Su-Tsai Lu

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Mesh electrode, sensing device, and electrode layer
- Patent number 10,001,889
- Issue date Jun 19, 2018
- Industrial Technology Research Institute
- Heng-Tien Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Conductive line structure and sensing device using the same
- Patent number 9,921,699
- Issue date Mar 20, 2018
- Industrial Technology Research Institute
- Sheng-Feng Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sensing structure
- Patent number 9,811,222
- Issue date Nov 7, 2017
- Industrial Technology Research Institute
- Bao-Shun Yau
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Touch panel and manufacturing method thereof and touch display panel
- Patent number 9,606,679
- Issue date Mar 28, 2017
- Industrial Technology Research Institute
- Jyun-Kai Ciou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Gravure printing system and method of using the same
- Patent number 9,579,878
- Issue date Feb 28, 2017
- Industrial Technology Research Institute
- Sheng-Feng Chung
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Touch panel structure and fabrication method for the same
- Patent number 9,448,672
- Issue date Sep 20, 2016
- Industrial Technology Research Institute
- Sheng-Feng Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Illumination device
- Patent number 9,395,072
- Issue date Jul 19, 2016
- Industrial Technology Research Institute
- Su-Tsai Lu
- F21 - LIGHTING
Information Patent Grant
Illumination device
- Patent number 9,224,790
- Issue date Dec 29, 2015
- Industrial Technology Research Institute
- Wen-Yung Yeh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip stack structure and method for fabricating the same
- Patent number 9,184,153
- Issue date Nov 10, 2015
- Industrial Technology Research Institute
- Su-Tsai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Touch structure and manufacturing method for the same
- Patent number 9,052,789
- Issue date Jun 9, 2015
- Industrial Technology Research Institute
- Bao-Shun Yau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly having a multilayer adhesive structure
- Patent number 8,604,613
- Issue date Dec 10, 2013
- Industrial Technology Research Institute
- Su-Tsai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package structure with a hydrophilic protection l...
- Patent number 8,598,686
- Issue date Dec 3, 2013
- Industrial Technology Research Institute
- Tao-Chih Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and assembling method thereof
- Patent number 8,415,795
- Issue date Apr 9, 2013
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level molding structure
- Patent number 8,384,215
- Issue date Feb 26, 2013
- Industrial Technology Research Institute
- Su-Tsai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure, chip package structure including the same and metho...
- Patent number 8,227,915
- Issue date Jul 24, 2012
- Industrial Technology Research Institute
- Su Tsai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealed joint structure of device and process using the same
- Patent number 8,134,230
- Issue date Mar 13, 2012
- Industrial Technology Research Institute
- Tsung-Fu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked capacitor structure and manufacturing method thereof
- Patent number 8,134,823
- Issue date Mar 13, 2012
- Industrial Technology Research Institute
- Wen-Hwa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode structure of memory capacitor
- Patent number 7,999,350
- Issue date Aug 16, 2011
- Industrial Technology Research Institute
- Su-Tsai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure with buffer layer and method of forming the same
- Patent number 7,988,808
- Issue date Aug 2, 2011
- Industrial Technology Research Institute
- Su-Tsai Lu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic assembly having a multilayer adhesive structure
- Patent number 7,960,830
- Issue date Jun 14, 2011
- Industrial Technology Research Institute
- Su-Tsai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package structure of optical-electronic device and meth...
- Patent number 7,465,603
- Issue date Dec 16, 2008
- Industrial Technology Research Institute
- Yuan-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure with buffer layer and method of forming the same
- Patent number 7,459,055
- Issue date Dec 2, 2008
- Industrial Technology Research Institute
- Su-Tsai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure with buffer layer and method of forming the same
- Patent number 7,446,421
- Issue date Nov 4, 2008
- Industrial Technology Research Institute
- Su-Tsai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure and chip package structure
- Patent number 7,423,348
- Issue date Sep 9, 2008
- Industrial Technology Research Institute
- Su-Tsai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite bump
- Patent number 7,378,746
- Issue date May 27, 2008
- Industrial Technology Research Institute
- Ji-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating conductive bumps with non-conductive juxtapo...
- Patent number 7,348,271
- Issue date Mar 25, 2008
- Industrial Technology Research Institute
- Yuan-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package structure of optical-electronic device and meth...
- Patent number 7,317,235
- Issue date Jan 8, 2008
- Industrial Technology Research Institute
- Yuan-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure of device packaging
- Patent number 7,239,027
- Issue date Jul 3, 2007
- Industrial Technology Research Institute
- Su-Tsai Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure with buffer layer and method of forming the same
- Patent number 7,183,494
- Issue date Feb 27, 2007
- Industrial Technology Research Institute
- Su-Tsai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bumps with non-conductive juxtaposed sidewalls
- Patent number 7,154,176
- Issue date Dec 26, 2006
- Industrial Technology Research Institute
