Steven R. Eskildsen

Person

Folsom, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus having a multiplexer for passive input/output expansion
- Patent number 11,385,949
- Issue date Jul 12, 2022
- Micron Technology, Inc.
- Suresh Rajgopal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Selection component that is configured based on an architecture ass...
- Patent number 11,347,415
- Issue date May 31, 2022
- Micron Technology, Inc.
- Suresh Rajgopal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Selection component that is configured based on an architecture ass...
- Patent number 10,877,678
- Issue date Dec 29, 2020
- Micron Technology, Inc.
- Suresh Rajgopal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus having multiplexers for passive input/output expansion an...
- Patent number 10,846,158
- Issue date Nov 24, 2020
- Micron Technology, Inc.
- Suresh Rajgopal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Face down dual sided chip scale memory package
- Patent number 10,366,934
- Issue date Jul 30, 2019
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face down dual sided chip scale memory package
- Patent number 10,153,221
- Issue date Dec 11, 2018
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Independent control of stacked electronic modules
- Patent number 9,269,403
- Issue date Feb 23, 2016
- Micron Technology, Inc.
- Robert N Schenck
- G11 - INFORMATION STORAGE
Information Patent Grant
Package including an interposer having at least one topological fea...
- Patent number 8,999,763
- Issue date Apr 7, 2015
- Micron Technology, Inc.
- Steven Eskildsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal shifting to allow independent control of identical stacked m...
- Patent number 8,952,515
- Issue date Feb 10, 2015
- Micron Technology, Inc.
- Robert Naylor Schenck
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods for receiving and transmitting voltage through the use of s...
- Patent number 8,860,496
- Issue date Oct 14, 2014
- Micron Technology, Inc.
- Mostafa Naguib Abdulla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supply voltage or ground connections for integrated circuit device
- Patent number 8,829,693
- Issue date Sep 9, 2014
- Micron Technology, Inc.
- Mostafa Naguib Abdulla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including an interposer having at least one topological fea...
- Patent number 8,749,074
- Issue date Jun 10, 2014
- Micron Technology, Inc.
- Steven Eskildsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supply voltage or ground connections for integrated circuit device
- Patent number 8,536,716
- Issue date Sep 17, 2013
- Micron Technology, Inc.
- Mostafa Naguib Abdulla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supply voltage or ground connections including bond pad interconnec...
- Patent number 8,531,849
- Issue date Sep 10, 2013
- Micron Technology, Inc.
- Mostafa Naguib Abdulla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal shifting to allow independent control of identical stacked m...
- Patent number 8,198,717
- Issue date Jun 12, 2012
- Micron Technology, Inc.
- Robert Naylor Schenck
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for using an in package power supply to supply power to an i...
- Patent number 7,823,279
- Issue date Nov 2, 2010
- Intel Corporation
- Steven R. Eskildsen
- G11 - INFORMATION STORAGE
Information Patent Grant
Packaging method for circuit board
- Patent number 7,533,457
- Issue date May 19, 2009
- Intel Corporation
- Richard B Foehringer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconducting device with folded interposer
- Patent number 7,482,698
- Issue date Jan 27, 2009
- Intel Corporation
- Iwen Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconducting device with folded interposer
- Patent number 7,456,048
- Issue date Nov 25, 2008
- Intel Corporation
- Iwen Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconducting device with folded interposer
- Patent number 7,145,249
- Issue date Dec 5, 2006
- Intel Corporation
- Iwen Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package with edge connect contacts
- Patent number 6,704,204
- Issue date Mar 9, 2004
- Intel Corporation
- Steven R. Eskildsen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Implementing micro BGA assembly techniques for small die
- Patent number 6,655,022
- Issue date Dec 2, 2003
- Intel Corporation
- Steven R. Eskildsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die having bond pads near adjacent sides to allo...
- Patent number 6,605,875
- Issue date Aug 12, 2003
- Intel Corporation
- Steven R. Eskildsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package with quick connect feature
- Patent number 6,547,570
- Issue date Apr 15, 2003
- Intel Corporation
- Steven R. Eskildsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implementing micro BGA™ assembly techniques for small die
- Patent number 6,489,557
- Issue date Dec 3, 2002
- Intel Corporation
- Steven R. Eskildsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pin count card retainer
- Patent number 6,356,456
- Issue date Mar 12, 2002
- Intel Corporation
- Steven R. Eskildsen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
IC package with quick connect feature
- Patent number 6,250,934
- Issue date Jun 26, 2001
- Intel Corporation
- Steven R. Eskildsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a scribelined layout structure for plastic enca...
- Patent number 5,336,456
- Issue date Aug 9, 1994
- Intel Corporation
- Steven R. Eskildsen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method and apparatus for testing the continuity of static random ac...
- Patent number 5,255,230
- Issue date Oct 19, 1993
- Intel Corporation
- James Chan
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SELECTION COMPONENT THAT IS CONFIGURED BASED ON AN ARCHITECTURE ASS...
- Publication number 20210117115
- Publication date Apr 22, 2021
- Micron Technology, Inc.
- Suresh Rajgopal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS HAVING A MULTIPLEXER FOR PASSIVE INPUT/OUTPUT EXPANSION
- Publication number 20210055979
- Publication date Feb 25, 2021
- Micron Technology, Inc.
- Suresh Rajgopal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PASSIVE INPUT/OUTPUT EXPANSION
- Publication number 20200110645
- Publication date Apr 9, 2020
- Micron Technology, Inc.
- Suresh Rajgopal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SELECTION COMPONENT THAT IS CONFIGURED BASED ON AN ARCHITECTURE ASS...
- Publication number 20190354301
- Publication date Nov 21, 2019
- Micron Technology, Inc.
- Suresh Rajgopal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Face Down Dual Sided Chip Scale Memory Package
- Publication number 20190088565
- Publication date Mar 21, 2019
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Face Down Dual Sided Chip Scale Memory Package
- Publication number 20180358275
- Publication date Dec 13, 2018
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDEPENDENT CONTROL OF STACKED ELECTRONIC MODULES
- Publication number 20160172336
- Publication date Jun 16, 2016
- Micron Technology, Inc.
- Robert N. Schenck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDEPENDENT CONTROL OF STACKED ELECTRONIC MODULES
- Publication number 20150155011
- Publication date Jun 4, 2015
- Micron Technology, Inc.
- Robert N. Schenck
- G11 - INFORMATION STORAGE
Information Patent Application
PACKAGE INCLUDING AN INTERPOSER HAVING AT LEAST ONE TOPOLOGICAL FEA...
- Publication number 20140287558
- Publication date Sep 25, 2014
- Steven Eskildsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPLY VOLTAGE OR GROUND CONNECTIONS FOR INTEGRATED CIRCUIT DEVICE
- Publication number 20140015133
- Publication date Jan 16, 2014
- Micron Technology, Inc.
- Mostafa Naguib Abdulla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPLY VOLTAGE OR GROUND CONNECTIONS INCLUDING BOND PAD INTERCONNEC...
- Publication number 20140009218
- Publication date Jan 9, 2014
- Micron Technology, Inc.
- Mostafa Naguib Abdulla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING AN INTERPOSER HAVING AT LEAST ONE TOPOLOGICAL FEA...
- Publication number 20110127659
- Publication date Jun 2, 2011
- Steven Eskildsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Providing in package power supplies for integrated circuits
- Publication number 20110012670
- Publication date Jan 20, 2011
- Steven R. Eskildsen
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTING DEVICE WITH FOLDED INTERPOSER
- Publication number 20070023905
- Publication date Feb 1, 2007
- Intel Corporation
- Iwen Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTING DEVICE WITH FOLDED INTERPOSER
- Publication number 20070026569
- Publication date Feb 1, 2007
- Intel Corporation
- Iwen Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging method and apparatus
- Publication number 20070004095
- Publication date Jan 4, 2007
- Richard B. Foehringer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconducting device with folded interposer
- Publication number 20050212112
- Publication date Sep 29, 2005
- Intel Corporation
- Iwen Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spacerless die stacking
- Publication number 20050067694
- Publication date Mar 31, 2005
- Florence R. Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Providing in package power supplies for integrated circuits
- Publication number 20030184963
- Publication date Oct 2, 2003
- Steven R. Eskildsen
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATED CIRCUIT DIE HAVING BOND PADS NEAR ADJACENT SIDES TO ALLO...
- Publication number 20030102567
- Publication date Jun 5, 2003
- STEVEN R. ESKILDSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLEMENTING MICRO BGATM ASSEMBLY TECHNIQUES FOR SMALL DIE
- Publication number 20020079120
- Publication date Jun 27, 2002
- STEVEN R. ESKILDSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC package with quick connect feature
- Publication number 20010027034
- Publication date Oct 4, 2001
- Steven R. Eskildsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PIN COUNT CARD RETAINER
- Publication number 20010002876
- Publication date Jun 7, 2001
- STEVEN R. ESKILDSEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Steven R. Eskildsen

