Steven Towle

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thinned die integrated circuit package
- Patent number 7,888,183
- Issue date Feb 15, 2011
- Intel Corporation
- Cheng-Yi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly having thermoelectric elements to cool a d...
- Patent number 7,589,417
- Issue date Sep 15, 2009
- Intel Corporation
- Shriram Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thinned die integrated circuit package
- Patent number 7,420,273
- Issue date Sep 2, 2008
- Intel Corporation
- Cheng-Yi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus to optically couple an optoelectronic chip to...
- Patent number 7,372,120
- Issue date May 13, 2008
- Intel Corporation
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate pattern to accommodate optical waveguide
- Patent number 7,369,718
- Issue date May 6, 2008
- Intel Corporation
- Steven Towle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Underfill integration for optical packages
- Patent number 7,256,059
- Issue date Aug 14, 2007
- Intel Corporation
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-substrate microlens to couple an off-substrate light emitter and...
- Patent number 7,236,666
- Issue date Jun 26, 2007
- Intel Corporation
- Henning Braunisch
- G02 - OPTICS
Information Patent Grant
Wafer support and release in wafer processing
- Patent number 7,226,812
- Issue date Jun 5, 2007
- Intel Corporation
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming a direct build-up layer on an encapsulated die...
- Patent number 7,189,596
- Issue date Mar 13, 2007
- Intel Corporation
- Chun Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost microelectronic circuit package
- Patent number 7,183,658
- Issue date Feb 27, 2007
- Intel Corporation
- Steven Towle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturable connectorization process for optical chip-to-chip in...
- Patent number 7,177,504
- Issue date Feb 13, 2007
- Intel Corporation
- Daoqiang Lu
- G02 - OPTICS
Information Patent Grant
Waveguide coupling mechanism
- Patent number 7,085,449
- Issue date Aug 1, 2006
- Intel Corporation
- Henning Braunisch
- G02 - OPTICS
Information Patent Grant
Microelectronic substrates with integrated devices
- Patent number 7,078,788
- Issue date Jul 18, 2006
- Intel Corporation
- Quat T. Vu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for packaging a microelectronic device using on-die bond pad...
- Patent number 7,071,024
- Issue date Jul 4, 2006
- Intel Corporation
- Steven Towle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating microelectronic package having a bumpless lam...
- Patent number 7,067,356
- Issue date Jun 27, 2006
- Intel Corporation
- Steven Towle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Underfill integration for optical packages
- Patent number 7,042,106
- Issue date May 9, 2006
- Intel Corporation
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrooptic assembly
- Patent number 7,039,263
- Issue date May 2, 2006
- Intel Corporation
- Steven Towle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level thick film standing-wave clocking
- Patent number 7,012,015
- Issue date Mar 14, 2006
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thick metal layer integrated process flow to improve power delivery...
- Patent number 6,977,435
- Issue date Dec 20, 2005
- Intel Corporation
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Healing of micro-cracks in an on-chip dielectric
- Patent number 6,975,017
- Issue date Dec 13, 2005
- Intel Corporation
- Steven N. Towle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of processing thick ILD layers using spray coating or lamin...
- Patent number 6,943,440
- Issue date Sep 13, 2005
- Intel Corporation
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level thick film standing-wave clocking
- Patent number 6,927,496
- Issue date Aug 9, 2005
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a low-K dielectric layer
- Patent number 6,914,335
- Issue date Jul 5, 2005
- Intel Corporation
- Ebrahim Andideh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device having signal distribution functionality on...
- Patent number 6,894,399
- Issue date May 17, 2005
- Intel Corporation
- Quat T. Vu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance, low cost microelectronic circuit package with int...
- Patent number 6,888,240
- Issue date May 3, 2005
- Intel Corporation
- Steven Towle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma induced depletion of fluorine from surfaces of fluorinated l...
- Patent number 6,846,737
- Issue date Jan 25, 2005
- Intel Corporation
- Steven Towle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thinned die integrated circuit package
- Patent number 6,841,413
- Issue date Jan 11, 2005
- Intel Corporation
- Cheng-Yi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming defect prevention trenches in dicing streets
- Patent number 6,838,299
- Issue date Jan 4, 2005
- Intel Corporation
- Rose A. Mulligan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optoelectronic packages and methods to simultaneously couple an opt...
- Patent number 6,834,133
- Issue date Dec 21, 2004
- Intel Corporation
- Steven Towle
- G02 - OPTICS
Information Patent Grant
Healing of micro-cracks in an on-chip dielectric
- Patent number 6,806,168
- Issue date Oct 19, 2004
- Intel Corporation