- Yuan-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE LINE STRUCTURE AND SENSING DEVICE USING THE SAME
- Publication number 20160139709
- Publication date May 19, 2016
- Industrial Technology Research Institute
- Sheng-Feng Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TOUCH PANEL
- Publication number 20160139708
- Publication date May 19, 2016
- Industrial Technology Research Institute
- Kuo-Hua Tseng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MESH ELECTRODE, SENSING DEVICE, AND ELECTRODE LAYER
- Publication number 20160132153
- Publication date May 12, 2016
- Industrial Technology Research Institute
- Heng-Tien Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SENSING STRUCTURE
- Publication number 20160018348
- Publication date Jan 21, 2016
- Industrial Technology Research Institute
- Bao-Shun Yau
- G01 - MEASURING TESTING
Information Patent Application
ILLUMINATION DEVICE
- Publication number 20150338078
- Publication date Nov 26, 2015
- Industrial Technology Research Institute
- Su-Tsai LU
- F21 - LIGHTING
Information Patent Application
Touch panel structure and fabrication method for the same
- Publication number 20150177867
- Publication date Jun 25, 2015
- Industrial Technology Research Institute
- Sheng-Feng CHUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ILLUMINATION DEVICE
- Publication number 20150129848
- Publication date May 14, 2015
- Industrial Technology Research Institute
- Wen-Yung YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOUCH PANEL AND MANUFACTURING METHOD THEREOF AND TOUCH DISPLAY PANEL
- Publication number 20140313160
- Publication date Oct 23, 2014
- Jyun-Kai Ciou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TOUCH STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20140124241
- Publication date May 8, 2014
- Industrial Technology Research Institute
- Bao-Shun Yau
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP STACK STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20130234320
- Publication date Sep 12, 2013
- Industrial Technology Research Institute
- Su-Tsai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL MOLDING STRUCTURE
- Publication number 20120168933
- Publication date Jul 5, 2012
- Industrial Technology Research Institute
- Su-Tsai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ASSEMBLING METHOD THEREOF
- Publication number 20120161336
- Publication date Jun 28, 2012
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE...
- Publication number 20110227190
- Publication date Sep 22, 2011
- Industrial Technology Research Institute
- Tao-Chih Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE, CHIP PACKAGE STRUCTURE INCLUDING THE SAME AND METHO...
- Publication number 20110079895
- Publication date Apr 7, 2011
- Industrial Technology Research Institute
- Su Tsai LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALED JOINT STRUCTURE OF DEVICE AND PROCESS USING THE SAME
- Publication number 20110018117
- Publication date Jan 27, 2011
- Industrial Technology Research Institute
- Tsung-Fu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20100207266
- Publication date Aug 19, 2010
- Industrial Technology Research Institute
- Tao-Chih Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CAPACITOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20090257169
- Publication date Oct 15, 2009
- Industrial Technology Research Institute
- Wen-Hwa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE STRUCTURE OF MEMORY CAPACITOR AND MANUFACTURING METHOD TH...
- Publication number 20090224362
- Publication date Sep 10, 2009
- Industrial Technology Research Institute
- Su-Tsai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CAPACITOR AND MANUFACTURING METHOD THEREOF
- Publication number 20090184393
- Publication date Jul 23, 2009
- Industrial Technology Research Institute
- Wen-Hwa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY HAVING A MULTILAYER ADHESIVE STRUCTURE
- Publication number 20090026611
- Publication date Jan 29, 2009
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Su-Tsai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional chip-stack package and active component on a subs...
- Publication number 20090008792
- Publication date Jan 8, 2009
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Cheng-Ta Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Structure With Buffer Layer And Method Of Forming The Same
- Publication number 20080305624
- Publication date Dec 11, 2008
- Su-Tsai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY HAVING A MULTILAYER ADHESIVE STRUCTURE
- Publication number 20080211092
- Publication date Sep 4, 2008
- Industrial Technology Research Institute
- Su-Tsai LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level package structure of optical-electronic device and meth...
- Publication number 20080081395
- Publication date Apr 3, 2008
- Industrial Technology Research Institute
- Yuan-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE BUMP
- Publication number 20070210457
- Publication date Sep 13, 2007
- Ji-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Structure With Buffer Layer And Method Of Forming The Same
- Publication number 20070122635
- Publication date May 31, 2007
- Su-Tsai Lu
- B32 - LAYERED PRODUCTS
Information Patent Application
Method for fabricating conductive bumps with non-conductive juxtapo...
- Publication number 20070111382
- Publication date May 17, 2007
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Yuan-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Structure With Buffer Layer And Method Of Forming The Same
- Publication number 20070056163
- Publication date Mar 15, 2007
- Su-Tsai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE, CHIP PACKAGE STRUCTURE AND BUMPING PROCESS THEREOF
- Publication number 20070052110
- Publication date Mar 8, 2007
- Su-Tsai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding structure of device packaging
- Publication number 20060078715
- Publication date Apr 13, 2006
- Su-Tsai Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Mesh electrode, sensing device, and electrode layer

