Steven Webster

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Molded semiconductor package
- Patent number 9,735,191
- Issue date Aug 15, 2017
- Amkor Technology, Inc.
- Steven Webster
- G02 - OPTICS
Information Patent Grant
Molded semiconductor package with snap lid
- Patent number 9,332,164
- Issue date May 3, 2016
- Amkor Technology, Inc.
- Steven Webster
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Molded image sensor package and method
- Patent number 8,994,860
- Issue date Mar 31, 2015
- Amkor, Technology, Inc.
- Steven Webster
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Camera module with window mechanical attachment
- Patent number 7,786,429
- Issue date Aug 31, 2010
- Amkor Technology, Inc.
- Thomas P. Glenn
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Optical module having cavity substrate
- Patent number 7,609,461
- Issue date Oct 27, 2009
- Amkor Technology, Inc.
- Steven Webster
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Snap lid camera module
- Patent number 7,425,750
- Issue date Sep 16, 2008
- Amkor Technology, Inc.
- Thomas P. Glenn
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Camera module fabrication method including the step of removing a l...
- Patent number 7,332,712
- Issue date Feb 19, 2008
- Amkor Technology, Inc.
- Steven Webster
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Camera module fabrication method including singulating a substrate
- Patent number 7,199,359
- Issue date Apr 3, 2007
- Amkor Technology, Inc.
- Steven Webster
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Camera module having a threaded lens barrel and a ball grid array c...
- Patent number 7,126,111
- Issue date Oct 24, 2006
- Amkor Technology, Inc.
- Steven Webster
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical module with lens integral holder fabrication method
- Patent number 7,059,040
- Issue date Jun 13, 2006
- Amkor Technology, Inc.
- Steven Webster
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor package fabrication method
- Patent number 6,956,201
- Issue date Oct 18, 2005
- Amkor Technology, Inc.
- Steven Webster
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of fabricating and using an image sensor package
- Patent number 6,946,316
- Issue date Sep 20, 2005
- Amkor Technology, Inc.
- Thomas P. Glenn
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wafer having alignment marks extending from a first to a second sur...
- Patent number 6,943,429
- Issue date Sep 13, 2005
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-side wafer singulation method
- Patent number 6,869,861
- Issue date Mar 22, 2005
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip on glass sensor package
- Patent number 6,849,916
- Issue date Feb 1, 2005
- Amkor Technology, Inc.
- Thomas P. Glenn
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor package
- Patent number 6,791,076
- Issue date Sep 14, 2004
- Amkor Technology, Inc.
- Steven Webster
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical module with lens integral holder
- Patent number 6,686,588
- Issue date Feb 3, 2004
- Amkor Technology, Inc.
- Steven Webster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micromachine stacked wirebonded package fabrication method
- Patent number 6,638,789
- Issue date Oct 28, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip size image sensor bumped package fabrication method
- Patent number 6,629,633
- Issue date Oct 7, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin image sensor package
- Patent number 6,627,864
- Issue date Sep 30, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micromirror device package fabrication method
- Patent number 6,624,921
- Issue date Sep 23, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip size image sensor wirebond package fabrication method
- Patent number 6,620,646
- Issue date Sep 16, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a special-purpose die using a polymerizable...
- Patent number 6,610,167
- Issue date Aug 26, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for protecting a micromachine with a cavity in a UV tape
- Patent number 6,580,153
- Issue date Jun 17, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip size semiconductor packages with stacked dies
- Patent number 6,577,013
- Issue date Jun 10, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for fabricating a special-purpose die using a polymerizab...
- Patent number 6,572,944
- Issue date Jun 3, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Flip chip image sensor package fabrication method
- Patent number 6,571,466
- Issue date Jun 3, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making and stacking a semiconductor package
- Patent number 6,564,454
- Issue date May 20, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micromachine stacked flip chip package fabrication method
- Patent number 6,530,515
- Issue date Mar 11, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Angulated semiconductor packages
- Patent number 6,532,157
- Issue date Mar 11, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE WITH SNAP LID
- Publication number 20160380015
- Publication date Dec 29, 2016
- Amkor Technology, Inc.
- Steven Webster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED IMAGE SENSOR PACKAGE HAVING LENS HOLDER
- Publication number 20130265486
- Publication date Oct 10, 2013
- Amkor Technology, Inc.
- Steven Webster
- G02 - OPTICS
Information Patent Application
MOLDED IMAGE SENSOR PACKAGE AND METHOD
- Publication number 20120112042
- Publication date May 10, 2012
- Amkor Technology, Inc.
- Steven Webster
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Camera module having lens mount with ir filter
- Publication number 20110115918
- Publication date May 19, 2011
- Amkor Technology, Inc.
- Steven Webster
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Camera module with window mechanical attachment
- Publication number 20080308717
- Publication date Dec 18, 2008
- Amkor Technology, Inc.
- Thomas P. Glenn
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of using a camera module
- Publication number 20080106624
- Publication date May 8, 2008
- Amkor Technology, Inc.
- Steven Webster
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Camera module fabrication method
- Publication number 20070152147
- Publication date Jul 5, 2007
- Amkor Technology, Inc.
- Steven Webster
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CAMERA MODULE FABRICATION METHOD
- Publication number 20070012864
- Publication date Jan 18, 2007
- Amkor Technology, Inc.
- Steven Webster
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Snap lid camera module
- Publication number 20060027740
- Publication date Feb 9, 2006
- Amkor Technology, Inc.
- Thomas P. Glenn
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Camera module
- Publication number 20050242274
- Publication date Nov 3, 2005
- Steven Webster
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Image sensor package fabrication method
- Publication number 20050024752
- Publication date Feb 3, 2005
- Amkor Technology, Inc.
- Steven Webster
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTEGRATED CIRCUIT PACKAGE INCLUDING INTERCONNECTION POSTS FOR MULT...
- Publication number 20040173894
- Publication date Sep 9, 2004
- Amkor Technology, Inc.
- Thomas P. Glenn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of fabricating and using an image sensor package
- Publication number 20030056967
- Publication date Mar 27, 2003
- Thomas P. Glenn
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Image sensor package having optical element
- Publication number 20030057359
- Publication date Mar 27, 2003
- Steven Webster
- G02 - OPTICS

Steven Webster

Person

Patents Grantslast 30 patents

Molded semiconductor package

Molded semiconductor package with snap lid

Molded image sensor package and method

Camera module with window mechanical attachment

Optical module having cavity substrate

Snap lid camera module

Camera module fabrication method including the step of removing a l...

Camera module fabrication method including singulating a substrate

Camera module having a threaded lens barrel and a ball grid array c...

Optical module with lens integral holder fabrication method

Image sensor package fabrication method

Method of fabricating and using an image sensor package

Wafer having alignment marks extending from a first to a second sur...

Back-side wafer singulation method

Flip chip on glass sensor package

Image sensor package

Optical module with lens integral holder

Micromachine stacked wirebonded package fabrication method

Chip size image sensor bumped package fabrication method

Thin image sensor package

Micromirror device package fabrication method

Chip size image sensor wirebond package fabrication method

Method for fabricating a special-purpose die using a polymerizable...

Structure for protecting a micromachine with a cavity in a UV tape

Chip size semiconductor packages with stacked dies

Structure for fabricating a special-purpose die using a polymerizab...

Flip chip image sensor package fabrication method

Method of making and stacking a semiconductor package

Micromachine stacked flip chip package fabrication method

Angulated semiconductor packages

Patents Applicationslast 30 patents

MOLDED SEMICONDUCTOR PACKAGE WITH SNAP LID

MOLDED IMAGE SENSOR PACKAGE HAVING LENS HOLDER

MOLDED IMAGE SENSOR PACKAGE AND METHOD

Camera module having lens mount with ir filter

Camera module with window mechanical attachment

Method of using a camera module

Camera module fabrication method

CAMERA MODULE FABRICATION METHOD

Snap lid camera module

Camera module

Image sensor package fabrication method

INTEGRATED CIRCUIT PACKAGE INCLUDING INTERCONNECTION POSTS FOR MULT...

Method of fabricating and using an image sensor package

Image sensor package having optical element