- Steven N. Towle
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THINNED DIE INTEGRATED CIRCUIT PACKAGE
- Publication number 20080153209
- Publication date Jun 26, 2008
- Intel Corporation
- Cheng-Yi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Processing Thick ILD Layers Using Spray Coating or Lamin...
- Publication number 20070190776
- Publication date Aug 16, 2007
- Intel Corporation
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thick metal layer integrated process flow to improve power delivery...
- Publication number 20060076678
- Publication date Apr 13, 2006
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturable connectorization process for optical chip-to-chip in...
- Publication number 20060067624
- Publication date Mar 30, 2006
- Steven Towle
- G02 - OPTICS
Information Patent Application
On-substrate microlens to couple an off-substrate light emitter and...
- Publication number 20060067606
- Publication date Mar 30, 2006
- Intel Corporation
- Steven Towle
- G02 - OPTICS
Information Patent Application
Waveguide coupling mechanism
- Publication number 20060051021
- Publication date Mar 9, 2006
- Henning Braunisch
- G02 - OPTICS
Information Patent Application
Methods of processing thick ILD layers using spray coating or lamin...
- Publication number 20060012039
- Publication date Jan 19, 2006
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL THICK FILM STANDING-WAVE CLOCKING
- Publication number 20050266675
- Publication date Dec 1, 2005
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer support and release in wafer processing
- Publication number 20050221598
- Publication date Oct 6, 2005
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic assembly having thermoelectric elements to cool a d...
- Publication number 20050178423
- Publication date Aug 18, 2005
- Shriram Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package substrate pattern to accommodate optical waveguide
- Publication number 20050161789
- Publication date Jul 28, 2005
- Steven Towle
- G02 - OPTICS
Information Patent Application
Die exhibiting an effective coefficient of thermal expansion equiva...
- Publication number 20050136640
- Publication date Jun 23, 2005
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill integration for optical packages
- Publication number 20050127528
- Publication date Jun 16, 2005
- Daoqiang Lu
- G02 - OPTICS
Information Patent Application
Thinned die integrated circuit package
- Publication number 20050121778
- Publication date Jun 9, 2005
- Intel Corporation
- Cheng-Yi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-level thick film standing-wave clocking
- Publication number 20050070087
- Publication date Mar 31, 2005
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic substrates with integrated devices
- Publication number 20050062173
- Publication date Mar 24, 2005
- Intel Corporation
- Quat T. Vu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thick metal layer integrated process flow to improve power delivery...
- Publication number 20050051894
- Publication date Mar 10, 2005
- Intel Corporation
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of processing thick ILD layers using spray coating or lamin...
- Publication number 20050051904
- Publication date Mar 10, 2005
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Healing of micro-cracks in an on-chip dielectric
- Publication number 20050023565
- Publication date Feb 3, 2005
- Steven N. Towle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Computer system implemented on flex tape
- Publication number 20040262727
- Publication date Dec 30, 2004
- David P. McConville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill integration for optical packages
- Publication number 20040266062
- Publication date Dec 30, 2004
- Daoqiang Lu
- G02 - OPTICS
Information Patent Application
Die-in heat spreader microelectronic package
- Publication number 20040155325
- Publication date Aug 12, 2004
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL THUMBTACK
- Publication number 20040126058
- Publication date Jul 1, 2004
- Daoqiang Lu
- G02 - OPTICS
Information Patent Application
Optical assembly
- Publication number 20040126064
- Publication date Jul 1, 2004
- Gilroy J. Vandentop
- G02 - OPTICS
Information Patent Application
Healing of micro-cracks in an on-chip dielectric
- Publication number 20040099877
- Publication date May 27, 2004
- Steven N. Towle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrooptic assembly
- Publication number 20040057649
- Publication date Mar 25, 2004
- Steven Towle
- G02 - OPTICS
Information Patent Application
Microelectronic package having a bumpless laminated interconnection...
- Publication number 20030227077
- Publication date Dec 11, 2003
- Intel Corporation
- Steven Towle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of forming a carbon doped oxide layer on a substrate
- Publication number 20030211325
- Publication date Nov 13, 2003
- Steven N. Towle
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Thinned die integrated circuit package
- Publication number 20030127715
- Publication date Jul 10, 2003
- Cheng-Yi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming defect prevention trenches in dicing streets
- Publication number 20030100143
- Publication date May 29, 2003
- Rose A. Mulligan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Steven Towle

