Steven L. Post

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Tempe, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Multichip IC module having coplanar dice and substrate
- Patent number 4,890,156
- Issue date Dec 26, 1989
- Motorola Inc.
- James E. Drye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coplanar die to substrate bond method
- Patent number 4,792,533
- Issue date Dec 20, 1988
- Motorola Inc.
- James E. Drye
- H01 - BASIC ELECTRIC ELEMENTS