Steven A. KLEIN

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Compression mounted technology (CMT) socket retention mechanisms to...
- Patent number 12,127,363
- Issue date Oct 22, 2024
- Intel Corporation
- Feifei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided socket device with corrugation structures and shield str...
- Patent number 12,009,612
- Issue date Jun 11, 2024
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided socket device with corrugation structures
- Patent number 11,916,322
- Issue date Feb 27, 2024
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Varied ball ball-grid-array (BGA) packages
- Patent number 11,916,003
- Issue date Feb 27, 2024
- Intel Corporation
- Xiao Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socket load regulation utilizing CPU carriers with shim components
- Patent number 11,818,832
- Issue date Nov 14, 2023
- Intel Corporation
- Feroz Mohammad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket loading mechanism for passive or active socket and package c...
- Patent number 11,646,244
- Issue date May 9, 2023
- Intel Corporation
- Steven A. Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package socket housing to enhance package cooling
- Patent number 11,581,671
- Issue date Feb 14, 2023
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure features to alter the shape of a socket
- Patent number 11,569,596
- Issue date Jan 31, 2023
- Intel Corporation
- Steven A. Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Membrane test for mechanical testing of stretchable electronics
- Patent number 10,634,594
- Issue date Apr 28, 2020
- Intel Corporation
- Ravindranth V. Mahajan
- G01 - MEASURING TESTING
Information Patent Grant
Electronic device, socket, and spacer to alter socket profile
- Patent number 10,455,685
- Issue date Oct 22, 2019
- Intel Corporation
- Steven A. Klein
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS TO IMPROVE THERMAL DISSIPATION AND MECHANICAL...
- Publication number 20250014967
- Publication date Jan 9, 2025
- Intel Corporation
- Kyle Jordan Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING CARRIERS WITH INCORPORATED SU...
- Publication number 20240357744
- Publication date Oct 24, 2024
- Intel Corporation
- Rick Canham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH DAMPENERS TO REDUCE VIBRATION EFFECTS
- Publication number 20240355702
- Publication date Oct 24, 2024
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE STRESS BETWEEN SOCKETS AND ASSOCIAT...
- Publication number 20240355758
- Publication date Oct 24, 2024
- Intel Corporation
- Steven Adam Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAMPING ASSEMBLIES FOR HEAT SINKS AND RELATED METHODS
- Publication number 20240349457
- Publication date Oct 17, 2024
- Phil Geng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID METAL CONNECTION DEVICE AND METHOD
- Publication number 20240297119
- Publication date Sep 5, 2024
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBST...
- Publication number 20240222288
- Publication date Jul 4, 2024
- Intel Corporation
- David Shia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES
- Publication number 20240162134
- Publication date May 16, 2024
- Intel Corporation
- Xiao LU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOCKET INTERCONNECT STRUCTURES AND RELATED METHODS
- Publication number 20240113479
- Publication date Apr 4, 2024
- Intel Corporation
- Kai Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENOUS SOCKET CONTACT FOR ELECTRICAL AND MECHANICAL PERFORMAN...
- Publication number 20220407254
- Publication date Dec 22, 2022
- Intel Corporation
- Zhichao Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPRESSION MOUNTED TECHNOLOGY (CMT) SOCKET RETENTION MECHANISMS TO...
- Publication number 20220102887
- Publication date Mar 31, 2022
- Intel Corporation
- Feifei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED SOCKET DEVICE WITH CORRUGATION STRUCTURES
- Publication number 20220102883
- Publication date Mar 31, 2022
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED SOCKET DEVICE WITH CORRUGATION STRUCTURES AND SHIELD STR...
- Publication number 20220102892
- Publication date Mar 31, 2022
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SOCKET PIN FOR SELF-RETENTION TO A CONDUCTIVE INTERPOSER
- Publication number 20220069532
- Publication date Mar 3, 2022
- Intel Corporation
- Feroz Mohammad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE FEATURES TO ALTER THE SHAPE OF A SOCKET
- Publication number 20210305731
- Publication date Sep 30, 2021
- Intel Corporation
- Steven A. KLEIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET LOAD REGULATION UTILIZING CPU CARRIERS WITH SHIM COMPONENTS
- Publication number 20210307153
- Publication date Sep 30, 2021
- Intel Corporation
- Feroz MOHAMMAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOADING FRAME FOR HIGH I/O COUNT PACKAGED SEMICONDUCTOR CHIP
- Publication number 20210183737
- Publication date Jun 17, 2021
- Intel Corporation
- Jeffory L. SMALLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES
- Publication number 20210082798
- Publication date Mar 18, 2021
- Intel Corporation
- Xiao LU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOCKET LOADING MECHANISM FOR PASSIVE OR ACTIVE SOCKET AND PACKAGE C...
- Publication number 20200411410
- Publication date Dec 31, 2020
- Intel Corporation
- Steven A. Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SOCKET HOUSING TO ENHANCE PACKAGE COOLING
- Publication number 20200303852
- Publication date Sep 24, 2020
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, SYSTEM AND METHOD FOR DETECTING DEGRADATION OF A FLEXIBLE C...
- Publication number 20180089984
- Publication date Mar 29, 2018
- Intel Corporation
- Vijay Krishnan Subramanian
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC ASSEMBLY COMPONENTS WITH CORNER ADHESIVE FOR WARPAGE RED...
- Publication number 20170287873
- Publication date Oct 5, 2017
- Santosh Sankarasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVABLE IC PACKAGE STIFFENER
- Publication number 20170287799
- Publication date Oct 5, 2017
- Steven A. Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lateral Expansion Apparatus for Mechanical Testing of Stretchable E...
- Publication number 20170268972
- Publication date Sep 21, 2017
- Intel Corporation
- Vijay Krishnan SUBRAMANIAN
- G01 - MEASURING TESTING
Information Patent Application
Inflatable Bladder Based Mechanical Testing for Stretchable Electro...
- Publication number 20170269017
- Publication date Sep 21, 2017
- Intel Corporation
- Steven A. KLEIN
- G01 - MEASURING TESTING
Information Patent Application
Membrane test for Mechanical Testing of Stretchable Electronics
- Publication number 20170268971
- Publication date Sep 21, 2017
- Intel Corporation
- Ravindranth V. MAHAJAN
- G01 - MEASURING TESTING

Steven A. KLEIN

Person

Patents Grantslast 30 patents

Compression mounted technology (CMT) socket retention mechanisms to...

Dual-sided socket device with corrugation structures and shield str...

Dual-sided socket device with corrugation structures

Varied ball ball-grid-array (BGA) packages

Socket load regulation utilizing CPU carriers with shim components

Socket loading mechanism for passive or active socket and package c...

Integrated circuit package socket housing to enhance package cooling

Pressure features to alter the shape of a socket

Membrane test for mechanical testing of stretchable electronics

Electronic device, socket, and spacer to alter socket profile

Patents Applicationslast 30 patents

METHODS AND APPARATUS TO IMPROVE THERMAL DISSIPATION AND MECHANICAL...

INTEGRATED CIRCUIT PACKAGES INCLUDING CARRIERS WITH INCORPORATED SU...

INTEGRATED CIRCUIT PACKAGES WITH DAMPENERS TO REDUCE VIBRATION EFFECTS

METHODS AND APPARATUS TO REDUCE STRESS BETWEEN SOCKETS AND ASSOCIAT...

DAMPING ASSEMBLIES FOR HEAT SINKS AND RELATED METHODS

LIQUID METAL CONNECTION DEVICE AND METHOD

SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBST...

VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES

SOCKET INTERCONNECT STRUCTURES AND RELATED METHODS

HETEROGENOUS SOCKET CONTACT FOR ELECTRICAL AND MECHANICAL PERFORMAN...

COMPRESSION MOUNTED TECHNOLOGY (CMT) SOCKET RETENTION MECHANISMS TO...

DUAL-SIDED SOCKET DEVICE WITH CORRUGATION STRUCTURES

DUAL-SIDED SOCKET DEVICE WITH CORRUGATION STRUCTURES AND SHIELD STR...

ELECTRONIC SOCKET PIN FOR SELF-RETENTION TO A CONDUCTIVE INTERPOSER

PRESSURE FEATURES TO ALTER THE SHAPE OF A SOCKET

SOCKET LOAD REGULATION UTILIZING CPU CARRIERS WITH SHIM COMPONENTS

LOADING FRAME FOR HIGH I/O COUNT PACKAGED SEMICONDUCTOR CHIP

VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES

SOCKET LOADING MECHANISM FOR PASSIVE OR ACTIVE SOCKET AND PACKAGE C...

INTEGRATED CIRCUIT PACKAGE SOCKET HOUSING TO ENHANCE PACKAGE COOLING

DEVICE, SYSTEM AND METHOD FOR DETECTING DEGRADATION OF A FLEXIBLE C...

ELECTRONIC ASSEMBLY COMPONENTS WITH CORNER ADHESIVE FOR WARPAGE RED...

REMOVABLE IC PACKAGE STIFFENER

Lateral Expansion Apparatus for Mechanical Testing of Stretchable E...

Inflatable Bladder Based Mechanical Testing for Stretchable Electro...

Membrane test for Mechanical Testing of Stretchable Electronics