Person

Patents Grantslast 30 patents

Thinned die integrated circuit package

Microelectronic assembly having thermoelectric elements to cool a d...

Thinned die integrated circuit package

Methods and apparatus to optically couple an optoelectronic chip to...

Package substrate pattern to accommodate optical waveguide

Underfill integration for optical packages

On-substrate microlens to couple an off-substrate light emitter and...

Wafer support and release in wafer processing

Process for forming a direct build-up layer on an encapsulated die...

Low cost microelectronic circuit package

Manufacturable connectorization process for optical chip-to-chip in...

Waveguide coupling mechanism

Microelectronic substrates with integrated devices

Method for packaging a microelectronic device using on-die bond pad...

Method of fabricating microelectronic package having a bumpless lam...

Underfill integration for optical packages

Electrooptic assembly

Wafer-level thick film standing-wave clocking

Thick metal layer integrated process flow to improve power delivery...

Healing of micro-cracks in an on-chip dielectric

Methods of processing thick ILD layers using spray coating or lamin...

Wafer-level thick film standing-wave clocking

Semiconductor device having a low-K dielectric layer

Microelectronic device having signal distribution functionality on...

High performance, low cost microelectronic circuit package with int...

Plasma induced depletion of fluorine from surfaces of fluorinated l...

Thinned die integrated circuit package

Forming defect prevention trenches in dicing streets

Optoelectronic packages and methods to simultaneously couple an opt...

Healing of micro-cracks in an on-chip dielectric

Patents Applicationslast 30 patents

THINNED DIE INTEGRATED CIRCUIT PACKAGE

Methods of Processing Thick ILD Layers Using Spray Coating or Lamin...

Thick metal layer integrated process flow to improve power delivery...

Manufacturable connectorization process for optical chip-to-chip in...

On-substrate microlens to couple an off-substrate light emitter and...

Waveguide coupling mechanism

Methods of processing thick ILD layers using spray coating or lamin...

WAFER-LEVEL THICK FILM STANDING-WAVE CLOCKING

Wafer support and release in wafer processing

Microelectronic assembly having thermoelectric elements to cool a d...

Package substrate pattern to accommodate optical waveguide

Die exhibiting an effective coefficient of thermal expansion equiva...

Underfill integration for optical packages

Thinned die integrated circuit package

Wafer-level thick film standing-wave clocking

Microelectronic substrates with integrated devices

Thick metal layer integrated process flow to improve power delivery...

Methods of processing thick ILD layers using spray coating or lamin...

Healing of micro-cracks in an on-chip dielectric

Computer system implemented on flex tape

Underfill integration for optical packages

Die-in heat spreader microelectronic package

OPTICAL THUMBTACK

Optical assembly

Healing of micro-cracks in an on-chip dielectric

Electrooptic assembly

Microelectronic package having a bumpless laminated interconnection...

Method of forming a carbon doped oxide layer on a substrate

Thinned die integrated circuit package

Forming defect prevention trenches in dicing streets