Person

Patents Grantslast 30 patents

Apparatus having a multiplexer for passive input/output expansion

Selection component that is configured based on an architecture ass...

Selection component that is configured based on an architecture ass...

Apparatus having multiplexers for passive input/output expansion an...

Face down dual sided chip scale memory package

Face down dual sided chip scale memory package

Independent control of stacked electronic modules

Package including an interposer having at least one topological fea...

Signal shifting to allow independent control of identical stacked m...

Methods for receiving and transmitting voltage through the use of s...

Supply voltage or ground connections for integrated circuit device

Package including an interposer having at least one topological fea...

Supply voltage or ground connections for integrated circuit device

Supply voltage or ground connections including bond pad interconnec...

Signal shifting to allow independent control of identical stacked m...

Method for using an in package power supply to supply power to an i...

Packaging method for circuit board

Semiconducting device with folded interposer

Semiconducting device with folded interposer

Semiconducting device with folded interposer

IC package with edge connect contacts

Implementing micro BGA assembly techniques for small die

Integrated circuit die having bond pads near adjacent sides to allo...

IC package with quick connect feature

Implementing micro BGA&#x02122; assembly techniques for small die

Low pin count card retainer

IC package with quick connect feature

Method of producing a scribelined layout structure for plastic enca...

Method and apparatus for testing the continuity of static random ac...

Patents Applicationslast 30 patents

SELECTION COMPONENT THAT IS CONFIGURED BASED ON AN ARCHITECTURE ASS...

APPARATUS HAVING A MULTIPLEXER FOR PASSIVE INPUT/OUTPUT EXPANSION

PASSIVE INPUT/OUTPUT EXPANSION

SELECTION COMPONENT THAT IS CONFIGURED BASED ON AN ARCHITECTURE ASS...

Face Down Dual Sided Chip Scale Memory Package

Face Down Dual Sided Chip Scale Memory Package

INDEPENDENT CONTROL OF STACKED ELECTRONIC MODULES

INDEPENDENT CONTROL OF STACKED ELECTRONIC MODULES

PACKAGE INCLUDING AN INTERPOSER HAVING AT LEAST ONE TOPOLOGICAL FEA...

SUPPLY VOLTAGE OR GROUND CONNECTIONS FOR INTEGRATED CIRCUIT DEVICE

SUPPLY VOLTAGE OR GROUND CONNECTIONS INCLUDING BOND PAD INTERCONNEC...

PACKAGE INCLUDING AN INTERPOSER HAVING AT LEAST ONE TOPOLOGICAL FEA...

Providing in package power supplies for integrated circuits

SEMICONDUCTING DEVICE WITH FOLDED INTERPOSER

SEMICONDUCTING DEVICE WITH FOLDED INTERPOSER

Packaging method and apparatus

Semiconducting device with folded interposer

Spacerless die stacking

Providing in package power supplies for integrated circuits

INTEGRATED CIRCUIT DIE HAVING BOND PADS NEAR ADJACENT SIDES TO ALLO...

IMPLEMENTING MICRO BGATM ASSEMBLY TECHNIQUES FOR SMALL DIE

IC package with quick connect feature

LOW PIN COUNT CARD RETAINER

Implementing micro BGA™ assembly techniques for small die