STEVEN ATHERTON

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AUSTIN, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Chip scale package
- Patent number 11,562,952
- Issue date Jan 24, 2023
- Cirrus Logic, Inc.
- Craig McAdam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via structure for semiconductor dies
- Patent number 11,373,968
- Issue date Jun 28, 2022
- Cirrus Logic, Inc.
- Yaoyu Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package substrate having a fiducial mark
- Patent number 10,049,988
- Issue date Aug 14, 2018
- NXP USA, INC.
- Steven A. Atherton
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device package substrate having a fiducial mark
- Patent number 9,627,255
- Issue date Apr 18, 2017
- NXP USA, INC.
- Steven A. Atherton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit interconnect crack monitor circuit
- Patent number 9,377,504
- Issue date Jun 28, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Stanley A. Cejka
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
CHIP SCALE PACKAGE
- Publication number 20230088252
- Publication date Mar 23, 2023
- Cirrus Logic International Semiconductor Ltd.
- Craig MCADAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE FOR SEMICONDUCTOR DIES
- Publication number 20220285299
- Publication date Sep 8, 2022
- Cirrus Logic International Semiconductor Ltd.
- Yaoyu PANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE
- Publication number 20220246514
- Publication date Aug 4, 2022
- Cirrus Logic International Semiconductor Ltd.
- Craig MCADAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE FOR SEMICONDUCTOR DIES
- Publication number 20200343206
- Publication date Oct 29, 2020
- Cirrus Logic International Semiconductor Ltd.
- Yaoyu PANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE SUBSTRATE HAVING A FIDUCIAL MARK
- Publication number 20170179038
- Publication date Jun 22, 2017
- NXP USA, Inc.
- STEVEN ATHERTON
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED CIRCUIT INTERCONNECT CRACK MONITOR CIRCUIT
- Publication number 20150276854
- Publication date Oct 1, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Stanley A. Cejka
- G01 - MEASURING TESTING