Conductive line structure and sensing device using the same

Sensing structure

Touch panel and manufacturing method thereof and touch display panel

Gravure printing system and method of using the same

Touch panel structure and fabrication method for the same

Illumination device

Illumination device

Chip stack structure and method for fabricating the same

Touch structure and manufacturing method for the same

Electronic assembly having a multilayer adhesive structure

Electronic device package structure with a hydrophilic protection l...

Semiconductor device and assembling method thereof

Wafer level molding structure

Bump structure, chip package structure including the same and metho...

Sealed joint structure of device and process using the same

Stacked capacitor structure and manufacturing method thereof

Electrode structure of memory capacitor

Bonding structure with buffer layer and method of forming the same

Electronic assembly having a multilayer adhesive structure

Wafer level package structure of optical-electronic device and meth...

Bonding structure with buffer layer and method of forming the same

Bonding structure with buffer layer and method of forming the same

Chip structure and chip package structure

Composite bump

Method for fabricating conductive bumps with non-conductive juxtapo...

Wafer level package structure of optical-electronic device and meth...

Bonding structure of device packaging

Bonding structure with buffer layer and method of forming the same

Conductive bumps with non-conductive juxtaposed sidewalls

Patents Applicationslast 30 patents

CONDUCTIVE LINE STRUCTURE AND SENSING DEVICE USING THE SAME

TOUCH PANEL

MESH ELECTRODE, SENSING DEVICE, AND ELECTRODE LAYER

SENSING STRUCTURE

ILLUMINATION DEVICE

Touch panel structure and fabrication method for the same

ILLUMINATION DEVICE

TOUCH PANEL AND MANUFACTURING METHOD THEREOF AND TOUCH DISPLAY PANEL

TOUCH STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

CHIP STACK STRUCTURE AND METHOD FOR FABRICATING THE SAME

WAFER LEVEL MOLDING STRUCTURE

SEMICONDUCTOR DEVICE AND ASSEMBLING METHOD THEREOF

ELECTRONIC DEVICE PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE...

BUMP STRUCTURE, CHIP PACKAGE STRUCTURE INCLUDING THE SAME AND METHO...

SEALED JOINT STRUCTURE OF DEVICE AND PROCESS USING THE SAME

CHIP PACKAGE STRUCTURE

STACKED CAPACITOR STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRODE STRUCTURE OF MEMORY CAPACITOR AND MANUFACTURING METHOD TH...

MEMORY CAPACITOR AND MANUFACTURING METHOD THEREOF

ELECTRONIC ASSEMBLY HAVING A MULTILAYER ADHESIVE STRUCTURE

Three-dimensional chip-stack package and active component on a subs...

Bonding Structure With Buffer Layer And Method Of Forming The Same

ELECTRONIC ASSEMBLY HAVING A MULTILAYER ADHESIVE STRUCTURE

Wafer level package structure of optical-electronic device and meth...

COMPOSITE BUMP

Bonding Structure With Buffer Layer And Method Of Forming The Same

Method for fabricating conductive bumps with non-conductive juxtapo...

Bonding Structure With Buffer Layer And Method Of Forming The Same

CHIP STRUCTURE, CHIP PACKAGE STRUCTURE AND BUMPING PROCESS THEREOF

Bonding structure of device packaging