINK FABRICATION

Mitigating Cracking Within Integrated Circuit (IC) Device Carrier

SPACER FOR DIE-TO-DIE COMMUNICATION IN AN INTEGRATED CIRCUIT

PRECISION ALIGNMENT OF MULTI-CHIP HIGH DENSITY INTERCONNECTS

MULTIPLE CHIP CARRIER FOR BRIDGE ASSEMBLY

DIRECT BONDED HETEROGENEOUS INTEGRATION PACKAGING STRUCTURES

MITIGATING MOISTURE-DRIVEN DEGRADATION OF FEATURES DESIGNED TO PREV...

DIRECT BONDED HETEROGENEOUS INTEGRATION PACKAGING STRUCTURES

FIXTURE FACILITATING HEAT SINK FABRICATION

MULTIPART LID FOR A SEMICONDUCTOR PACKAGE WITH MULTIPLE COMPONENTS

MULTIPART LID FOR A SEMICONDUCTOR PACKAGE WITH MULTIPLE COMPONENTS

METHOD FOR SHAPING A LAMINATE SUBSTRATE

LAMINATE PERIPHERAL CLAMPING TO CONTROL MICROELECTRONIC MODULE BSM...

DETERMINING MAGNITUDE OF COMPRESSIVE LOADING

FIXTURE FOR SHAPING A LAMINATE SUBSTRATE

METHOD FOR SHAPING A LAMINATE SUBSTRATE

DETERMINING MAGNITUDE OF COMPRESSIVE LOADING

PRECAST THERMAL INTERFACE ADHESIVE FOR EASY AND REPEATED, SEPARATIO...

MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE

IMPLEMENTING LOADING AND HEAT REMOVAL FOR HUB MODULE ASSEMBLY

UNDERFILL METHOD AND CHIP PACKAGE

MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE