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Manila, PH
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Patents Grants
last 30 patents
Information
Patent Grant
Mounting for a package containing a chip
Patent number
6,967,395
Issue date
Nov 22, 2005
Amkor Technology, Inc.
Thomas P. Glenn
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Tool and method for forming an integrated optical circuit
Patent number
6,875,379
Issue date
Apr 5, 2005
Amkor Technology, Inc.
Thomas P. Glenn
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
VCSEL package and fabrication method
Patent number
6,816,523
Issue date
Nov 9, 2004
Amkor Technology, Inc.
Thomas P. Glenn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mounting for a package containing a chip
Patent number
6,777,789
Issue date
Aug 17, 2004
Amkor Technology, Inc.
Thomas P. Glenn
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for forming an image sensor package with vision die in lens...
Patent number
6,734,419
Issue date
May 11, 2004
Amkor Technology, Inc.
Thomas P. Glenn
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Pre-drilled image sensor package fabrication method
Patent number
6,730,536
Issue date
May 4, 2004
Amkor Technology, Inc.
Thomas P. Glenn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating and using an image sensor package with reflector
Patent number
6,717,126
Issue date
Apr 6, 2004
Amkor Technology, Inc.
Thomas P. Glenn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Image sensor package with reflector
Patent number
6,686,580
Issue date
Feb 3, 2004
Amkor Technology, Inc.
Thomas P. Glenn
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Optical fiber having tapered end and optical connector with recipro...
Patent number
6,672,773
Issue date
Jan 6, 2004
Amkor Technology, Inc.
Thomas P. Glenn
G02 - OPTICS
Information
Patent Grant
Integrated circuit package mounting
Patent number
6,670,698
Issue date
Dec 30, 2003
Amkor Technology, Inc.
Thomas P. Glenn
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Structure for backside saw cavity protection
Patent number
6,661,080
Issue date
Dec 9, 2003
Amkor Technology, Inc.
Thomas P. Glenn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ceramic semiconductor package and method for fabricating the package
Patent number
6,627,987
Issue date
Sep 30, 2003
Amkor Technology, Inc.
Thomas P. Glenn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reduced thickness packaged electronic device
Patent number
6,586,824
Issue date
Jul 1, 2003
Amkor Technology, Inc.
Thomas P. Glenn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package having posts for connection to other pac...
Patent number
6,586,826
Issue date
Jul 1, 2003
Amkor Technology, Inc.
Thomas P. Glenn
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Heat spreader with spring IC package
Patent number
6,580,167
Issue date
Jun 17, 2003
Amkor Technology, Inc.
Thomas P. Glenn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat spreader with spring IC package fabrication method
Patent number
6,562,655
Issue date
May 13, 2003
Amkor Technology, Inc.
Thomas P. Glenn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pre-drilled image sensor package
Patent number
6,548,759
Issue date
Apr 15, 2003
Amkor Technology, Inc.
Thomas P. Glenn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mounting for a package containing a chip
Patent number
6,545,345
Issue date
Apr 8, 2003
Amkor Technology, Inc.
Thomas P. Glenn
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Vacuum sealed package for semiconductor chip
Patent number
6,528,875
Issue date
Mar 4, 2003
Amkor Technology, Inc.
Thomas P. Glenn
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Pre-drilled ball grid array package
Patent number
6,486,545
Issue date
Nov 26, 2002
Amkor Technology, Inc.
Thomas P. Glenn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Active heat sink for cooling a semiconductor chip
Patent number
6,429,513
Issue date
Aug 6, 2002
Amkor Technology, Inc.
Charles A. Shermer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming a reduced thickness packaged electronic device
Patent number
6,399,418
Issue date
Jun 4, 2002
Amkor Technology, Inc.
Thomas P. Glenn
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
TOOL AND METHOD FOR FORMING AN INTEGRATED OPTICAL CIRCUIT
Publication number
20040245659
Publication date
Dec 9, 2004
Thomas P. Glenn
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL