Steve S. Cho

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB...
- Patent number 12,068,172
- Issue date Aug 20, 2024
- Intel Corporation
- Tarek A. Ibrahim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protruding SN substrate features for epoxy flow control
- Patent number 12,009,271
- Issue date Jun 11, 2024
- Intel Corporation
- Edvin Cetegen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface finishes with low RBTV for fine and mixed bump pitch archit...
- Patent number 11,935,857
- Issue date Mar 19, 2024
- Intel Corporation
- Kristof Darmawaikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corner guard for improved electroplated first level interconnect bu...
- Patent number 11,776,864
- Issue date Oct 3, 2023
- Intel Corporation
- Jacob Vehonsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,735,558
- Issue date Aug 22, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration resistant and profile consistent contact arrays
- Patent number 11,699,648
- Issue date Jul 11, 2023
- Tahoe Research, LTD.
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface finishes with low rBTV for fine and mixed bump pitch archit...
- Patent number 11,488,918
- Issue date Nov 1, 2022
- Intel Corporation
- Kristof Darmawaikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,373,972
- Issue date Jun 28, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration resistant and profile consistent contact arrays
- Patent number 11,309,239
- Issue date Apr 19, 2022
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
First layer interconnect first on carrier approach for EMIB patch
- Patent number 11,088,103
- Issue date Aug 10, 2021
- Intel Corporation
- Changhua Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration resistant and profile consistent contact arrays
- Patent number 10,854,541
- Issue date Dec 1, 2020
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration resistant and profile consistent contact arrays
- Patent number 10,431,537
- Issue date Oct 1, 2019
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper seed layer and nickel-tin microbump structures
- Patent number 10,297,563
- Issue date May 21, 2019
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR LAYER WITH DRY DEPOSITION LAYER
- Publication number 20250006671
- Publication date Jan 2, 2025
- Intel Corporation
- Marcel Arlan Wall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL
- Publication number 20240258183
- Publication date Aug 1, 2024
- Intel Corporation
- Edvin CETEGEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS
- Publication number 20240194548
- Publication date Jun 13, 2024
- Intel Corporation
- Kristof Darmawikarta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLYTIC SURFACE FINISH ARCHITECTURE
- Publication number 20240105575
- Publication date Mar 28, 2024
- Intel Corporation
- Jason M. GAMBA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNEC...
- Publication number 20240096809
- Publication date Mar 21, 2024
- Intel Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING ONE OR MORE ELECTRICAL INTERCONNECTS
- Publication number 20240006298
- Publication date Jan 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STAT...
- Publication number 20230343723
- Publication date Oct 26, 2023
- Intel Corporation
- Nicholas NEAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD...
- Publication number 20230343769
- Publication date Oct 26, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE DEFECTS IN INTERCONNECTS BETWEEN S...
- Publication number 20230097624
- Publication date Mar 30, 2023
- Intel Corporation
- Kyle McElhinny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE DEFECTS IN INTERCONNECTS BETWEEN S...
- Publication number 20230096835
- Publication date Mar 30, 2023
- Intel Corporation
- Kyle McElhinny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE DEFECTS IN INTERCONNECTS BETWEEN SE...
- Publication number 20230095281
- Publication date Mar 30, 2023
- Intel Corporation
- Kyle McElhinny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEFORMABLE SEMICONDUCTOR DEVICE CONNECTION
- Publication number 20230086180
- Publication date Mar 23, 2023
- Intel Corporation
- Onur Ozkan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package Having Internal I/O Structures With Modu...
- Publication number 20230086649
- Publication date Mar 23, 2023
- Intel Corporation
- Onur OZKAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIRST LEVEL INTERCONNECT UNDER BUMP METALLIZATIONS FOR FINE PITCH H...
- Publication number 20230091379
- Publication date Mar 23, 2023
- Intel Corporation
- Liang HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIRST LAYER INTERCONNECT FIRST ON CARRIER APPROACH FOR EMIB PATCH
- Publication number 20230027030
- Publication date Jan 26, 2023
- Intel Corporation
- Changhua LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FINISHES WITH LOW RBTV FOR FINE AND MIXED BUMP PITCH ARCHIT...
- Publication number 20230015619
- Publication date Jan 19, 2023
- Intel Corporation
- Kristof DARMAWAIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20220270998
- Publication date Aug 25, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS
- Publication number 20220199515
- Publication date Jun 23, 2022
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20210391294
- Publication date Dec 16, 2021
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIRST LAYER INTERCONNECT FIRST ON CARRIER APPROACH FOR EMIB PATCH
- Publication number 20210343673
- Publication date Nov 4, 2021
- Intel Corporation
- Changhua LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ATTACHMENT AND/OR STOP STRUCTURES
- Publication number 20210066162
- Publication date Mar 4, 2021
- Intel Corporation
- Sergio A. CHAN ARGUEDAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STAT...
- Publication number 20210035921
- Publication date Feb 4, 2021
- Intel Corporation
- Nicholas NEAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SACRIFICIAL PADS TO PREVENT GALVANIC CORROSION OF FLI BUMPS IN EMIB...
- Publication number 20210035818
- Publication date Feb 4, 2021
- Intel Corporation
- Tarek A. IBRAHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS
- Publication number 20210035901
- Publication date Feb 4, 2021
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL
- Publication number 20210020531
- Publication date Jan 21, 2021
- Intel Corporation
- Edvin CETEGEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORNER GUARD FOR IMPROVED ELECTROPLATED FIRST LEVEL INTERCONNECT BU...
- Publication number 20210020532
- Publication date Jan 21, 2021
- Intel Corporation
- Jacob VEHONSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIRST LAYER INTERCONNECT FIRST ON CARRIER APPROACH FOR EMIB PATCH
- Publication number 20200286847
- Publication date Sep 10, 2020
- Intel Corporation
- Changhua LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FINISHES WITH LOW RBTV FOR FINE AND MIXED BUMP PITCH ARCHIT...
- Publication number 20200135679
- Publication date Apr 30, 2020
- Intel Corporation
- Kristof DARMAWAIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS
- Publication number 20190393145
- Publication date Dec 26, 2019
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NICKEL-TIN MICROBUMP STRUCTURES AND METHOD OF MAKING SAME
- Publication number 20190244922
- Publication date Aug 8, 2019
- Intel Corporation
- Rahul JAIN
- H01 - BASIC ELECTRIC ELEMENTS

Steve S. Cho

Person

Patents Grantslast 30 patents

Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB...

Protruding SN substrate features for epoxy flow control

Surface finishes with low RBTV for fine and mixed bump pitch archit...

Corner guard for improved electroplated first level interconnect bu...

Microelectronic structures including bridges

Electromigration resistant and profile consistent contact arrays

Surface finishes with low rBTV for fine and mixed bump pitch archit...

Microelectronic structures including bridges

Electromigration resistant and profile consistent contact arrays

First layer interconnect first on carrier approach for EMIB patch

Electromigration resistant and profile consistent contact arrays

Electromigration resistant and profile consistent contact arrays

Copper seed layer and nickel-tin microbump structures

Patents Applicationslast 30 patents

SEMICONDUCTOR LAYER WITH DRY DEPOSITION LAYER

PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL

APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS

ELECTROLYTIC SURFACE FINISH ARCHITECTURE

MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNEC...

SUBSTRATE HAVING ONE OR MORE ELECTRICAL INTERCONNECTS

SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STAT...

PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD...

METHODS AND APPARATUS TO REDUCE DEFECTS IN INTERCONNECTS BETWEEN S...

METHODS AND APPARATUS TO REDUCE DEFECTS IN INTERCONNECTS BETWEEN S...

METHODS AND APPARATUS TO REDUCE DEFECTS IN INTERCONNECTS BETWEEN SE...

DEFORMABLE SEMICONDUCTOR DEVICE CONNECTION

Semiconductor Chip Package Having Internal I/O Structures With Modu...

FIRST LEVEL INTERCONNECT UNDER BUMP METALLIZATIONS FOR FINE PITCH H...

FIRST LAYER INTERCONNECT FIRST ON CARRIER APPROACH FOR EMIB PATCH

SURFACE FINISHES WITH LOW RBTV FOR FINE AND MIXED BUMP PITCH ARCHIT...

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

FIRST LAYER INTERCONNECT FIRST ON CARRIER APPROACH FOR EMIB PATCH

SEMICONDUCTOR PACKAGE WITH ATTACHMENT AND/OR STOP STRUCTURES

SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STAT...

SACRIFICIAL PADS TO PREVENT GALVANIC CORROSION OF FLI BUMPS IN EMIB...

ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS

PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL

CORNER GUARD FOR IMPROVED ELECTROPLATED FIRST LEVEL INTERCONNECT BU...

FIRST LAYER INTERCONNECT FIRST ON CARRIER APPROACH FOR EMIB PATCH

SURFACE FINISHES WITH LOW RBTV FOR FINE AND MIXED BUMP PITCH ARCHIT...

ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS

NICKEL-TIN MICROBUMP STRUCTURES AND METHOD OF MAKING SAME